JPH01156580U - - Google Patents
Info
- Publication number
- JPH01156580U JPH01156580U JP5425188U JP5425188U JPH01156580U JP H01156580 U JPH01156580 U JP H01156580U JP 5425188 U JP5425188 U JP 5425188U JP 5425188 U JP5425188 U JP 5425188U JP H01156580 U JPH01156580 U JP H01156580U
- Authority
- JP
- Japan
- Prior art keywords
- attachment
- integrated circuit
- components
- attached
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5425188U JPH01156580U (en, 2012) | 1988-04-21 | 1988-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5425188U JPH01156580U (en, 2012) | 1988-04-21 | 1988-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156580U true JPH01156580U (en, 2012) | 1989-10-27 |
Family
ID=31280187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5425188U Pending JPH01156580U (en, 2012) | 1988-04-21 | 1988-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156580U (en, 2012) |
-
1988
- 1988-04-21 JP JP5425188U patent/JPH01156580U/ja active Pending