JPH01146789A - Heating body - Google Patents

Abstract

PURPOSE:To obtain a heating body sliding a recording material stably for a long time, by a method wherein, a lubricating heat-resistant layer is provided on a heating resistant layer, and the lubricating heat-resistant layer contains at least one additive of fluorine, silicone, or acid amide releasants or surfactants and a thermosetting resin. CONSTITUTION:A recording signal is issued from a power source 9 to a separation electrode 1 and returns to a return electrode 2 through a heating resistant layer 4. The recording signal current passing through the heating resistant layer 4 heats the heating resistant layer 4, and a recording on a thermal recording material 7 is carried out by this heat. A heating body has a lubricating heat-resistant layer 5 contains an additive and a thermosetting resin on the heating resistant layer 4. As the thermosetting resin, a resin setting by a radical polymerization or ion polymerization or a resin setting by a condensation polymerization is generally used. The additive is incorporated in the thermosetting resin, thereby reducing a frictional properties between the lubricating heat- resistant layer 5 and the thermal recording material 7 to make the thermal recording material easily slidable. As the additive, at least one of fluorine, silicone, or acid amide releasants or surfactants is used.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to heating elements used, for example, in electrical thermal transfer recording for recording images or characters at high speed and low power, and in particular for recording stable, high-quality images or characters at low power consumption. This invention relates to a heating element suitable for electric thermal transfer recording that is available at a reasonable price. - Conventional technology Thermal transfer recording method uses a thermal head to perform recording, but there is a problem in that it is difficult to perform high-speed recording because the thermal head accumulates a large amount of heat. During this period, for example, US Pat. As described in the specification of No. 744゜611, recording is performed using a current-carrying head having a separation electrode and a return electrode, a current-carrying transfer ribbon in which a heat-generating resistive layer and a heat-melting ink cartridge are integrated, and a recording paper. Electrical thermal recording technology was proposed. However, this proposal has the drawback of high running costs because the electrically conductive transfer ribbon is expensive. For this drawback, for example, Japanese Patent Laid-Open No. 61-17
As described in Japanese Patent Laid-open No. 9764 and Japanese Patent Application Laid-open No. 199996/1989, running is performed by using a current-carrying head, a heat-generating sheet, a heat-melting transfer sheet, and a recording paper, and using the heat-generating sheet multiple times. Proposals have been made to reduce costs.

Problems to be Solved by the Invention In all of the above proposals, since the current-carrying head slides on a heat-generating sheet while supplying a recording signal current to the current-carrying head, the electrode part of the current-carrying head (separated electrode and feedback type g) is There was a drawback that it was difficult to permanently maintain electrical contact with the heat generating sheet.

Therefore, it consists of a current-carrying head, a heat-generating member having a slippery heat-resistant layer on a heat-generating resistive layer, and a recording material. A recording method in which recording is performed by sliding between materials is a recording method that can overcome the above-mentioned drawbacks.

An object of the present invention is to provide a heating element that allows a recording material to slide stably and for a long time.

Means for Solving the Problems A slippery heat-resistant layer is provided on the heat-generating resistive layer, and the slippery heat-resistant layer is made of at least one type of fluorine-based, silicone-based, or acid amide-based mold release agent or surfactant. additives and a thermosetting resin.

The thermosetting resin of the slippery heat-resistant layer exhibits heat resistance against the heat generated by the heating resistor. At least one type of additive among fluorine-based, silicone-based, or acid amide-based female agents or surfactants in the slippery heat-resistant layer lowers the coefficient of friction between the recording material and the heating element. Due to the above two points, it is possible to provide a heating element that can stably slide a recording material over a long period of time.

Embodiment FIG. 4 is a conceptual cross-sectional view of an embodiment of a recording method using a heating element of the present invention.

