JPH01154652U - - Google Patents
Info
- Publication number
- JPH01154652U JPH01154652U JP5074388U JP5074388U JPH01154652U JP H01154652 U JPH01154652 U JP H01154652U JP 5074388 U JP5074388 U JP 5074388U JP 5074388 U JP5074388 U JP 5074388U JP H01154652 U JPH01154652 U JP H01154652U
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving element
- sealed
- utility
- device characterized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Description
第１図は本考案赤外光受光装置の一つの実施例
を示す断面図、第２図及び第３図は赤外受光装置
の各別の従来例を示す断面図である。
符号の説明、１……受光素子、５……可視光カ
ツト染料入り樹脂、６……透明樹脂。
FIG. 1 is a sectional view showing one embodiment of the infrared light receiving device of the present invention, and FIGS. 2 and 3 are sectional views showing different conventional examples of the infrared light receiving device. Explanation of the symbols: 1... Light receiving element, 5... Visible light cut dye-containing resin, 6... Transparent resin.
Claims (1)
れた樹脂でインナーコートし、 上記受光素子を透明樹脂で封止してなる ことを特徴とする赤外光受光装置。[Claims for Utility Model Registration] An infrared light receiving device characterized in that the light receiving surface of the light receiving element is inner coated with a resin mixed with a visible light cutting dye, and the light receiving element is sealed with a transparent resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5074388U JPH01154652U (en) | 1988-04-15 | 1988-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5074388U JPH01154652U (en) | 1988-04-15 | 1988-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154652U true JPH01154652U (en) | 1989-10-24 |
Family
ID=31276781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5074388U Pending JPH01154652U (en) | 1988-04-15 | 1988-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154652U (en) |
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1988
- 1988-04-15 JP JP5074388U patent/JPH01154652U/ja active Pending