JPH01152292A - Production of electrodeposited sheet - Google Patents
Production of electrodeposited sheetInfo
- Publication number
- JPH01152292A JPH01152292A JP31100687A JP31100687A JPH01152292A JP H01152292 A JPH01152292 A JP H01152292A JP 31100687 A JP31100687 A JP 31100687A JP 31100687 A JP31100687 A JP 31100687A JP H01152292 A JPH01152292 A JP H01152292A
- Authority
- JP
- Japan
- Prior art keywords
- electrodeposited
- sheets
- plate
- electrodeposited sheets
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 5
- 238000011109 contamination Methods 0.000 abstract description 3
- 238000004299 exfoliation Methods 0.000 abstract 3
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000009432 framing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の技術分野）
本発明は１陰極母板面から多数枚の電着板の製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a method for manufacturing a large number of electrodeposited plates from one cathode mother plate surface.
（発明の従来技術）
金、銀、銅、鉄、ニッケル、コバルト等水溶液から電着
させ得る。(Prior Art to the Invention) Gold, silver, copper, iron, nickel, cobalt, etc. can be electrodeposited from an aqueous solution.
金属の電着板のほとんどは溶解成形後ないしは小分割品
として市販さ九でいる。これらの流れは通常品質もので
あれば問題とならないが高純度品の場合、溶解成形もさ
ることながら小分割工程での汚染が大きな問題となる。Most electrodeposited metal plates are commercially available after melt molding or as small pieces. These flows are not a problem if the product is of normal quality, but in the case of high-purity products, contamination during the subdivision process as well as melt molding becomes a major problem.
以下高純度銅の例について詳述する。Examples of high-purity copper will be described in detail below.
９９．９９９９％（６Ｎ）ｕｐの高純度銅は硝酸銅沿で
の隔膜電解で、陰極母板に電着させ剥取る方法で製造さ
れている。この方法で得られる定着網の大きさは、陰極
母板の大きさによってきまる。一方、高純度銅は例外な
く溶解して使用される。この溶解は炉の種類や大きさに
合った電着板を必要とする。すなわち、用途別に陰極母
板を準備するか大きな電着板を切断するかのどちらかで
対応せざるを得ない。これらの対策については、本発明
者等が特願昭６２−２１１２８９号で、すでに提案して
いる。しかしこの提案では、１枚の陰極母板面から細「
］１で縦に長いものの製造は容易であるが、横に長いも
のや、縦横ともに細巾の製品を得る場合、陰極母板に、
自然剥離時の落下を防止するための貫通孔を多数つくる
必要がある。High-purity copper of 99.9999% (6N) up is produced by electrodepositing it on a cathode mother plate and peeling it off using diaphragm electrolysis along copper nitrate. The size of the fixing net obtained by this method is determined by the size of the cathode mother plate. On the other hand, high-purity copper is used after being melted without exception. This melting requires electrodeposited plates that match the type and size of the furnace. In other words, it is necessary to either prepare a cathode mother plate for each use or cut a large electrodeposited plate. These countermeasures have already been proposed by the present inventors in Japanese Patent Application No. 62-211289. However, in this proposal, a thin “
] 1 makes it easy to manufacture vertically long items, but when producing horizontally long items or products that are narrow both vertically and horizontally, on the cathode mother plate,
It is necessary to create a large number of through holes to prevent falling during natural peeling.
これは電着銅板の用途別に専用母板を持つことにほかな
らず、問題は解決されていない。This is nothing more than having a dedicated motherboard for each use of the electrodeposited copper plate, and the problem remains unsolved.
また、高純度の電着金属を得るため、溶解時に小片とす
る必要がある場合、切ＩＦｒ器具からの不純物（例えば
鉄）が混入し、６Ｎあるいは７Ｎ以上の高純度の金属を
結果的に得られない問題がある。Additionally, when it is necessary to make small pieces during melting to obtain high purity electrodeposited metal, impurities (e.g. iron) from the cutting IFr equipment may be mixed in, resulting in a high purity metal of 6N or 7N or higher. There is a problem that cannot be resolved.
か＼る現状にかんがみ本発明者等は鋭意検討した結果、
以下の発明をなした。In view of the current situation, the inventors of the present invention have conducted extensive studies, and have found that
He made the following inventions.
