JPH01146665A - Diamond segment chip - Google Patents
Diamond segment chipInfo
- Publication number
- JPH01146665A JPH01146665A JP30400787A JP30400787A JPH01146665A JP H01146665 A JPH01146665 A JP H01146665A JP 30400787 A JP30400787 A JP 30400787A JP 30400787 A JP30400787 A JP 30400787A JP H01146665 A JPH01146665 A JP H01146665A
- Authority
- JP
- Japan
- Prior art keywords
- wear
- diamond
- chip
- resistant
- side surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 30
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000002245 particle Substances 0.000 claims description 36
- 238000005520 cutting process Methods 0.000 abstract description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract description 2
- 229910052593 corundum Inorganic materials 0.000 abstract description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 2
- 239000003082 abrasive agent Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010426 asphalt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 102220555786 DDB1- and CUL4-associated factor 4_W22C_mutation Human genes 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- -1 blocks Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、石材、コンクリート、ブロック、レンガ、タ
イル、瓦その忙硬質材料の切断、穴開けに使用するダイ
ヤモンドセグメント型ブレードのセグメントチップに関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a segment tip of a diamond segment type blade used for cutting and drilling hard materials such as stone, concrete, blocks, bricks, tiles, and tiles.
ダイヤモンドセグメント型ブレードにおいて、セグメン
トチップが平坦、均一に摩耗することは切断の真直性を
維持するために特に重要である。In diamond segment type blades, flat, even wear of the segment tip is especially important to maintain straightness of the cut.
ところが、ダイヤモンドブレードによる切断作業時にお
いて、セグメントの周縁部の方が中央部より大きい切断
衝撃負荷を受け、周縁部の方が中 。However, when cutting with a diamond blade, the periphery of the segment receives a larger cutting impact load than the center, and the periphery receives a larger cutting impact load than the center.
央平坦部より先に摩耗し易く、その断面形状が丸い形状
となる。The center flat part tends to wear out first, and its cross-sectional shape becomes round.
従来、この対策として、セグメントを形成する砥材の硬
度、密度分布を変えたもの、あるいは各位置によってそ
の硬さが異なる結合剤を用いてセグメントをサンドウィ
ッチ状に成形して、セグメントの作用面の摩耗の平均化
を図ったものが、実公昭５３−１３９９１号公報、実開
昭４７−６４９１号公報、実開昭５７−８３３７２号公
報、実公昭６０−１２６９４号公報等に開示されている
。Conventionally, as a countermeasure to this problem, the hardness and density distribution of the abrasive material that forms the segments is changed, or the segments are formed into a sandwich shape using a bonding agent whose hardness varies depending on the position. Those aiming at equalizing the wear are disclosed in Japanese Utility Model Publication No. 53-13991, Japanese Utility Model Application Publication No. 47-6491, Japanese Utility Model Application Publication No. 57-83372, and Japanese Utility Model Publication No. 60-12694.
しかしながら、上記公報に記載のセグメントは、中心部
に砥材の低密度もしくは軟質部材を設け、その上、セグ
メントが性状の異なる層で形成されているため、全体と
して摩耗速度が早く、工具の寿命が低下するばかりでは
なく、両サイドで高低ができたり、極端に両サイドが立
った場合、サイドエツジが破損することがある。However, the segments described in the above publication have a low-density abrasive material or a soft member in the center, and in addition, the segments are formed of layers with different properties, so the overall wear rate is high and the tool has a long lifespan. Not only will this decrease, but if both sides become uneven, or if both sides stand up too much, the side edges may be damaged.
これらの現象に加えて、ダイヤモンドブレードによる切
削において切粉排出に必要なりリアランスが、側面の摩
耗によって消滅し、切断作業が不可能となる問題がある
。In addition to these phenomena, when cutting with a diamond blade, there is a problem that the clearance required for ejecting chips disappears due to wear of the side surface, making cutting work impossible.
ところが、ダイヤモンドセグメントチップにおける側面
摩耗に対する対策は従来、何等採られていない。However, conventionally, no measures have been taken to prevent side wear of diamond segment tips.
