JPH01146706A - Punching device - Google Patents
Punching deviceInfo
- Publication number
- JPH01146706A JPH01146706A JP30655287A JP30655287A JPH01146706A JP H01146706 A JPH01146706 A JP H01146706A JP 30655287 A JP30655287 A JP 30655287A JP 30655287 A JP30655287 A JP 30655287A JP H01146706 A JPH01146706 A JP H01146706A
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- punching pin
- ceramic green
- pin
- plastic rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 title abstract description 12
- 238000005553 drilling Methods 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 21
- 239000004033 plastic Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は材料板に穴を明ける穴明は装置に関し、持ちセ
ラミックグリーンシート上に複数の穴を明ける穴明は装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a drilling device for drilling holes in a material plate, and relates to a drilling device for drilling a plurality of holes in a ceramic green sheet.
セラミック多層配線基板は大型コンピュータなどの高密
度実装基板として実用化され始め、今後ますます普及し
ていくものと思われる。そのセラミック多層配線基板の
製造工程の一つにセラミックグリーンシートへの穴明は
工程がある。Ceramic multilayer wiring boards have begun to be put into practical use as high-density mounting boards for large computers, and are expected to become even more popular in the future. One of the manufacturing processes for the ceramic multilayer wiring board is the process of drilling holes in the ceramic green sheet.
従来、この種の穴明けを行う装置は、電圧が印加される
と軸方向に伸張力を発生する圧電素子により穴明はピン
を飛□行させ、局部的に収縮する弾性体上に置かれたセ
ラミックグリーンシートに穴明はピンを衝突させて穴明
けしていた。この穴明はピンは先端面を平行にしたもの
を使用していた。Conventionally, this type of drilling device uses a piezoelectric element that generates an axial stretching force when a voltage is applied to make the pin fly, and the pin is placed on an elastic body that contracts locally. Anaki was making a hole in the ceramic green sheet by colliding a pin with it. This drilling method used pins with parallel tip surfaces.
上述した従来の穴明は装置では、穴明はピンの先端面が
平なため、セラミックグリーンシートを打ち抜き、下型
の弾性体を局部的に押し潰すのに、極めて大きな力を必
要としていた。また穴明はピンが下型の弾性体に鋭く挿
入しないために穴の抜は際が大きく欠けるなどの欠点が
あった。In the conventional hole punching device described above, since the tip of the hole punching pin is flat, an extremely large force is required to punch out the ceramic green sheet and locally crush the elastic body of the lower die. Additionally, hole punching had the disadvantage that the pin was not inserted sharply into the elastic body of the lower mold, resulting in large chips at the edges when punching the hole.
本発明の穴明は装置は、材料板を表面上に保持する弾性
体と、先端がＶ字形状で外周先端が切れ刃をなす穴明は
ピンと、前記穴明はビンを先端が前記材料板を突き抜け
るように飛行させて前記材料板に穴を明ける駆動手段と
を含んで構成される。The drilling device of the present invention includes: an elastic body for holding a material plate on the surface; a drilling pin having a V-shaped tip and a cutting edge at the outer peripheral tip; and a driving means for making a hole in the material plate by flying the hole through the material plate.
〔作用）
先端部がＶ字形状で外周先端が切れ刃をなす穴明はビン
を使用すれば、極めて小さい力で穴明けすることができ
、しかも下型の弾性体に鋭く挿入するために穴の抜は際
が欠けることがなく真円度の高い良好な穴を明けること
ができ、セラミック多層配線基板の歩留り率を向上でき
る。[Function] If you use a bottle, you can make a hole with a V-shaped tip and a cutting edge on the outer edge with an extremely small amount of force. By punching, it is possible to make holes with high roundness without chipping, and the yield rate of ceramic multilayer wiring boards can be improved.
次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の穴明は装置の一実施例を示す全体断面
図、第２図は第１図に示す穴明はピン６の先端のセラミ
ックグリーンシート９に穴を明けた状態の部分拡大断面
図、第３図は穴明はピン６の先端部の底面図である。第
１図、第２図において駆動手段である圧電素子２は、上
端が筐体１に固定され、制御部３より電圧が印加される
と軸方向に伸張し伸張力を発生する。この例では、上端
が固定されているので伸張力は下方に働く。FIG. 1 is an overall cross-sectional view showing an embodiment of the device of the present invention, and FIG. 2 is a portion of the ceramic green sheet 9 at the tip of the pin 6. The enlarged cross-sectional view in FIG. 3 is a bottom view of the tip of the pin 6. In FIGS. 1 and 2, the piezoelectric element 2, which is a driving means, has its upper end fixed to the housing 1, and when a voltage is applied from the control section 3, it expands in the axial direction and generates a stretching force. In this example, the upper end is fixed, so the stretching force acts downward.
圧電素子２に電圧が印加されていないときに、圧電素子
２の下端に、高硬度高反発力の材料でできた穴明はビン
ヘッド４の球状頭部が与圧されて接するように筐体１に
両端を固定した板ばね５に穴明はピンヘッド４が固定さ
れている。穴明はピンヘッド４の下部は、穴明はピンヘ
ッド４と一体構造で、しかも先端がＶ字形状で外周先端
が切れ刃になっている微小径の穴明はビン６を有してい
る。穴明はピン６は、制御部３より圧電素子２に電圧が
印加されると圧電素子２の伸張力により飛ばされ、中心
軸上の下方向に飛行し、また、飛行後は板ばね５の復帰
力により元の位置に戻る。When no voltage is applied to the piezoelectric element 2, a hole made of a material with high hardness and high repulsion is inserted into the housing 1 so that the spherical head of the bottle head 4 is pressurized and comes into contact with the lower end of the piezoelectric element 2. A pin head 4 with a hole is fixed to a leaf spring 5 whose both ends are fixed to. The lower part of the pin head 4 has a micro diameter pin 6 which is integrally constructed with the pin head 4 and has a V-shaped tip and a cutting edge on the outer periphery. The pin 6 is blown away by the stretching force of the piezoelectric element 2 when a voltage is applied to the piezoelectric element 2 by the control unit 3, and flies downward on the central axis. It returns to its original position due to the restoring force.