（発明の構成）
すなわち、本発明は、１陰極母板面から小分割された多
数枚の電着板を得る方法において、上部と下部に分割さ
れる電着板の上部電着板は母板の貫通孔の電着板によっ
て支持され、下部電着板は上部電着板の１部に連結され
支持されるよう絶林部を設けた陰極母板を使用する電着
板の製造方法に関する。(Structure of the Invention) That is, the present invention provides a method for obtaining a large number of electrodeposited plates subdivided from the surface of one cathode mother plate, in which the upper electrodeposited plate of the electrodeposited plate divided into upper and lower portions is separated from the mother plate. The present invention relates to a method for manufacturing an electrodeposited plate using a cathode mother plate provided with a dead end portion so that the lower electrodeposited plate is connected to and supported by a portion of the upper electrodeposited plate.
（発明の詳細な説明）
本発明で対象となる金属は、金、銀、銅、３イ）、亜鉛
、ニッケル、コバルト、鉄、クロム、ビスマス等水溶液
から電着できる金属である。(Detailed Description of the Invention) The metals targeted by the present invention are metals that can be electrodeposited from an aqueous solution, such as gold, silver, copper, 3), zinc, nickel, cobalt, iron, chromium, and bismuth.
特に、本発明においては、１陰極母板面から縦横とも小
分割された多数枚の電着板を得るものであり、陰極母板
面は例えば、スコッチテープ（３Ｍ社ｍ）等で所定サイ
ズに枠取りされる。この枠取りにおいて、縦横ともに小
分割された陰極母板面は必ず、上部の面と１部で連結し
ていることが必要である。この連結部の電着板によって
、下部の電着板は支持されるので、電槽中ないし運搬過
程での自然剥離による落下は皆無となる。In particular, in the present invention, a large number of electrodeposited plates are obtained by dividing the surface of one cathode mother plate into small pieces vertically and horizontally. Framed. In this framing, it is necessary that the surface of the cathode mother plate, which is divided into small parts both vertically and horizontally, is connected to the upper surface at a portion. Since the electrodeposited plate at the bottom is supported by the electrodeposited plate at this connection part, there is no chance of it falling due to natural peeling in the container or during the transportation process.
一方、陰極母板の貫通口、及び連結部の電着板は１人力
で容易に破断てき、かつ自然剥離時に落下を防止できる
範囲の電着板となる強度である必要がある。これにより
、切断器具による汚染もなく、高純度金属を得ることが
できるからである。On the other hand, the electrodeposited plates at the through holes and connecting portions of the cathode mother plate need to have a strength that allows them to be easily broken by one person and prevent them from falling during natural peeling. This is because high purity metal can be obtained without contamination due to cutting tools.
各分割の枠取りにおける絶縁境界の巾、貫通孔径及び連
結部の１ｆ１は、目標とする小分割電着板の厚さ、形状
、重量等に関するので一義的に表現することはできない
。電着厚さは、３部ｗｎないし５１■が好ましい。これ
により、人力でも切断可能だからである。絶縁境界中は
１．５ｍｍないし３薗が目安である。隣の板との結合を
防止しかつより多く電着させるためである。また、電着
板の重量が１−ないし２ｋｇの長方形の場合の好ましい
貫通口径は１．５〜２．０＋ｍである。連結部の巾は２
ｍｍないし ５ｍである。The width of the insulating boundary, the diameter of the through hole, and 1f1 of the connecting portion in the framing of each division cannot be uniquely expressed because they relate to the target thickness, shape, weight, etc. of the subdivided electrodeposited plate. The electrodeposition thickness is preferably 3 parts wn to 51 parts. This is because it can be cut manually. The standard distance between insulation boundaries is 1.5 mm to 3 mm. This is to prevent bonding with adjacent plates and to allow more electrodeposition. Further, when the electrodeposited plate is rectangular and weighs 1-2 kg, the preferred through-hole diameter is 1.5-2.0+ m. The width of the connecting part is 2
It is from mm to 5m.
