JPH01155282U - - Google Patents
Info
- Publication number
- JPH01155282U JPH01155282U JP5094988U JP5094988U JPH01155282U JP H01155282 U JPH01155282 U JP H01155282U JP 5094988 U JP5094988 U JP 5094988U JP 5094988 U JP5094988 U JP 5094988U JP H01155282 U JPH01155282 U JP H01155282U
- Authority
- JP
- Japan
- Prior art keywords
- shield braid
- shield
- braid
- conductive tape
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5094988U JPH01155282U (ko) | 1988-04-18 | 1988-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5094988U JPH01155282U (ko) | 1988-04-18 | 1988-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01155282U true JPH01155282U (ko) | 1989-10-25 |
Family
ID=31276977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5094988U Pending JPH01155282U (ko) | 1988-04-18 | 1988-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01155282U (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188040A (ja) * | 1992-12-18 | 1994-07-08 | Yazaki Corp | シールドコネクタ |
| WO2001057965A1 (fr) * | 2000-02-03 | 2001-08-09 | Matsushita Electric Industrial Co., Ltd. | Connecteur de cable |
| WO2015174258A1 (ja) * | 2014-05-13 | 2015-11-19 | 株式会社村田製作所 | 端子接合方法および端子接合構造 |
-
1988
- 1988-04-18 JP JP5094988U patent/JPH01155282U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188040A (ja) * | 1992-12-18 | 1994-07-08 | Yazaki Corp | シールドコネクタ |
| WO2001057965A1 (fr) * | 2000-02-03 | 2001-08-09 | Matsushita Electric Industrial Co., Ltd. | Connecteur de cable |
| WO2015174258A1 (ja) * | 2014-05-13 | 2015-11-19 | 株式会社村田製作所 | 端子接合方法および端子接合構造 |
| JPWO2015174258A1 (ja) * | 2014-05-13 | 2017-04-20 | 株式会社村田製作所 | 端子接合方法および端子接合構造 |