本発明は、ダイヤモンドブレードのセグメントチップの
両側部表面を耐摩耗性とすることによって切削作業中の
切粉による側面摩耗を防止することによって、クリアラ
ンスを確保して上記目的を達成したものである。The present invention achieves the above object by ensuring clearance by making the surfaces of both sides of the segment tip of a diamond blade wear-resistant to prevent side wear caused by chips during cutting operations.
両側部表面を耐摩耗性とするための具体的な手段として
、第１図に示すように、基体１の外周部に、基体１とク
リアランス２を有して形成されたダイヤモンドセグメン
トチップ３の両側面に耐摩耗性粒子４がダイヤモンド砥
材５と共に表面に露出した状態で埋め込まれた構造にす
る。As a specific means for making the surfaces of both sides wear-resistant, as shown in FIG. The structure is such that wear-resistant particles 4 and diamond abrasive material 5 are embedded in the surface in a state where they are exposed on the surface.
耐摩耗性粒子４としてはＷ２２Ｃ、ＷＣ、Ｗ２Ｃ、ＷＣ
、ＴｉＣ。Wear-resistant particles 4 include W22C, WC, W2C, and WC.
, TiC.
ＴｉＮ、 Ａｌ２Ｏ３，ＳｉＣもしくはセラミックス
粒を用いる。同耐摩耗性粒子４の径は、使用する砥材の
サイズで異なるが、例えば砥材であるダイヤモンド粒子
５０粒径が４０メツシユの場合は３００ｐ径のＷ ２
ＣｒＬを用いることができる。TiN, Al2O3, SiC or ceramic grains are used. The diameter of the wear-resistant particles 4 varies depending on the size of the abrasive used, but for example, if the diameter of 50 diamond particles used as the abrasive is 40 mesh, the diameter of the wear-resistant particles 4 is 300p.
CrL can be used.
第２図に示すように、耐摩耗性粒子４ａが小さすぎると
、側面のドレッシングの際に、砥材５の粒径の１５〜５
０％位の表面厚さの結合剤６と共に削り落とされてしま
う。このためドレッシング後も耐摩耗性材料を残留させ
るためには、少なくともダイヤモンド砥材５とほぼ同粒
径が必要である。As shown in FIG. 2, if the wear-resistant particles 4a are too small, they may be 15 to 5 times smaller than the particle size of the abrasive material 5 during side dressing.
It is scraped off together with the binder 6, which has a surface thickness of about 0%. Therefore, in order for the wear-resistant material to remain after dressing, it is necessary that the grain size is at least approximately the same as that of the diamond abrasive material 5.
また、第３図に示すように、逆に耐摩耗性粒子４ｂが大
きすぎると、ドレッシング後、砥材５の突出高さより耐
摩耗性粒子の突出高さが高くなり、これが切れ味に対し
てブレーキとして働くため不適当である。Moreover, as shown in FIG. 3, if the wear-resistant particles 4b are too large, the protruding height of the wear-resistant particles will be higher than the protruding height of the abrasive material 5 after dressing, and this will cause a brake on the sharpness. Unsuitable for working as a.
また、耐摩耗性粒子４を埋め込む深さは、ダイヤモンド
砥材５の粒径までとし、側面の表面に必ず耐摩耗性粒子
４が出現している必要がある。チップ内に深く埋まり込
むと、砥材５による切れ味に対する抵抗となる。Further, the depth at which the wear-resistant particles 4 are embedded must be up to the particle size of the diamond abrasive material 5, and the wear-resistant particles 4 must appear on the side surfaces. If it is deeply embedded in the chip, it will resist the sharpness of the abrasive material 5.
上記耐摩耗性粒子４の分散量は、１個の耐摩耗性粒子の
摩耗防御ゾーン域の大きさによって決定される。The amount of dispersion of the wear-resistant particles 4 is determined by the size of the wear protection zone of one wear-resistant particle.
