JPH01154637U - - Google Patents
Info
- Publication number
- JPH01154637U JPH01154637U JP5206188U JP5206188U JPH01154637U JP H01154637 U JPH01154637 U JP H01154637U JP 5206188 U JP5206188 U JP 5206188U JP 5206188 U JP5206188 U JP 5206188U JP H01154637 U JPH01154637 U JP H01154637U
- Authority
- JP
- Japan
- Prior art keywords
- dimension
- die collet
- tapered surface
- tolerance
- ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003247 decreasing effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は本考案のダイコレツトの寸法比を示す
ための第３図の―線に沿う横断面図、第２図
は本考案が適用されるダイコレツトを上下を逆に
示した斜視図、第３図は部品吸着状態の縦断面図
、第４図は従来のダイコレツトの第３図の―
線に沿う縦断面図、第５図は部品のＸ，Ｙ寸法を
示す平面図である。
１……ダイコレツト、２……中空軸、３，４…
…テーパ面、５……部品、Ａ……部品のＸ方向設
計寸法、Ｂ……部品のＹ方向設計寸法、Ａ′……
ダイコレツトのＸ方向の寸法、Ｂ′……ダイコレ
ツトのＹ方向の寸法、Ｃ……部品のＸ方向実際寸
法、Ｄ……部品のＹ方向実際寸法、α……部品の
Ｘ方向の寸法公差、β……部品のＹ方向の寸法公
差。
Fig. 1 is a cross-sectional view taken along line - in Fig. 3 to show the dimensional ratio of the die collet of the present invention, Fig. 2 is a perspective view of the die collet to which the present invention is applied, shown upside down, and Fig. 3 The figure is a vertical cross-sectional view of the component suction state, and Figure 4 is the conventional die collet shown in Figure 3.
FIG. 5 is a plan view showing the X and Y dimensions of the part. 1...Die collet, 2...Hollow shaft, 3, 4...
...Tapered surface, 5... Part, A... Part's X-direction design dimension, B... Part's Y-direction design dimension, A'...
Dimension in the X direction of the die collet, B'... Dimension in the Y direction of the die collet, C... Actual dimension in the X direction of the part, D... Actual dimension in the Y direction of the part, α... Dimensional tolerance of the part in the X direction, β ...Dimensional tolerance of the part in the Y direction.
Claims (1)
面においてＸ方向、Ｙ方向に接触して部品を吸着
するダイコレツトにおいて、その接触部における
Ｘ方向又はＹ方向の寸法の一方は部品の公差寸法
分を増し、他方は部品の公差寸法分を減じた寸法
比に設定したことを特徴とするダイコレツト。 In a die collet that has a pyramid-shaped tapered surface formed inside and attracts components by contacting the tapered surface in the X direction and Y direction, one of the dimensions in the X direction or Y direction at the contact portion is the tolerance dimension of the component. A die collet characterized in that the dimension ratio is set such that the dimension ratio is increased and the other dimension is decreased by the tolerance dimension of the part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5206188U JPH01154637U (en) | 1988-04-18 | 1988-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5206188U JPH01154637U (en) | 1988-04-18 | 1988-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154637U true JPH01154637U (en) | 1989-10-24 |
Family
ID=31278071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5206188U Pending JPH01154637U (en) | 1988-04-18 | 1988-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154637U (en) |
-
1988
- 1988-04-18 JP JP5206188U patent/JPH01154637U/ja active Pending