JPH01145538A - Thermistor type temperature sensor - Google Patents
Thermistor type temperature sensorInfo
- Publication number
- JPH01145538A JPH01145538A JP30317887A JP30317887A JPH01145538A JP H01145538 A JPH01145538 A JP H01145538A JP 30317887 A JP30317887 A JP 30317887A JP 30317887 A JP30317887 A JP 30317887A JP H01145538 A JPH01145538 A JP H01145538A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- thermistor
- leaf spring
- temp
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 229910000906 Bronze Inorganic materials 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010974 bronze Substances 0.000 abstract description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 2
- 230000035515 penetration Effects 0.000 abstract 1
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は自動車のエンジン冷却水温を検出するために使
用するサーミスタ式温度センサに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermistor-type temperature sensor used to detect the temperature of engine cooling water in an automobile.
従来の自動車に使用されるエンジン冷却水温検出用温度
センサは公開実用新案昭54−39084に記載のよう
になっていた。温度検出用サーミスタを熱可塑性樹脂と
一体成形された板ばねでクリップし、鎖板ばねを外部接
続用端子に接続している。A conventional temperature sensor for detecting the temperature of engine cooling water used in automobiles is as described in the published utility model No. 54-39084. The temperature detection thermistor is clipped with a leaf spring integrally molded with thermoplastic resin, and the chain leaf spring is connected to an external connection terminal.
上記従来技術は熱可塑性樹脂のベースにインサートされ
た板ばねの気密性の点については配慮されておらず耐水
性が悪いという問題があった。The above-mentioned conventional technology does not take into consideration the airtightness of the leaf spring inserted into the thermoplastic resin base, and has a problem of poor water resistance.
本発明の目的は耐水性の優れたものにすることにある。An object of the present invention is to provide a material with excellent water resistance.
上記目的は熱可塑性樹脂のベースにインサートされる板
ばね、及びホルダーの表面に凹凸を設けることにより達
成される。The above object is achieved by providing a plate spring inserted into a thermoplastic resin base and by providing irregularities on the surface of the holder.
板ばね及びホルダーの表面に設けた凹凸により、冷熱耐
久テストにより熱可塑性樹脂との接合面の剥離が凹凸面
でずれ止めされ、抑えられ板ばね及びホルダーの気密性
は良くなる。Due to the unevenness provided on the surface of the leaf spring and holder, the peeling of the joint surface with the thermoplastic resin is prevented and suppressed by the uneven surface during a cold and heat durability test, and the airtightness of the leaf spring and holder is improved.
以下、本発明の一実施例を第1図〜第8図により説明す
る。1は円筒形のNTC特性を持つサーミスタで、両端
面に銀を焼付し電極としている。An embodiment of the present invention will be described below with reference to FIGS. 1 to 8. 1 is a cylindrical thermistor with NTC characteristics, with silver baked on both end faces to serve as electrodes.
2はサーミスタ端面の銀電極に接する部分を球面に加工
し、サーミスタの画電極を一定の圧力で挾む様に設定さ
れているりん青銅板より出来ている板ばねで、熱可塑性
樹脂(ガラス30%入りナイロン6)のベース3を成形
するときインサートされたものである。第2図に板ばね
3をベース3にインサートするときの状態を示す。熱可
塑性樹脂(ガラス30%入りナイロン6)で出来ている
ホルダー4に設けた出張部5に板ばねの穴を合せ、位置
決めし、かつホルダーの出張部5を熱溶融し固定する。2 is a plate spring made of a phosphor bronze plate whose end surface of the thermistor is made into a spherical surface in contact with the silver electrode, and is set to sandwich the thermistor's picture electrode with a constant pressure. It was inserted when molding the base 3 of nylon 6). FIG. 2 shows the state in which the leaf spring 3 is inserted into the base 3. The holes of the leaf springs are aligned and positioned with the protruding parts 5 provided on the holder 4 made of thermoplastic resin (nylon 6 containing 30% glass), and the protruding parts 5 of the holder are fixed by heat melting.
