JPH01145135U - - Google Patents
Info
- Publication number
- JPH01145135U JPH01145135U JP4142588U JP4142588U JPH01145135U JP H01145135 U JPH01145135 U JP H01145135U JP 4142588 U JP4142588 U JP 4142588U JP 4142588 U JP4142588 U JP 4142588U JP H01145135 U JPH01145135 U JP H01145135U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- groove
- viewed
- embedded
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4142588U JPH01145135U (hu) | 1988-03-28 | 1988-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4142588U JPH01145135U (hu) | 1988-03-28 | 1988-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145135U true JPH01145135U (hu) | 1989-10-05 |
Family
ID=31267859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4142588U Pending JPH01145135U (hu) | 1988-03-28 | 1988-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145135U (hu) |
-
1988
- 1988-03-28 JP JP4142588U patent/JPH01145135U/ja active Pending