JPH01146529U - - Google Patents
Info
- Publication number
- JPH01146529U JPH01146529U JP4301188U JP4301188U JPH01146529U JP H01146529 U JPH01146529 U JP H01146529U JP 4301188 U JP4301188 U JP 4301188U JP 4301188 U JP4301188 U JP 4301188U JP H01146529 U JPH01146529 U JP H01146529U
- Authority
- JP
- Japan
- Prior art keywords
- lands
- external connection
- holes
- view
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000011253 protective coating Substances 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043011U JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043011U JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01146529U true JPH01146529U (US07579456-20090825-P00002.png) | 1989-10-09 |
| JPH0625006Y2 JPH0625006Y2 (ja) | 1994-06-29 |
Family
ID=31269412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988043011U Expired - Lifetime JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625006Y2 (US07579456-20090825-P00002.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5769765A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Sealed body of semiconductor device |
| JPS5769766A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Ship carrier |
| JPS57201839U (US07579456-20090825-P00002.png) * | 1981-06-19 | 1982-12-22 |
-
1988
- 1988-03-31 JP JP1988043011U patent/JPH0625006Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5769765A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Sealed body of semiconductor device |
| JPS5769766A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Ship carrier |
| JPS57201839U (US07579456-20090825-P00002.png) * | 1981-06-19 | 1982-12-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625006Y2 (ja) | 1994-06-29 |