実施例
厚さ３ ｍ ／ ｍ、巾約３９０ｍ／ｍ、長さ約５２０
ｍ ／ ｍのチタン板を陰極母板とし、第１図のよう
に１型から１′型にスコッチテープで面の枠取りを行っ
た。■及び１′型は６０ ｏｎ Ｘ ２４０ｍａ＋（９
面）、２型は６０ｍｍＸ１２０ｍａ＋（３面）、３型は
６０ｍｍＸ６０ｍｍ（２面）、４及び４′型は１２０購
Ｘ２８購（４面）とした。また、１型は貫通口Ａを含む
電着板支持原点面Ｂとつらなっており、その他の面は各
連結部りで上部面とつらなる構造とした６貫通ロＡは２
ｍｍ、連結部の巾りはすべて３部ｗｍ、絶縁境界Ｃの巾
はすべて３ｎｎとした。Example thickness: 3 m/m, width: approximately 390 m/m, length: approximately 520 mm
A m/m titanium plate was used as the cathode mother plate, and the surface was framed with Scotch tape from type 1 to type 1' as shown in FIG. ■ and 1' type are 60 on x 240ma + (9
Type 2 was 60 mm x 120 ma + (3 sides), Type 3 was 60 mm x 60 mm (2 sides), and Types 4 and 4' were 120 mm x 28 mm (4 sides). In addition, type 1 is connected to electrodeposited plate support origin surface B including through hole A, and 6 through hole A has a structure in which the other surfaces are connected to the upper surface at each connecting part.
mm, the width of all connecting parts was 3 parts wm, and the width of all insulation boundaries C was 3 nn.
電解液は硝酸銅であり、ｐＨ＝１．５゜Ｃｕ ＝ ５０
ｇ ／ Ｑ、とし陰極母板を隔膜室に配置し、陽極は
電気銅（９９，９９％Ｃｕ ）として再電解を行った。The electrolyte is copper nitrate, pH = 1.5゜Cu = 50
g/Q, the cathode mother plate was placed in the diaphragm chamber, and electrolytic copper (99.99% Cu) was used as the anode for re-electrolysis.
電流密度は１ 、 ＯＡ ／ ｄ ｍとし、１０日サイ
クルで電着板からの剥離を行って、１０サイクル実施し
た。The current density was 1 OA/dm, and the electrodeposited plate was peeled off in 10-day cycles for 10 cycles.
これにより、厚さ３．０〜３．５ｍｍの１型ないし１′
型板９０枚、２型板３枚、３型板２０枚、４型ないし４
′型板４０枚を得た。これらの電着銅板はすべて高純度
（９９，９９９９％Ｃｕ；Ａｇ；０．２ｐｐｍＳ ；０
．Ｏ５ｐｐｍ以下）であった。This allows for type 1 to 1' with a thickness of 3.0 to 3.5 mm.
90 templates, 3 templates 2, 20 templates 3, 4 or 4
'Forty templates were obtained. All of these electrodeposited copper plates have high purity (99,9999%Cu;Ag;0.2ppmS;0
．． (05 ppm or less).
各電着銅板の大きさは各型面に対し縦、横とも１．０〜
１．５ｍ大きくなっていた。なお、１０サイクル実施の
過程でいずれの型面においても電着板の落下はなかった
。The size of each electrodeposited copper plate is 1.0~
It was 1.5m larger. It should be noted that during the course of 10 cycles, the electrodeposited plate did not fall on any of the mold surfaces.
（発明の効果） 本発明の実施により以下の効果を有する。(Effect of the invention) Implementation of the present invention has the following effects.
（１）目的形状の電着板が容易に２枚以上できる。(1) Two or more electrodeposited plates with the desired shape can be easily produced.
（２）陰極母板は絶縁枠取りを変更するのみでいかなる
形状の電着板の製造用に供し得る。(2) The cathode mother plate can be used to manufacture electrodeposited plates of any shape by simply changing the insulation frame.
（３）自然剥離により落下が全たくない。(3) No falling due to natural peeling.