板ばねの一端にはサーミスタの電極に接する出張部6を
設け、他端には子端子7のL形に折り曲げた部分を溶接
で固定する。板ばねのベース3に埋込まれる部分の形状
は第2図の如く凹凸に折り曲げ、かつ第3図の如く巾寸
法を数個所D>dに細く加工する。One end of the leaf spring is provided with a projecting portion 6 that contacts the electrode of the thermistor, and the L-shaped bent portion of the child terminal 7 is fixed to the other end by welding. The shape of the portion of the leaf spring to be embedded in the base 3 is bent into an uneven shape as shown in FIG. 2, and the width is narrowed in several places so that D>d as shown in FIG.
第4図、第5図はホルダーの正面図とAA断面図である
。ホルダー4の一端8は円筒形をしたサーミスタ1の外
径に合せた半円形とし、サーミスタ1を装着したときの
位置決めとしている。ホルダー4に設けた溝寸法Wは板
ばね2の巾寸法りより若干寸法を大きくし、板ばねを溝
に挿入し、板ばねの位置決めとしている。又ホルダーの
巾、厚にW>w、B>bの凹凸を数個設けている。FIGS. 4 and 5 are a front view and an AA sectional view of the holder. One end 8 of the holder 4 is semicircular to match the outer diameter of the cylindrical thermistor 1, and is used for positioning when the thermistor 1 is attached. The groove dimension W provided in the holder 4 is slightly larger than the width dimension of the leaf spring 2, and the leaf spring is inserted into the groove to position the leaf spring. In addition, the width and thickness of the holder are provided with several unevenness such that W>w and B>b.
第6図、第7図は熱可塑樹脂(ガラス30%入りナイロ
ン6)で成形したサーミスタホルダー9で、中心部の出
張部1oの先端は円筒状のサーミスタを抑えるため半円
形の形状をしたものである。Figures 6 and 7 show a thermistor holder 9 molded from thermoplastic resin (nylon 6 with 30% glass content), and the tip of the protruding portion 1o at the center is semicircular to suppress the cylindrical thermistor. It is.
サーミスタホルダー9の底部両端の出張部11の先端部
に穴12を設け、ベースの出張部13と嵌合させサーミ
スタホルダーの軸方向の位置決めとしている。またサー
ミスタホルダーの該出張部11とベース3との接触面は
平面とし回転方向の回りを防止している。サーミスタ1
およびサーミスタホルダー9を装着したベースアッセン
ブリを六角黄銅棒を切削した中空ケース14の中に挿入
し、ケース14の開口端15を加締めることによりベー
ス段付部に設置したゴム環のOリング16を三角溝に収
めることにより温度センサ内部に水が浸入するのを防止
する。端子7とベース3の接合面の気密性を保つため、
可撓性エポキシ樹脂の接着剤17を塗布する。Holes 12 are provided at the tips of protrusions 11 at both ends of the bottom of the thermistor holder 9, and are fitted with protrusions 13 on the base to position the thermistor holder in the axial direction. Further, the contact surface between the projecting portion 11 of the thermistor holder and the base 3 is made flat to prevent rotation in the rotational direction. Thermistor 1
Insert the base assembly with the thermistor holder 9 attached into the hollow case 14 made by cutting a hexagonal brass rod, and tighten the open end 15 of the case 14 to tighten the rubber ring O-ring 16 installed on the stepped part of the base. By fitting it into the triangular groove, water is prevented from entering inside the temperature sensor. In order to maintain the airtightness of the joint surface between the terminal 7 and the base 3,
A flexible epoxy resin adhesive 17 is applied.
この様に構成されたサーミスタ式温度センサはケース先
端部18を温度を検出する個所に挿入する様に、ケース
14に設けたねじ19により実機に取付けられる。検出
部の温度変化をサーミスタの抵抗変化として端子7より
取出すものである。The thermistor type temperature sensor configured in this manner is attached to an actual device using screws 19 provided in the case 14 such that the case tip 18 is inserted into the temperature detecting location. The temperature change of the detection section is taken out from the terminal 7 as a resistance change of the thermistor.