It is composed of a current-carrying head 3 having a separation electrode 1 and a return electrode 2, a heating element 6 having a slippery heat-resistant layer 5 on a heating resistance layer 4, a heat-sensitive recording material 7, and a platen 8. First, a recording signal from the power source 9 passes through the minute electrode 1, passes through the heating resistor layer 4, and returns to the return electrode 2. When a recording signal current flows through the heat generating resistor M4, the heat generating resistor N4 generates heat, and this heat is used to record on the thermosensitive recording material 7. The heat-sensitive recording material 7 is
It may be thermal paper that develops color by direct heat, or a thermal transfer sheet and recording paper. When using a thermal transfer sheet, it goes without saying that the surface of the transfer sheet that is different from the ink surface should face the slippery heat-resistant layer 5 side.

The heat generating resistance layer 4 of the present invention is made of polyimide, for example.

Products whose resistance value is controlled by mixing heat-resistant resin such as polyamide with conductive particles such as carbon, etc.
N, TiC-5i02. Cr-3iO2, T1C-S
Examples include those in which iC, Ti, -AI-N, etc. are controlled in film thickness by sputtering or vacuum evaporation.

The lubricious heat-resistant layer 5 has lubricity that allows the heat-sensitive recording material 7 to slide;
It is necessary to have heat resistance to the heat generated by the heat generating resistor layer 4 and thermal conductivity to transfer the heat generated by the heat generating resistor layer 4 to the thermosensitive recording material 7.

When the heating element of the present invention is used, while a recording signal is being applied to the energizing head 3, at least the energizing head 3 and the heating element 6
When the recording signal is not applied to the current-carrying head 3, the current-carrying head 3 and the heating element 6 can record without changing their relative position.
You can change the relative position with. Therefore, it is possible to carry out current-conducting heat-sensitive recording without causing electrical contact failure, which is a drawback of the conventional method. It also has good thermal efficiency and can record at least five times faster with about half the recording energy of a thermal head. Furthermore, the energizing head 3 and heating element 6 are cheaper than conventional thermal heads.

FIG. 1 shows a conceptual cross-sectional view of one embodiment of the heating element of the present invention. A slippery heat-resistant layer N5 containing an additive and a thermosetting resin is formed on the heat-generating resistor N4.

Thermosetting resins are generally resins that are cured by radical polymerization or ionic polymerization, or resins that are cured by condensation polymerization, such as acrylates such as epoxy acrylates, urethane acrylates, and polyester acrylates, phenolic resins, urea resins, and melamine. resin,
Examples include unsaturated polyester resins and epoxy resins. These resins may be mixed with sensitizers, curing accelerators, 9 reactive diluents, etc. depending on the reaction form.Additives include:
By including it in the thermosetting resin, the coefficient of friction between the slippery heat-resistant N5 and the heat-sensitive recording material 7 is reduced, making it easier for the heat-sensitive recording material to slide. Muramura's additives include silicone oils such as dimethylpolysiloxane and alkylaryl-modified silicone oils, silicone surfactants such as polyether-modified dimethyl silicone, carboxy-modified dimethyl silicone, and amide-modified dimethyl silicone, and perfluoroalkyl sulfonates. , perfluoroalkyl carboxylic acid salts, perfluoroalkyl ethylene oxide adducts, oligomers containing perfluoroalkyl groups/hydrophilic groups/lipophilic groups, urethanes containing perfluoroalkyl groups/lipophilic groups, perfluoroalkyl phosphate esters, etc. Examples include surfactants, fatty acid amides, and the like, and these additives may be used singly or in combination of two or more.

The content of the additive is O81 to 10% by weight of the thermosetting resin.
A range of is preferred. The additive is 0.0% of the thermosetting resin 11.
If 1% by weight of the groove is ungrooved, the coefficient of friction may be uneven. Furthermore, if the amount of the additive is more than 10% by weight of the thermosetting resin, the adhesion to the heating resistor N4 may decrease depending on the materials of the thermosetting resin and the additive.

The slippery heat-resistant N5 may contain particles in addition to additives. Examples of particle materials include silicon oxide, carbon fluoride,
Talc, melamine resin, guanamine resin, alumina, boron nitride, silicon nitride, aluminum silicate, calcium carbonate, calcium silicate.

Examples include titanium oxide, aluminum hydroxide, barium sulfate, and the like.

The thickness of the slippery heat-resistant layer 5 has a strong influence on thermal conductivity, and the thinner the thickness, the better the thermal conductivity, but the worse the heat resistance.