穴開はピン６の下側には、支持板７の上面に固定された
プラスチックゴム板８と、異方性のプラスチックゴム板
８の上面には、被加工物のセラミックグリーンシート９
が設置されている。A plastic rubber plate 8 fixed to the upper surface of the support plate 7 is placed under the pin 6, and a ceramic green sheet 9 of the workpiece is placed on the upper surface of the anisotropic plastic rubber plate 8.
is installed.
穴開はビン６が飛行し、穴開はビン６のＶ字形状先端部
６０１がセラミックグリーンシート９に鋭く挿入し突き
抜けると、穴開はピン６の先端力を受けたプラスチック
ゴム８は局部的に押し潰され下型の同じ働きをする。穴
開はピン６の先端部′により抜かれた屑１０は、′プラ
スチックゴム８に押し潰された空間部分に埋め込まれる
。穴開はピン６はセラミックグリーンシート９を打ち抜
くと元の位置に戻りセラミックグリーンシート９に穴が
明けられ、る。To make a hole, the bottle 6 flies, and when the V-shaped tip 601 of the bottle 6 sharply inserts it into the ceramic green sheet 9 and penetrates it, the plastic rubber 8 receives the tip force of the pin 6, and the hole is made locally. It is crushed and has the same function as the lower mold. The scraps 10 removed by the tip of the pin 6 are buried in the space crushed by the plastic rubber 8. When the pin 6 punches out the ceramic green sheet 9, it returns to its original position and a hole is made in the ceramic green sheet 9.
引き続き穴明けする場合は、穴明はビン６の位置を筐体
１とともに少しずらすか、セラミックグリーンシート９
の位置を支持板７とともに少しずらせばよい。プラスチ
ックゴム板８の上面が屑１０で埋め尽くされれば新しい
プラスチックゴム板と交換して使用すればよい。If you wish to continue drilling, either move the position of the bottle 6 along with the casing 1 a little, or use the ceramic green sheet 9.
It is only necessary to slightly shift the position of the support plate 7 along with the support plate 7. If the upper surface of the plastic rubber plate 8 is completely covered with debris 10, it can be replaced with a new plastic rubber plate.
以上説明したように本発明は、穴明はビンの先端部を７
字形状で、しかも外周先端を切れ刃にしたことにより、
極めて小さい力で穴明けすることができ、しかも下型の
弾性体に鋭く挿入するために穴の抜は際が欠けることが
なく真円度の高い良好な穴を明けることができるため、
セラミック多層配線基板の歩留り率を向上できるなどの
効果がある。As explained above, in the present invention, the tip of the bottle is
By having a shape with a cutting edge at the tip of the outer periphery,
The hole can be drilled with extremely small force, and since it is inserted sharply into the elastic body of the lower mold, the hole can be punched without chipping at the edge, making it possible to drill a hole with a high degree of roundness.
This has the effect of improving the yield rate of ceramic multilayer wiring boards.
第１図は、本発明の一実施例を示す全体断面図、第２図
は第１図に示す穴明はビン６の先端のセラミックグリー
ンシート９に穴を明けた状態の部分拡大断面図、第３図
は穴明はビン６の先端部の底面図である。
１・・・筐体、２・・・圧電素子、３・・・制御部、４
・・・穴明はピンヘッド、５・・・板ばね、６・・・穴
明はピン、６０１・・・Ｖ字形状先端部、７・・・支持
板、８・・・異方性プラスチックゴム、９・・・セラミ
ックグリーンシート、１０・・・屑。FIG. 1 is an overall sectional view showing one embodiment of the present invention, and FIG. 2 is a partial enlarged sectional view of a state where the holes shown in FIG. 1 are made in the ceramic green sheet 9 at the tip of the bottle 6. FIG. 3 is a bottom view of the tip of the bottle 6. DESCRIPTION OF SYMBOLS 1... Housing, 2... Piezoelectric element, 3... Control part, 4
... Holes are pin heads, 5... Leaf springs, 6... Holes are pins, 601... V-shaped tip, 7... Support plate, 8... Anisotropic plastic rubber. , 9... Ceramic green sheet, 10... Scrap.
Claims (1)
外周先端が切れ刃をなす穴明けピンと、前記穴明けピン
を先端が前記材料板を突き抜けるように飛行させて前記
材料板に穴を明ける駆動手段とを含むことを特徴とする
穴明け装置。an elastic body that holds the material plate on the surface; a drilling pin having a V-shaped tip and a cutting edge at the outer peripheral tip; and a drilling pin that is flown so that its tip pierces through the material plate, and the drilling pin is attached to the material plate. A drilling device comprising a drive means for drilling a hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30655287A JPH01146706A (en) | 1987-12-02 | 1987-12-02 | Punching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30655287A JPH01146706A (en) | 1987-12-02 | 1987-12-02 | Punching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146706A true JPH01146706A (en) | 1989-06-08 |
Family
ID=17958416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30655287A Pending JPH01146706A (en) | 1987-12-02 | 1987-12-02 | Punching device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146706A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6261499B2 (en) * | 1979-10-30 | 1987-12-22 | Mitsubishi Electric Corp |
-
1987
- 1987-12-02 JP JP30655287A patent/JPH01146706A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6261499B2 (en) * | 1979-10-30 | 1987-12-22 | Mitsubishi Electric Corp |
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