実験によると、１個の耐摩耗性粒子４による摩耗防御ゾ
ーンは第４図に示すとおり、ブレードの回転方向の後方
に向かって、耐摩耗性粒子の粒径りの１０〜３０倍であ
ることが確認されている。従って、耐摩耗性粒子径りが
３００１ｓの場合、側面全体を防御するために必要な耐
摩耗性粒子４の量は、側面の全面積に対し、３〜２０％
の面接率を占めることが最適である。According to experiments, the wear protection zone by one wear-resistant particle 4 is 10 to 30 times the particle diameter of the wear-resistant particle toward the rear in the rotating direction of the blade, as shown in FIG. has been confirmed. Therefore, when the wear-resistant particle diameter is 3001s, the amount of wear-resistant particles 4 necessary to protect the entire side surface is 3 to 20% of the total area of the side surface.
It is optimal that the interview rate be
この分布率が３％よりも少ないと、側面摩耗の防止効果
が少なく、また２０％よりも多いと、砥材の切れ味を低
下させることになる。If this distribution ratio is less than 3%, the effect of preventing side wear will be small, and if it is more than 20%, the sharpness of the abrasive will be reduced.
さらに、耐摩耗性粒子４の形状として球状、立方体、板
状等、任意の形状を採り得る。Furthermore, the shape of the wear-resistant particles 4 may be any shape such as spherical, cubic, or plate-like.
上記セグメントチップ側面に耐摩耗性粒子を分布させる
ための方法として、チップ側面用パンチに耐摩耗性粒子
を接着しておき、その間をダイヤモンド粒子とメタルパ
ウダーを充填し、焼結する方法、耐摩耗性粒子を含む粉
体を一層だけチャージしておき、その上にダイヤモンド
とメタルパウダーを充填し、さらにその上に耐摩耗性を
含む粉体を一層チャージして同時焼結する方法、さらに
は、ダイヤモンドを含むグリーンコンパクトを作り、側
面に接着材を塗布して耐摩耗性粒子を貼りつけて焼結す
る方法等がある。As a method for distributing wear-resistant particles on the side surface of the segment chip, there is a method in which the wear-resistant particles are adhered to a punch for the chip side surface, and the space between them is filled with diamond particles and metal powder, and then sintered. A method of charging only one layer of powder containing wear-resistant particles, filling it with diamond and metal powder, and then charging a layer of powder containing wear-resistant particles on top of that and simultaneously sintering. There are methods such as making a green compact containing diamonds, applying an adhesive to the sides, pasting wear-resistant particles, and sintering it.
また、本発明による側面強化セグメントチップは、上記
従来の粒度、密度等の分布調整と併用することも勿論可
能である。Furthermore, it is of course possible to use the side-reinforced segment chip according to the present invention in combination with the above-mentioned conventional distribution adjustment of particle size, density, etc.
本発明を５７２ｍｍ径のアスファルト舗装道路切断用ダ
イヤモンドブレードに適用した。The present invention was applied to a diamond blade for cutting asphalt pavement with a diameter of 572 mm.
セグメントチップとして、５０ｕ！ｎ〜４００ｐメツシ
ユの合成ダイヤモンド砥材を、結合剤としてＷＣ（５ｐ
径）５５ｗｔ％＋Ｃｕ、 Ｓ ｎ、 Ｃｏ、 Ｎｉ ４
５ｗｔ％を用い、さらに、耐摩耗性粒子として４０〜５
０ｐメツシユのＷ２Ｃを、面積率５％に分布させたもの
を使用した。As a segment chip, 50u! A synthetic diamond abrasive material with a mesh size of n~400p was mixed with WC (5p
Diameter) 55wt%+Cu, Sn, Co, Ni 4
5 wt%, and 40 to 5 wt% as wear-resistant particles.
A 0p mesh W2C distributed at an area ratio of 5% was used.
このダイヤモンドプレートを用い、被削材として舗装厚
さ２００＋ｎｍのアスファルト舗装道路の切断を、以下
の作業条件で行った。Using this diamond plate, an asphalt paved road with a pavement thickness of 200+ nm was cut as a work material under the following working conditions.