本発明の一実施例によると、板ばね2.ホルダー4のベ
ース3に埋込まれた部分に凹、凸を設けることにより、
ベース材料と板ばね、ホルダーの接合面の密着性を良く
することが出来る、これにより、外部からの水の浸入を
防止することが出来るので、耐水性能の優れた温度セン
サとすることが出来る効果がある。また、リード線端子
を廃止し、直差し端子の温度センサとすることが出来る
のでコストの安い物とすることが出来る。According to one embodiment of the invention, leaf spring 2. By providing concavities and convexities in the part embedded in the base 3 of the holder 4,
The adhesion between the base material, leaf spring, and holder joint surfaces can be improved, which prevents water from entering from the outside, resulting in a temperature sensor with excellent water resistance. There is. Furthermore, since the lead wire terminal can be eliminated and a temperature sensor with a direct-plug terminal can be used, the cost can be reduced.
本発明によれば、温度センサを冷熱耐久試験(−20℃
X15分−)130’CX 15分/1+J−1’クル
)に供すると、板ばね、ホルダーに凹凸がないものは1
oサイクルで端子7とベース3の接合面より気泡が発生
気密不良になるが、板ばね、ホルダーに凹凸設けた本発
明品は50サイクル完了゛しても気密不良になるものは
発生しないことより、耐水性の優れた温度センサとする
ことが出来る効果がある。According to the present invention, the temperature sensor is subjected to a cold and heat durability test (-20℃
*15 minutes -) 130'CX 15 minutes/1+J-1'km
During o cycles, air bubbles are generated from the joint surface of the terminal 7 and the base 3, resulting in poor airtightness, but with the product of the present invention, which has unevenness on the leaf spring and holder, no airtightness defects occur even after 50 cycles are completed. This has the effect of providing a temperature sensor with excellent water resistance.
第1図は本発明の断面正面図、第2図はホルダーアッセ
ンブリの断面正面図、第3図はホルダーアッセンブリの
側面図、第4図はホルダーの正面図、第5図はホルダー
のAA断面図、第6図はサーミスタホルダーの平面図、
第7図はサーミスタホルダーのEE断面図、第8図はサ
ーミスタホルダーの正面図である。
1・・・サーミスタ、2・・・板ばね、3・・・ベース
、4・・・ホルダー、14・・・ケース。Fig. 1 is a sectional front view of the present invention, Fig. 2 is a sectional front view of the holder assembly, Fig. 3 is a side view of the holder assembly, Fig. 4 is a front view of the holder, and Fig. 5 is an AA sectional view of the holder. , Figure 6 is a plan view of the thermistor holder,
FIG. 7 is an EE sectional view of the thermistor holder, and FIG. 8 is a front view of the thermistor holder. 1... Thermistor, 2... Leaf spring, 3... Base, 4... Holder, 14... Case.
Claims (1)
状ケースのケース底部にベースに埋込んだばね特性を有
する固定板によりサーミスタを圧接し導通するものにお
いて、ベースに埋込んだ固定板を凹凸に成形したことを
特徴とするサーミスタ式温度センサ。1. In the case where the thermistor is a heat-sensitive element and the thermistor is pressed into contact with a fixing plate with spring characteristics embedded in the base at the bottom of the case of a hollow case with only the top open, the fixing plate embedded in the base is made uneven. A thermistor type temperature sensor characterized by being molded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30317887A JPH01145538A (en) | 1987-12-02 | 1987-12-02 | Thermistor type temperature sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30317887A JPH01145538A (en) | 1987-12-02 | 1987-12-02 | Thermistor type temperature sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01145538A true JPH01145538A (en) | 1989-06-07 |
Family
ID=17917821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30317887A Pending JPH01145538A (en) | 1987-12-02 | 1987-12-02 | Thermistor type temperature sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01145538A (en) |
-
1987
- 1987-12-02 JP JP30317887A patent/JPH01145538A/en active Pending
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