JPH01146533U - - Google Patents
Info
- Publication number
- JPH01146533U JPH01146533U JP4357088U JP4357088U JPH01146533U JP H01146533 U JPH01146533 U JP H01146533U JP 4357088 U JP4357088 U JP 4357088U JP 4357088 U JP4357088 U JP 4357088U JP H01146533 U JPH01146533 U JP H01146533U
- Authority
- JP
- Japan
- Prior art keywords
- tool
- bonding
- pressing
- forces
- raising
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Wire Bonding (AREA)
Description
第1図は本考案のテープボンデイング装置の実
施例の構成図、第2図は従来のテープボンデイン
グ装置のボンデイングツール加圧手段の構成図で
ある。
1……上下駆動モータ、2……プーリ、3……
ベルト、4……ボールねじロツド、5……上下ス
ライドガイド部、6……ボンデイングツール、7
……加圧力伝達アーム、8……低加圧シリンダ、
9……高加圧シリンダ、10……アーム支持部、
11……ばね、12……スライド部、13……ツ
ールホルダ、14……カムフオロア、15……ス
ライド部、18……上下駆動モータ、19……上
下カム、21……加圧シリンダ、22……加圧力
伝達アーム。
FIG. 1 is a block diagram of an embodiment of the tape bonding apparatus of the present invention, and FIG. 2 is a block diagram of a bonding tool pressurizing means of a conventional tape bonding apparatus. 1...Vertical drive motor, 2...Pulley, 3...
Belt, 4... Ball screw rod, 5... Vertical slide guide section, 6... Bonding tool, 7
...Pressure transmission arm, 8...Low pressure cylinder,
9...High pressure cylinder, 10...Arm support part,
DESCRIPTION OF SYMBOLS 11... Spring, 12... Slide part, 13... Tool holder, 14... Cam follower, 15... Slide part, 18... Vertical drive motor, 19... Vertical cam, 21... Pressure cylinder, 22... ...Pressure force transmission arm.
Claims (1)
段と;ボンデイングツールをワークに押し付ける
第1および第2のツール加圧力をそれぞれ発生す
る第1および第2のツール加圧力発生手段と;第
1のツール加圧力と第2のツール加圧力を加算し
てボンデイングツールに伝えることのできるツー
ル加圧力伝達手段と;を具備することを特徴とす
るテープボンデイング装置。 tool raising and lowering means for raising and lowering the bonding tool; first and second tool pressing force generating means for respectively generating first and second tool pressing forces for pressing the bonding tool against the work; first and second tool pressing forces; A tape bonding apparatus comprising: a tool pressurizing force transmitting means capable of adding two tool pressurizing forces and transmitting the sum to the bonding tool.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4357088U JPH01146533U (en) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4357088U JPH01146533U (en) | 1988-03-31 | 1988-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01146533U true JPH01146533U (en) | 1989-10-09 |
Family
ID=31269963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4357088U Pending JPH01146533U (en) | 1988-03-31 | 1988-03-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01146533U (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5411668A (en) * | 1977-06-27 | 1979-01-27 | Shinkawa Seisakusho Kk | Tape bonding unit |
JPS63157432A (en) * | 1986-12-20 | 1988-06-30 | Toshiba Corp | Inner reed bonding equipment |
JPS63232345A (en) * | 1987-03-20 | 1988-09-28 | Toshiba Corp | Inner lead bonder |
-
1988
- 1988-03-31 JP JP4357088U patent/JPH01146533U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5411668A (en) * | 1977-06-27 | 1979-01-27 | Shinkawa Seisakusho Kk | Tape bonding unit |
JPS63157432A (en) * | 1986-12-20 | 1988-06-30 | Toshiba Corp | Inner reed bonding equipment |
JPS63232345A (en) * | 1987-03-20 | 1988-09-28 | Toshiba Corp | Inner lead bonder |
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