エンジン駆動 ３７ＨＰ 出力
プレート回転数 ２５０Ｏｒｐｍ
切り込み深さ ２００ ｍ
送り速度 ６０ｍ／Ｈｒ
また、同条件で、耐摩耗性粒子を分布しないダイヤモン
ドブレードを用いて比較した。Engine drive: 37 HP Output plate rotation speed: 250 rpm Depth of cut: 200 m Feed rate: 60 m/Hr Further, a comparison was made under the same conditions using a diamond blade in which no wear-resistant particles were distributed.
その結果、第１表に示す結果を得ることができた。同表
の表示は、・第５図に示すものであり、同（ａ）は本発
明にかかるチップの性状を示し、ら）は従来チップの性
状を示す。そして、残留チップの形状は図示のとおりで
あった。As a result, the results shown in Table 1 could be obtained. The representations in the table are as shown in FIG. 5, in which (a) shows the properties of the chip according to the present invention, and (ra) shows the properties of the conventional chip. The shape of the remaining chips was as shown in the figure.
第１表 〔発明の効果〕 本発明により、以下の効果を奏することができる。Table 1 〔Effect of the invention〕 According to the present invention, the following effects can be achieved.
■ 従来の粒度、密度調整をしたセグメントチップより
も作動面の平坦、均一性が維持できる。■ The flatness and uniformity of the working surface can be maintained compared to conventional segment chips with particle size and density adjustment.
■ 側面の摩耗がなくなり、的確なりリアランスを最終
使用にまで維持でき、■と併せ切削に際しての真直性を
維持できる。（使い切り後のチップ厚さは２．５ｍｎ＋
に対し３．４ｍｍ）■ ダイヤモンドセグメントチップ
を最後まで使用できるため、耐用が６０％向上した。（
チップ残留量は１．５ｍｍに対し０．３１１１１１１＞
■ クリアランスを大きく最後まで維持でき、切味も向
上できる。■ Eliminates wear on the sides, allowing accurate clearance to be maintained until final use, and in conjunction with ■, maintains straightness during cutting. (Chip thickness after use is 2.5mm+
3.4mm) ■ The diamond segment tip can be used to the end, improving durability by 60%. (
Chip residual amount is 0.3111111 for 1.5mm>
■ Large clearance can be maintained until the end, and cutting quality can also be improved.
第１図は本発明の態様を示し、第２図右よび第３図は条
件設定の説明図、第４図は耐摩耗性の摩耗防御ゾーンの
説明図、さらに第５図は実施例における本発明のチップ
と比較例のチップの性状を示す図である。
１ニブレードの基体 ２：クリアランス３：ダイヤ
モンドセグメントチップ
４：耐摩耗性粒子 ５：ダイヤモンド砥材６：除
去されて、結合材FIG. 1 shows an embodiment of the present invention, FIG. It is a figure showing the properties of the chip of the invention and the chip of a comparative example. 1. Substrate of two blades 2: Clearance 3: Diamond segment tip 4: Wear-resistant particles 5: Diamond abrasive material 6: Removed and bonding material
Claims (1)
ヤモンド砥材粒子と略同径の耐摩耗性粒子を分散した耐
摩耗面を形成したダイヤモンドセグメントチップ。 ２、耐摩耗性粒子が、Ｗ＿２Ｃ、ＷＣ、ＴｉＣ、ＴｉＮ
、Ａｌ＿２Ｏ＿３、ＳｉＣ等のセラミックス粒子である
ことを特徴とする特許請求の範囲第１項に記載のダイヤ
モンドセグメントチップ。 ３、耐摩耗面が耐摩耗性粒子を表面上に現出したもので
あることを特徴とする特許請求の範囲第１項に記載のダ
イヤモンドセグメントチップ。 ４、耐摩耗性粒子の表面分布率が、全側面に対し３〜２
０％の面積率であることを特徴とする特許請求の範囲第
１項に記載のダイヤモンドセグメントチップ。[Scope of Claims] 1. A diamond segment chip in which a wear-resistant surface is formed on the side surface of the segment chip in which wear-resistant particles having approximately the same diameter as the diamond abrasive particles forming the chip are dispersed. 2. Wear-resistant particles are W_2C, WC, TiC, TiN
, Al_2O_3, SiC, etc., the diamond segment chip according to claim 1. 3. The diamond segment chip according to claim 1, wherein the wear-resistant surface has wear-resistant particles exposed on the surface. 4. The surface distribution ratio of wear-resistant particles is 3 to 2 on all sides.
