JPH01146544U - - Google Patents
Info
- Publication number
- JPH01146544U JPH01146544U JP4310588U JP4310588U JPH01146544U JP H01146544 U JPH01146544 U JP H01146544U JP 4310588 U JP4310588 U JP 4310588U JP 4310588 U JP4310588 U JP 4310588U JP H01146544 U JPH01146544 U JP H01146544U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor device
- semiconductor
- die
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4310588U JPH01146544U (US20030157376A1-20030821-M00001.png) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4310588U JPH01146544U (US20030157376A1-20030821-M00001.png) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146544U true JPH01146544U (US20030157376A1-20030821-M00001.png) | 1989-10-09 |
Family
ID=31269506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4310588U Pending JPH01146544U (US20030157376A1-20030821-M00001.png) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146544U (US20030157376A1-20030821-M00001.png) |
-
1988
- 1988-03-31 JP JP4310588U patent/JPH01146544U/ja active Pending
