JPH0114680Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a plating device used for locally plating electrical components such as lead frames for ICs.

[Conventional technology]

Conventionally, in this type of plating device,
A device having the configuration disclosed in Japanese Patent No. 49-24775 is well known.

Such a plating device is capable of plating only the necessary portions of a material to be plated, such as an IC lead frame, but it is capable of plating a single item and is inferior in mass productivity.

Therefore, in view of the above-mentioned drawbacks of the conventional device, the second
2. Description of the Related Art An apparatus has been developed for plating a plurality of long plate-shaped materials A to be plated at once as shown in FIGS. This type of plating device has plating tank 1.
The plating liquid M inside is injected from below through a pump 2 from a large number of nozzles 3 toward a large number of mold holes 5 of a rubber mask 4 and circulated.
The portions of the materials to be plated A, which are placed in parallel and pressed by a plurality of strips of holding members 6 made of an elastic material such as silicone rubber, are locally placed in positions corresponding to the respective mold holes 5. It has a structure in which it is plated.

[Problem that the invention attempts to solve]

However, in the above-mentioned plating device, each presser member 6 attached to the lower surface of the press board 8 via the acrylic resin plate 7, for example...
As shown in the figure, the materials to be plated A are placed in parallel on the rubber mask 4... are arranged in a direction perpendicular to the longitudinal direction or in a parallel direction, and their pressing surfaces P-P As shown by the dotted line, they are flush on the same plane, so when pressurizing by one air cylinder 9 in the center via the press board 8, the area of the press part is large, so the central part and There was a problem in that a pressure difference occurred between both ends, and the plating liquid M leaked around the plating surface of the material A to be plated placed on both ends of the rubber mask 4.

The present invention was developed under the above circumstances, and its purpose is to provide a plating device that can uniformly apply pressure to multiple materials to be plated that are placed in parallel on a rubber mask. Our goal is to provide the following.

[Means for solving problems]

In order to solve the above problems, this invention
A plurality of elongated plate-shaped materials to be plated are placed in parallel on a rubber mask having a large number of mold holes in positions corresponding to the respective mold holes, and each of these materials to be plated is made from a plurality of elastic bodies. A plating device which performs local plating processing on each of the materials to be plated at once by pressing and holding the materials from above with a presser member, and spraying plating liquid from the underside of the rubber mask toward each mold hole. In this method, the pressing surface made of the plurality of holding members has a central portion recessed in a stepped manner at least in the longitudinal direction of each material to be plated.

[Effect]

The present invention has the above-mentioned configuration, so that when the pressing surface of each pressing member attached to the press board presses the material to be plated on the rubber mask by the downward movement of one central air cylinder, , the pressurizing force at both ends is greater than the pressurizing force at the center, and therefore the pressure difference between the center and both ends can be reduced, making it possible to pressurize the entire area uniformly, and applying pressure to both ends on the rubber mask. It becomes possible to reliably prevent the plating liquid from leaking to the mounted material to be plated.

〔Example〕

The present invention will be explained below with reference to an embodiment shown in FIG. In the illustrated embodiment of the present invention, the same reference numerals are used for parts that have the same configuration as those of the conventional plating device shown in FIGS. 2 and 3.
The explanation will be omitted.

That is, as shown in FIG. It has a structure in which the center part is symmetrically recessed with a step,
As a means for providing such a step on the pressing surface P-P, for example, by adjusting the thickness of the support plate 7 made of acrylic resin, etc., interposed between each presser member 6... It is carried out with

In addition, in the above embodiment, the pressing surface P-P was recessed stepwise in the longitudinal direction of the material to be plated.
It is also possible to have a similar configuration in the parallel direction of the materials to be plated.

[Effect of idea]

As is clear from the above description, according to the present invention, the pressing surface of the pressing member that presses the plurality of materials to be plated placed on the rubber mask is formed in a stepped manner so that the central portion is concave. Since the pressure difference between the center and both ends is reduced and the entire area can be pressurized uniformly, this has the excellent effect of reliably preventing the plating liquid from leaking as in the conventional case.

[Brief explanation of the drawing]

Fig. 1 is a schematic sectional view showing an embodiment of a plating device according to the present invention, Fig. 2 is a schematic sectional view of a conventional plating device, and Fig. 3 is a schematic sectional view showing a state in which the material to be plated is held under pressure. FIG. 1... Plating tank, 3... Nozzle, 4... Rubber mask, 5... Mold hole, 6... Holding member, 8... Press board, A... Material to be plated, M... Plating liquid, P
-P... Presser surface.

Claims (1)

[Scope of utility model registration request] A plurality of elongated plate-shaped materials to be plated are placed in parallel on a rubber mask having a large number of mold holes in positions corresponding to the respective mold holes, and each of these materials to be plated is made from a plurality of elastic bodies. A plating device that performs local plating processing on each of the materials to be plated at once by pressing and holding the materials from above with a presser member made of the same material, and spraying plating liquid toward each mold hole from the underside of the rubber mask. A plating device according to the present invention, wherein the pressing surface made of the plurality of holding members is recessed in a step-like manner at a central portion with respect to at least the longitudinal direction of each material to be plated.