JPH01146537U - - Google Patents
Info
- Publication number
- JPH01146537U JPH01146537U JP4409888U JP4409888U JPH01146537U JP H01146537 U JPH01146537 U JP H01146537U JP 4409888 U JP4409888 U JP 4409888U JP 4409888 U JP4409888 U JP 4409888U JP H01146537 U JPH01146537 U JP H01146537U
- Authority
- JP
- Japan
- Prior art keywords
- molded electronic
- components
- resin
- exteriorized
- transistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4409888U JPH01146537U (zh) | 1988-03-30 | 1988-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4409888U JPH01146537U (zh) | 1988-03-30 | 1988-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146537U true JPH01146537U (zh) | 1989-10-09 |
Family
ID=31270475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4409888U Pending JPH01146537U (zh) | 1988-03-30 | 1988-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146537U (zh) |
-
1988
- 1988-03-30 JP JP4409888U patent/JPH01146537U/ja active Pending