JPH01146551U - - Google Patents

Info

Publication number
JPH01146551U
JPH01146551U JP4262388U JP4262388U JPH01146551U JP H01146551 U JPH01146551 U JP H01146551U JP 4262388 U JP4262388 U JP 4262388U JP 4262388 U JP4262388 U JP 4262388U JP H01146551 U JPH01146551 U JP H01146551U
Authority
JP
Japan
Prior art keywords
power transistor
diode
external terminal
backflow prevention
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4262388U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4262388U priority Critical patent/JPH01146551U/ja
Publication of JPH01146551U publication Critical patent/JPH01146551U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Continuous-Control Power Sources That Use Transistors (AREA)
  • Power Conversion In General (AREA)
JP4262388U 1988-03-30 1988-03-30 Pending JPH01146551U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4262388U JPH01146551U (enExample) 1988-03-30 1988-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4262388U JPH01146551U (enExample) 1988-03-30 1988-03-30

Publications (1)

Publication Number Publication Date
JPH01146551U true JPH01146551U (enExample) 1989-10-09

Family

ID=31269032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4262388U Pending JPH01146551U (enExample) 1988-03-30 1988-03-30

Country Status (1)

Country Link
JP (1) JPH01146551U (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60235450A (ja) * 1984-05-08 1985-11-22 Sanyo Electric Co Ltd 半導体集積回路装置
JPS62115854A (ja) * 1985-11-15 1987-05-27 Sharp Corp マルチチツプデバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60235450A (ja) * 1984-05-08 1985-11-22 Sanyo Electric Co Ltd 半導体集積回路装置
JPS62115854A (ja) * 1985-11-15 1987-05-27 Sharp Corp マルチチツプデバイス

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