JPH01145133U - - Google Patents
Info
- Publication number
- JPH01145133U JPH01145133U JP1988040783U JP4078388U JPH01145133U JP H01145133 U JPH01145133 U JP H01145133U JP 1988040783 U JP1988040783 U JP 1988040783U JP 4078388 U JP4078388 U JP 4078388U JP H01145133 U JPH01145133 U JP H01145133U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cap
- internal wiring
- molded
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988040783U JPH0741158Y2 (ja) | 1988-03-28 | 1988-03-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988040783U JPH0741158Y2 (ja) | 1988-03-28 | 1988-03-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01145133U true JPH01145133U (US07655688-20100202-C00086.png) | 1989-10-05 |
| JPH0741158Y2 JPH0741158Y2 (ja) | 1995-09-20 |
Family
ID=31267245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988040783U Expired - Lifetime JPH0741158Y2 (ja) | 1988-03-28 | 1988-03-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741158Y2 (US07655688-20100202-C00086.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190052098A (ko) * | 2016-10-24 | 2019-05-15 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59152647A (ja) * | 1983-02-21 | 1984-08-31 | Sumitomo Electric Ind Ltd | 多層配線方法 |
| JPS6194352U (US07655688-20100202-C00086.png) * | 1984-11-26 | 1986-06-18 |
-
1988
- 1988-03-28 JP JP1988040783U patent/JPH0741158Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59152647A (ja) * | 1983-02-21 | 1984-08-31 | Sumitomo Electric Ind Ltd | 多層配線方法 |
| JPS6194352U (US07655688-20100202-C00086.png) * | 1984-11-26 | 1986-06-18 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190052098A (ko) * | 2016-10-24 | 2019-05-15 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
| DE112016007369T5 (de) | 2016-10-24 | 2019-07-11 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
| US10854523B2 (en) | 2016-10-24 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
| DE112016007369B4 (de) | 2016-10-24 | 2022-09-29 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741158Y2 (ja) | 1995-09-20 |
