JPH01154652U - - Google Patents

Info

Publication number
JPH01154652U
JPH01154652U JP1988050743U JP5074388U JPH01154652U JP H01154652 U JPH01154652 U JP H01154652U JP 1988050743 U JP1988050743 U JP 1988050743U JP 5074388 U JP5074388 U JP 5074388U JP H01154652 U JPH01154652 U JP H01154652U
Authority
JP
Japan
Prior art keywords
light receiving
receiving element
sealed
utility
device characterized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988050743U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988050743U priority Critical patent/JPH01154652U/ja
Publication of JPH01154652U publication Critical patent/JPH01154652U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1988050743U 1988-04-15 1988-04-15 Pending JPH01154652U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988050743U JPH01154652U (OSRAM) 1988-04-15 1988-04-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988050743U JPH01154652U (OSRAM) 1988-04-15 1988-04-15

Publications (1)

Publication Number Publication Date
JPH01154652U true JPH01154652U (OSRAM) 1989-10-24

Family

ID=31276781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988050743U Pending JPH01154652U (OSRAM) 1988-04-15 1988-04-15

Country Status (1)

Country Link
JP (1) JPH01154652U (OSRAM)

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