Therefore, the thickness of the slippery heat-resistant layer 5 is preferably 1 to 10 μm.

The coating method for the slippery heat-resistant layer 5 is, for example, a bar coater.

Coating can be done using conventional methods such as gravure coater or reverse coater. Further, thermosetting resins usually undergo a curing reaction after being applied.

FIG. 2 shows a conceptual cross-sectional view of another embodiment of the present invention. An electrode NIO is formed at the interface between the heat generating resistance layer 4 and the slippery heat resistant layer 5.

FIG. 3 shows a conceptual structural sectional view of another embodiment of the present invention. A heat generating resistor N4 is laminated on the current-carrying high resistance Nll, and a slippery heat resistant layer N5 is formed on the heat generating resistor layer 4-H.

The slippery heat-resistant layer 5 shown in FIGS. 1 to 3 is usually in the form of a sheet, and when no recording signal is applied, the lubricious heat-resistant layer 5 is
shift the relative position.

Specific examples will be described below.

Example-1 O heating resistance layer A carbon-containing aromatic polyamide film (sheet resistance layer I KΩ/hole) was used.

○Smooth heat-resistant layer First, a coating liquid with the following composition was prepared.

Thermosetting 1 resin: Epoxy acrylate 5PI509 (manufactured by Showa Kobunshi ■) 30 parts by weight Sensitizer: Darocure-1173 (manufactured by Merck & Co., Ltd.)
1.5 parts by weight Additive: Silicone oil L-45 (100) (manufactured by Nippon Unicar) 3 parts by weight Solvent: ethyl acetate
70 parts by weight of the paint having the above composition was dissolved and applied onto the heat generating resistor layer using a bar coater. After drying the solvent, it was cured by irradiating it with a 1KW high pressure mercury lamp for 2 minutes to obtain heat generating element 1. . The coating thickness was 371 m.

Example 2 0 Heating Resistance Layer A film (600 angstroms of aluminum) was deposited on the carbon-containing polyamide film of Example 1.
A sheet resistance of approximately 1Ω/mouth) was used.

Heat generating element 2 was obtained by coating and curing the coating liquid of O-slip heat-resistant layer Example-1 in the same manner as in Example-1. The coating thickness was 371 tn.

Example-3 0 Heating Resistance Layer 7ic-SiO2 was attached to a carbon-containing polyimide film (sheet resistance layer 2 Ω/hole) with approximately 1000 angstroms of vines (sheet resistance approximately 200 Ω/hole) to form a heating resistance layer. did.

O-slip heat-resistant layer The coating liquid of Example-1 was applied in the same manner as in Example-1,
The heating element 3 was obtained by curing. The coating thickness was 3 knots.

Example-4 0 heating resistance layer The heating resistance layer of Example-3 was used.

O slippery heat resistant layer First, a coating liquid with the following composition was prepared.

Thermosetting resin: Epoxy acrylate 5P1509
30 parts by weight Sensitizer: Darocure-1
173 1.5 parts by weight Additive: Silicone surfactant L-7500 (manufactured by Nippon Unicar) 31 parts by weight Solvent:
70 Layout Parts: Melt the Kinusei paint and apply it on the heating resistor layer using a bar coater. After drying the solvent, irradiate it with an IKW high-pressure mercury lamp for 2 minutes to harden it to form the heating element 4. I got it. The coating thickness was 37 zm.

Example-5 Off heat resistance layer The heating resistance layer of Example-3 was used.

- Smooth heat-resistant layer Using the same paint as in Example 4, it was dried and cured in the same manner to obtain heating element 5. The coating thickness was 1011 m.

Example-6 0 heating resistance layer The heating resistance layer of Example-3 was used.

O Slip heat-resistant layer Using the same paint as in Example 4, it was dried and cured in the same manner to obtain a heating element 6. The coating thickness was 15 μm.

Example-7 0 heating resistance layer The heating resistance layer of Example-3 was used.

Heat generating element 7 was obtained by drying and curing in the same manner using the same paint as in O-lubricious heat-resistant layer (Example 4). The coating thickness was 1.57 Lm.

