JPH01153697U - - Google Patents
Info
- Publication number
- JPH01153697U JPH01153697U JP4523888U JP4523888U JPH01153697U JP H01153697 U JPH01153697 U JP H01153697U JP 4523888 U JP4523888 U JP 4523888U JP 4523888 U JP4523888 U JP 4523888U JP H01153697 U JPH01153697 U JP H01153697U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- screw
- heat dissipation
- dissipation structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4523888U JPH01153697U (xx) | 1988-04-05 | 1988-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4523888U JPH01153697U (xx) | 1988-04-05 | 1988-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01153697U true JPH01153697U (xx) | 1989-10-23 |
Family
ID=31271553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4523888U Pending JPH01153697U (xx) | 1988-04-05 | 1988-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01153697U (xx) |
-
1988
- 1988-04-05 JP JP4523888U patent/JPH01153697U/ja active Pending