JPH01153647U - - Google Patents
Info
- Publication number
- JPH01153647U JPH01153647U JP4637088U JP4637088U JPH01153647U JP H01153647 U JPH01153647 U JP H01153647U JP 4637088 U JP4637088 U JP 4637088U JP 4637088 U JP4637088 U JP 4637088U JP H01153647 U JPH01153647 U JP H01153647U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- resin
- coated
- base portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Thermistors And Varistors (AREA)
- Details Of Resistors (AREA)
Description
第１図は第１実施例を示す分解斜視図、第２図
は第１図のものを組み立てた状態の一部を切り欠
いた正面図、第３図は第２実施例を示す一部を切
り欠いた正面図である。 １……ダイオード本体、２……リード線、２ａ
，２ａ……根元部分、３，５……熱収縮性樹脂カ
バー、４……モールド樹脂。
は第１図のものを組み立てた状態の一部を切り欠
いた正面図、第３図は第２実施例を示す一部を切
り欠いた正面図である。 １……ダイオード本体、２……リード線、２ａ
，２ａ……根元部分、３，５……熱収縮性樹脂カ
バー、４……モールド樹脂。
Claims (1)
- 【実用新案登録請求の範囲】 電子部品本体からリード線を外方に延在し、該
電子部品本体をリード線の根元部分を含めて樹脂
で被覆した電子部品において、 前記リード線の根元部分に曲げ加工を施すと共
に、少なくとも電子部品本体を樹脂カバーで被覆
したことを特徴とする電子部品。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4637088U JPH01153647U (ja) | 1988-04-05 | 1988-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4637088U JPH01153647U (ja) | 1988-04-05 | 1988-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01153647U true JPH01153647U (ja) | 1989-10-23 |
Family
ID=31272641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4637088U Pending JPH01153647U (ja) | 1988-04-05 | 1988-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01153647U (ja) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4985961A (ja) * | 1972-12-22 | 1974-08-17 | ||
| JPS5124864B1 (ja) * | 1970-06-29 | 1976-07-27 | ||
| JPS576251B2 (ja) * | 1977-01-26 | 1982-02-04 | ||
| JPS62104058A (ja) * | 1985-06-04 | 1987-05-14 | Mitsubishi Electric Corp | 半導体装置 |
| JPS6228445B2 (ja) * | 1983-03-26 | 1987-06-20 | Tatsuo Shinagawa |
-
1988
- 1988-04-05 JP JP4637088U patent/JPH01153647U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124864B1 (ja) * | 1970-06-29 | 1976-07-27 | ||
| JPS4985961A (ja) * | 1972-12-22 | 1974-08-17 | ||
| JPS576251B2 (ja) * | 1977-01-26 | 1982-02-04 | ||
| JPS6228445B2 (ja) * | 1983-03-26 | 1987-06-20 | Tatsuo Shinagawa | |
| JPS62104058A (ja) * | 1985-06-04 | 1987-05-14 | Mitsubishi Electric Corp | 半導体装置 |