Example-8 0 heating resistance layer The heating resistance layer of Example-3 was used.

- Smooth heat-resistant layer Using the same paint as in Example 4, it was dried and cured in the same manner to obtain heating element 8. The coating thickness was 0°671 m.

Example-9 0 heating resistance layer The heating resistance layer of Example-3 was used.

O Slip heat-resistant layer A paint containing 0.03 parts by weight of additive L-7500 in the paint of Example-4 was prepared and dried and cured in the same manner as in Example-4 to obtain a heating element 9.

The coating thickness was 3 μm.

Example-10 0 heating resistance layer The heating resistance layer of Example-3 was used.

O Slip heat-resistant layer A paint containing 0.006 parts by weight of additive L-7500 in the paint of Example-4 was prepared and dried and cured in the same manner as in Example-4 to obtain a heating element 10. The coating thickness was 371 m.

Example-11 0 heating resistance layer The heating resistance layer of Example-3 was used.

○Smooth heat-resistant layer First, a coating liquid with the following composition was used.

Thermosetting resin: Sumitex Resin M-3 (manufactured by Sumitomo Chemical Co., Ltd.) 100 parts by weight Curing agent: Sumitex Accelerator ACX (manufactured by Sumitomo Chemical Co., Ltd.)
10 parts by weight Curing accelerator: Sumitex Accelerator
-80 (manufactured by Sumitomo Chemical Co., Ltd. (Mu1) 2 parts by weight Solvent: Water 100 parts by weight Additive: Fluorine surfactant Megafac F-177 (manufactured by Dainippon Ink ■)
3 parts by weight of Tamaki Kinsei's paint was dispersed in a ball mill for 30 minutes, coated on the heat generating resistor layer with a bar coater, dried the solvent, and heated at 150°C for 1 hour to harden to form a heat generating element. I got 11. The coating thickness was 1071 m.

Example-12 0 heating resistance layer The heating resistance layer of Example-3 was used.

○Smooth heat-resistant layer First, a coating liquid with the following composition was prepared.

The same thermosetting resin and sensitizer as in Example-4.

The same amount of solvent was prepared.

Additive Difluorinated surfactant Megafac F-184 (manufactured by Dainippon Ink ■) 1.5 parts by weight Additive: L-7005
1.5 parts by weight The above coating liquid was dissolved in the same manner as in Example 4, coated with a bar coater, and dried and cured in the same manner to obtain a heating element 12. The coating thickness was 3 μm.

Example-13 0 heating resistance layer The heating resistance layer of Example-3 was used.

○Smooth heat-resistant layer First, a coating liquid with the following composition was prepared.

The same thermosetting resin and sensitizer as in Example-12.

The same amounts of additives and solvents were prepared.

Particles: Carbon fluoride OF (Daikin Kogyo 551) 31
Ryube: The paint having the above composition was dispersed in a ball mill for 2 hours, coated on the heat generating resistor layer with a bar coater, and after drying the solvent, it was irradiated with an IKW high-pressure mercury lamp for 2 minutes to cure, thereby forming the heat generating element 13. I got it. The coating thickness was 371 m.

Comparative Example-1 A heating element 1' was prepared using only the same heating resistance layer as in Example-1.

Comparative Example 2 A heating element 2' was prepared using only the same heating resistance layer as in Example 2.

Comparative Example 3 A heating element 2' was prepared using only the same heating resistance layer as in Example 3.

Using the above heating elements 1 to 132 and heating elements 1' to 3', under the recording conditions shown below, perform a wax type transfer sheet) TCRC.
/W (manufactured by Fuji Kagaku Paper Industries ■) as a transfer sheet and thermal transfer paper TTRPW (manufactured by Mitsubishi Paper Industries ■) as a recording paper, and energization recording was performed by solid printing.

<Recording conditions> ○Electric head...16 dots/+-nm (separated electrode density) (Line head) ○Recording period
...0.4ms ○Applied pulse width ...80 )t s○Applied voltage
...39V The results are shown in the table.

Comparing heating element 1-13 with heating elements 1' to 3', it can be seen that the number of continuous recording lines is increased due to the smooth heat-resistant layer of the present invention.

