JPH01152464U - - Google Patents
Info
- Publication number
- JPH01152464U JPH01152464U JP5007288U JP5007288U JPH01152464U JP H01152464 U JPH01152464 U JP H01152464U JP 5007288 U JP5007288 U JP 5007288U JP 5007288 U JP5007288 U JP 5007288U JP H01152464 U JPH01152464 U JP H01152464U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- external lead
- film substrate
- soldered
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5007288U JPH01152464U (en, 2012) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5007288U JPH01152464U (en, 2012) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01152464U true JPH01152464U (en, 2012) | 1989-10-20 |
Family
ID=31276149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5007288U Pending JPH01152464U (en, 2012) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01152464U (en, 2012) |
-
1988
- 1988-04-13 JP JP5007288U patent/JPH01152464U/ja active Pending