The diamond segment chip according to claim 1, characterized in that the area ratio is 0%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62304007A JPH0712592B2 (en) | 1987-11-30 | 1987-11-30 | Diamond segment type blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62304007A JPH0712592B2 (en) | 1987-11-30 | 1987-11-30 | Diamond segment type blade |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01146665A true JPH01146665A (en) | 1989-06-08 |
| JPH0712592B2 JPH0712592B2 (en) | 1995-02-15 |
Family
ID=17927937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62304007A Expired - Lifetime JPH0712592B2 (en) | 1987-11-30 | 1987-11-30 | Diamond segment type blade |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0712592B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994023873A1 (en) * | 1993-04-16 | 1994-10-27 | Widia Heinlein Gmbh | Cutting tool |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3739304B2 (en) | 2001-07-26 | 2006-01-25 | 株式会社ノリタケスーパーアブレーシブ | Rotating disc grinding wheel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56151762U (en) * | 1980-04-09 | 1981-11-13 | ||
| JPS57149961U (en) * | 1981-03-18 | 1982-09-20 |
-
1987
- 1987-11-30 JP JP62304007A patent/JPH0712592B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56151762U (en) * | 1980-04-09 | 1981-11-13 | ||
| JPS57149961U (en) * | 1981-03-18 | 1982-09-20 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994023873A1 (en) * | 1993-04-16 | 1994-10-27 | Widia Heinlein Gmbh | Cutting tool |
| US5632576A (en) * | 1993-04-16 | 1997-05-27 | Widia Heinlein Gmbh | Cutting plate for a ball head miller |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0712592B2 (en) | 1995-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8104464B2 (en) | Brazed diamond tools and methods for making the same | |
| US7124753B2 (en) | Brazed diamond tools and methods for making the same | |
| US9868100B2 (en) | Brazed diamond tools and methods for making the same | |
| US9463552B2 (en) | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods | |
| US9409280B2 (en) | Brazed diamond tools and methods for making the same | |
| US9221154B2 (en) | Diamond tools and methods for making the same | |
| US20040112359A1 (en) | Brazed diamond tools and methods for making the same | |
| JP3739304B2 (en) | Rotating disc grinding wheel | |
| US9199357B2 (en) | Brazed diamond tools and methods for making the same | |
| US9238207B2 (en) | Brazed diamond tools and methods for making the same | |
| JPH01146665A (en) | Diamond segment chip | |
| JPH07266239A (en) | Diamond core bit | |
| JPH04135176A (en) | Dressing method for poreless type grinding wheel | |
| JPS62176769A (en) | Grinding stone | |
| JPH05345280A (en) | Tip structure of diamond cutting grinding wheel | |
| WO2000051789A1 (en) | Diamond saw blade | |
| JPS59152066A (en) | Cubic crystal boron nitride grind stone | |
| JPH0624700B2 (en) | Vitrified grindstone | |
| JP2001087943A (en) | Composite rotary cutter | |
| JP3097356B2 (en) | Manufacturing method of drill bit | |
| JP2000190228A (en) | Fixed abrasive grain work tool | |
| JPH0276681A (en) | Saw blade member containing fine diamond or cubic system boron nitride grain | |
| JPH081807Y2 (en) | Cutting stone | |
| JP3539679B2 (en) | Segment structure of diamond blade | |
| JP2992250B2 (en) | Dressing method of inner peripheral blade in semiconductor wafer cutting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080215 Year of fee payment: 13 |