第１図は、１陰極母板面から小区分された電着物を多数
枚得る目的で絶縁テープで枠取した陰極母板面である。
Ａ 電着過程で支持原点の根となる電着物を形成する貫
通孔
Ｂ 電着過程で支持原点面を形成する面Ｃ電着板を小区
分するための絶縁境界FIG. 1 shows the surface of a cathode mother plate framed with insulating tape in order to obtain a large number of subdivided electrodeposits from one cathode mother plate surface. A Through hole that forms the electrodeposited material that becomes the root of the support origin in the electrodeposition process B Surface that forms the support origin surface in the electrodeposition process C Insulation boundary for subdividing the electrodeposited plate
Claims (1)
得る方法において、上部と下部に分割される電着板の上
部電着板は、母板の貫通孔部の電着板によって支持され
、下部電着板は上部電着板の１部に連結され支持される
よう絶縁部を設けた陰極母板を用いることを特徴とする
電着板の製造方法。(1) In the method of obtaining a large number of electrodeposited plates that are subdivided from one cathode mother plate surface, the upper electrodeposited plate of the electrodeposited plate that is divided into upper and lower parts is electrodeposited at the through-hole portion of the mother plate. A method for manufacturing an electrodeposited plate, characterized in that a cathode mother plate is supported by a plate and has an insulating part so that the lower electrodeposited plate is connected to and supported by a part of the upper electrodeposited plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62311006A JP2622560B2 (en) | 1987-12-10 | 1987-12-10 | Manufacturing method of electrodeposited plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62311006A JP2622560B2 (en) | 1987-12-10 | 1987-12-10 | Manufacturing method of electrodeposited plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01152292A true JPH01152292A (en) | 1989-06-14 |
| JP2622560B2 JP2622560B2 (en) | 1997-06-18 |
Family
ID=18011990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62311006A Expired - Fee Related JP2622560B2 (en) | 1987-12-10 | 1987-12-10 | Manufacturing method of electrodeposited plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2622560B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006322920A (en) * | 2005-03-07 | 2006-11-30 | Aurema Sa | Wrist watch |
| JP2016222972A (en) * | 2015-05-29 | 2016-12-28 | Ｊｘ金属株式会社 | Manufacturing method of subdivided electrolytic copper, negative electrode and electrocoating guide using the method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52152832A (en) * | 1976-06-15 | 1977-12-19 | Int Nickel Co | Method of producing ordinary electrolytic nickel or annular nickel product from electroplating bath providing precipitates of large stress |
| JPS53149120A (en) * | 1977-06-01 | 1978-12-26 | British Insulated Callenders | Method of producing copper |
-
1987
- 1987-12-10 JP JP62311006A patent/JP2622560B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52152832A (en) * | 1976-06-15 | 1977-12-19 | Int Nickel Co | Method of producing ordinary electrolytic nickel or annular nickel product from electroplating bath providing precipitates of large stress |
| JPS53149120A (en) * | 1977-06-01 | 1978-12-26 | British Insulated Callenders | Method of producing copper |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006322920A (en) * | 2005-03-07 | 2006-11-30 | Aurema Sa | Wrist watch |
| JP2016222972A (en) * | 2015-05-29 | 2016-12-28 | Ｊｘ金属株式会社 | Manufacturing method of subdivided electrolytic copper, negative electrode and electrocoating guide using the method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2622560B2 (en) | 1997-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0110463B1 (en) | A process of electroforming a metal product and electroformed metal product | |
| EP1182278A3 (en) | Manufacturing method of electrodeposited copper foil and electrodeposited copper foil | |
| TR200201173T2 (en) | High purity aluminum production by electrolysis using inert anodes | |
| EP1065298A3 (en) | Method of manfacturing electrodeposited copper foil and electrodeposited copper foil | |
| JPH01152292A (en) | Production of electrodeposited sheet | |
| CN110699713A (en) | Cyanide-free gold alloy electroforming solution and using method thereof | |
| CN111945191A (en) | Additive for sulfur-containing nickel button and preparation and application thereof | |
| JPS6184389A (en) | Manufacture of high purity electrolytic copper | |
| EP0155955B1 (en) | Electrode for electrometallurgical processes | |
| JPS63307291A (en) | Manufacture of high-purity copper | |
| CN102554186A (en) | Method for preparing copper electrolysis anode plate | |
| EP0094308A3 (en) | Process and apparatus for the electrolytic preparation of metal, especially lead, and semi-product obtained by their use | |
| JPS6038678Y2 (en) | Mother plate for metal electrodeposition | |
| JP2005163096A5 (en) | ||
| ES2006482A6 (en) | Process and apparatus for the electro-deposition of copper or other metals on bipolar electrodes made of lead. | |
| RU2005130634A (en) | METHOD FOR ELECTROCHEMICAL DISTRIBUTION OF COPPER IN A CHLORIDE SOLUTION | |
| JPS6043497A (en) | Electrolytic refining method of copper | |
| CN107119312B (en) | A kind of hardware plate derusting device | |
| GB1108868A (en) | Process for the electrolytic production of manganese dioxide | |
| JPH0154440B2 (en) | ||
| JP2002302787A (en) | Method of producing special-shaped electric nickel for plating | |
| JPS55148786A (en) | Manufacture of cathode for water electrolysis | |
| Nerubashchenko et al. | Production of Titanium Powders by Electrolysis of Chloride--Fluoride Melts with Soluble Anodes | |
| JPH0653949B2 (en) | Copper electrolytic refining method | |
| CN204138792U (en) | A kind of negative plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |