JPH01154637U - - Google Patents

Info

Publication number
JPH01154637U
JPH01154637U JP5206188U JP5206188U JPH01154637U JP H01154637 U JPH01154637 U JP H01154637U JP 5206188 U JP5206188 U JP 5206188U JP 5206188 U JP5206188 U JP 5206188U JP H01154637 U JPH01154637 U JP H01154637U
Authority
JP
Japan
Prior art keywords
dimension
die collet
tapered surface
tolerance
ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5206188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5206188U priority Critical patent/JPH01154637U/ja
Publication of JPH01154637U publication Critical patent/JPH01154637U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP5206188U 1988-04-18 1988-04-18 Pending JPH01154637U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5206188U JPH01154637U (enrdf_load_stackoverflow) 1988-04-18 1988-04-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5206188U JPH01154637U (enrdf_load_stackoverflow) 1988-04-18 1988-04-18

Publications (1)

Publication Number Publication Date
JPH01154637U true JPH01154637U (enrdf_load_stackoverflow) 1989-10-24

Family

ID=31278071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5206188U Pending JPH01154637U (enrdf_load_stackoverflow) 1988-04-18 1988-04-18

Country Status (1)

Country Link
JP (1) JPH01154637U (enrdf_load_stackoverflow)

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