Heating elements 1 to 3 show the relationship between the different shapes of the heat generating resistive layer of the present invention and continuous recording. It can be seen that the number of continuous recording lines increases when the heating resistive layer is provided on the current-carrying high-resistance layer (heating element 3) than when the film base itself is used as the heating resistive layer (heating elements 1 and 2). . The reason for this is that if the film itself is used as a heat generating resistance layer, history due to heating will accumulate and the film will be destroyed.

The heating elements 4 to 8 are an effect of the thickness of the active heat-resistant layer.

Due to the effect of the thickness of the slippery heat-resistant layer, the heating element 5 has a lower temperature than the heating element 4.
14,000 lines were extended, and the heating element 6 was extended about 2o, ooo lines. However, since the heating element 6 had a thick lubricious heat-resistant layer of 15 μm, the print recording sensitivity was slightly low. Also, the heating element 7
and heating element 8, on the contrary, are for the case where the slippery heat-resistant layer is thin. Heating element 7 was only reduced by about i,ooo lines compared to heating element 4, but heating element 8 was reduced by about 40,000 lines compared to heating element 7. The cause of this is the effect of the additives added to the heat-resistant layer.Heating element 4 is 10% by weight and heating element 9 is 0.1% by weight relative to the thermosetting resin. 10 is due to the fact that it is 0.05% by weight.

As is clear from the heating element 11, the lubricating heat-resistant layer of the present invention can be made of resins other than ultraviolet-curable thermosetting resins.

Comparing heating elements 4 and 12, it can be seen that multiple types of additives may be mixed.

Comparing heating elements 12 and 13, heating element 13 has an increased number of continuous recording lines by 94,000 lines. This is the effect of the particles placed in the active heat-resistant layer.

Further, in the present example and comparative example, since electrical contact was permanently maintained, no missing characters occurred.

Note that in this example and comparative example, there was no density difference between the rising line and the final line, and the recording period was 0.4 ms.
Even during high-speed recording, there was almost no heat accumulation.

Similar results were also obtained when other additive materials were added.

Similar results were also obtained using other heat-sensitive recording materials (for example, heat-sensitive recording paper, sublimation heat-sensitive transfer recording material, etc.).

Effects of the Invention In the heating element of the present invention, the slippery heat-resistant layer contains at least one additive selected from a fluorine-based, silicone-based, or acid amide-based mold release agent or surfactant, and a thermosetting resin. The recording material can be slid stably and for a long time.

In the recording method using the heating element of the present invention, electrical contact can be maintained permanently, so there is an effect that printing omissions do not occur during recording.

In addition, commercially available thermal transfer sheets and thermal paper can be used, and running costs can be reduced.

[Brief explanation of the drawing]

1 to 3 are cross-sectional views showing the structure of a heating element in an embodiment of the present invention, and FIG. 4 is a cross-sectional view showing the structure of a recording method using the heat generating element of the present invention. 1...Separation electrode, 2...1Iffi return electrode, 3.
... Current-carrying head, 4... Heat-generating resistive layer, 5... Slippery heat-resistant layer, 6... Heating element, 7... Heat-sensitive recording material,
10... Electrode layer, 11... Current-carrying high resistance layer. Name of agent: Patent attorney Toshio Nakao (1 person) Figure 1 Figure 2 (Ro) 3rd Figure 4

Claims (5)

[Claims] (1) A slippery heat-resistant layer is provided on the heat-generating resistance layer, and the slippery heat-resistant layer contains at least one additive selected from a fluorine-based, silicone-based, or acid amide-based mold release agent or a surfactant. A heating element characterized by comprising a curable resin. (2) The heating element according to claim 1, characterized in that an electrode layer is provided at the interface between the heating resistance layer and the slippery heat-resistant layer. (3) The heating element according to claim 1 or 2, wherein the heating resistance layer is laminated on the current-carrying high resistance layer. (4) The heating element according to any one of claims 1 to 3, characterized in that the slippery heat-resistant layer contains particles. (5) The heating element according to claim 1, wherein the additive is in a range of 0.1 to 10% by weight of the thermosetting resin.