JPH01144638A - Manufacturing apparatus for semiconductor - Google Patents
Manufacturing apparatus for semiconductorInfo
- Publication number
- JPH01144638A JPH01144638A JP30369087A JP30369087A JPH01144638A JP H01144638 A JPH01144638 A JP H01144638A JP 30369087 A JP30369087 A JP 30369087A JP 30369087 A JP30369087 A JP 30369087A JP H01144638 A JPH01144638 A JP H01144638A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- dust
- section
- air
- shutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000428 dust Substances 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 230000003247 decreasing effect Effects 0.000 claims 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000010410 dusting Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1753—Cleaning or purging, e.g. of the injection unit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体製造装置の改良に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvement of semiconductor manufacturing equipment.
第２図は従来の半導体製造装置を示す図であり、図に於
いて、（１）は半導体素子を封止成形するモールド金型
の上金型（以下、上型と記す） 、（２＋は上記上型ｉ
ｌ＋と一対の下金型（以下、下型と記す）、（３）は上
型（１１が取付けられた上プラテン、（４）は下型（２
）が取付られた下プラテン、（５）は上プラテン（３）
と連結され、固定された下プラテン（４）を摺動するタ
イバ、（６）はボールネジ、（７）はボールネジ（６）
ヘモータの動力を伝達する減速機、（８）はボールネジ
（６）のナツト、（９）はナンド（８）とタイバ（５）
を連結するホルダ、００）はタイバ（５）が摺動するガ
イド、Ｑｌｌは上型１１）と下型（２）の清掃を行なう
クリーナ、（２）は防塵カバー、α蜀は防塵カバー（２
）に取付けられた集塵ＩＩ（図示せず）に接続される集
塵機、圓はＩＰの流れが生ずる様に防塵カバー（２）の
前方に設けられた開口である。FIG. 2 is a diagram showing a conventional semiconductor manufacturing apparatus. In the figure, (1) is the upper mold (hereinafter referred to as the upper mold) of the molding die for sealing the semiconductor element, and (2+ is the upper mold). Above upper mold i
l+ and a pair of lower molds (hereinafter referred to as lower molds), (3) is the upper platen on which the upper mold (11 is attached), (4) is the lower mold (2
) is attached to the lower platen, (5) is the upper platen (3)
A tie bar that slides on the fixed lower platen (4), (6) is a ball screw, (7) is a ball screw (6)
The reducer that transmits the power of the motor, (8) is the nut of the ball screw (6), (9) is the Nand (8) and tie bar (5)
00) is the guide on which the tie bar (5) slides, Qll is the cleaner that cleans the upper mold 11) and the lower mold (2), (2) is the dust-proof cover, and αShu is the dust-proof cover (2).
) is an opening provided in front of the dust cover (2) to allow the flow of IP to occur.
次に動作について説明する。先ず、リードフレームと樹
脂タブレットがモールド金型へ供給される。ローダ（図
示せず）によるワークの供給後、プレスの駆動モータが
起動し、減速機（７）、ボールネジ（６）、ナンド（８
）、ホルダ（９）、タイバ（５）を介して、上プラテン
（３）が下降し、型締・加圧を行なう。型締後、モール
ド金型内へ樹脂タブレットを射出注入し、封止成形、及
びキュアを行う。キュア完了後、上プラテン（３）が上
昇し、アンローダ（図示せず）により成形品を取り出す
。成形品を取出した後、クリーナ０υにより、上型（１
）、下型（２）による封止成形時に発生ずる樹脂ハリの
除去の為、モールド金型のブラッシングを行なう。クリ
ーナによるモールド金型のブラッシング後、前方よりエ
アブロ−を行ない樹脂ハリを集塵ダクトα３）内へ吹き
飛ばす。このとき、集塵ダクト０３）に接続された集塵
機は常時吸引状態である為、防塵カバーα乃内は図中の
矢印方向にエアの流れを生じている。Next, the operation will be explained. First, a lead frame and a resin tablet are supplied to a mold. After the loader (not shown) supplies the workpiece, the drive motor of the press is started, and the drive motor of the press is started, and the reducer (7), the ball screw (6), and the NAND (8
), the holder (9), and the tie bar (5), the upper platen (3) is lowered to perform mold clamping and pressurization. After clamping, a resin tablet is injected into the mold, sealed and cured. After curing is completed, the upper platen (3) is raised and the molded product is taken out by an unloader (not shown). After removing the molded product, remove the upper mold (1
), the mold is brushed to remove the resin stagnation that occurs during sealing with the lower mold (2). After brushing the mold with the cleaner, air is blown from the front to blow away the resin sludge into the dust collection duct α3). At this time, since the dust collector connected to the dust collection duct 03) is always in a suction state, air flows inside the dust cover α in the direction of the arrow in the figure.
従来の半導体製造装置は以上の様に構成されているので
、集塵機の吸引能力と開口部の面積とによる防塵カバー
内のエアの流れの制御が困難で、特にエアブロ−時にエ
アの流れが乱れて塵埃の吸引、回収が不十分になるなど
の問題があった。Conventional semiconductor manufacturing equipment is configured as described above, so it is difficult to control the air flow inside the dust cover depending on the suction capacity of the dust collector and the area of the opening, and the air flow is disturbed especially during air blowing. There were problems such as insufficient suction and collection of dust.
この発明は上記の様な問題点を解消する為になされたも
ので、開口部の面積を安価で簡単に調整できる半導体製
造装置を得ることを目的とする。This invention was made to solve the above-mentioned problems, and an object thereof is to provide a semiconductor manufacturing apparatus in which the area of an opening can be easily adjusted at low cost.
この発明に係る半導体製造装置は位置調整のできるシャ
ッタを設け、開口部の面積を調整する様にしたものであ
る。A semiconductor manufacturing apparatus according to the present invention is provided with a shutter whose position can be adjusted, so that the area of the opening can be adjusted.
この発明に於ける半導体製造装置は、開口部の面積を調
整することにより、集塵機の吸引能力とのバランスを保
ち、エアの流れを制御する。The semiconductor manufacturing apparatus according to the present invention maintains a balance with the suction capacity of the dust collector and controls the flow of air by adjusting the area of the opening.
以下、この発明の一実施例を図について説明する。第１
図に於いて、α５）は上プラテン（３）に上下調整可能
に取付けられたシャッタである。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, α5) is a shutter attached to the upper platen (3) so as to be vertically adjustable.
その他の符号の説明は従来装置と同様につき説明を省略
する。Descriptions of other symbols are omitted as they are the same as in the conventional device.
基本的動作は従来と同様であるがシャッタα５）は上プ
ラテン（３）に取付けられている為、型締時には、開口
００部が小さくなり、エアブロ−を行なう型開時には開
口ａａ部が大きくなることになる。このとき、上プラテ
ン（３）へのシャッタ０５）の取付位置を上下調整して
、開口００部の面積を変化させることが出来る。The basic operation is the same as before, but since the shutter α5) is attached to the upper platen (3), the opening 00 becomes smaller when the mold is clamped, and the opening aa becomes larger when the mold is opened for air blowing. It turns out. At this time, the area of the opening 00 can be changed by vertically adjusting the mounting position of the shutter 05) on the upper platen (3).
尚、上記実施例では、上プラテン（３）にシャッタα５
）を設けたものを示したが、アクチュエータ等を用いて
も良い。In the above embodiment, the shutter α5 is attached to the upper platen (3).
), but an actuator or the like may also be used.
又、上記実施例では、半導体装置の樹脂封止装置の場合
についても説明したが、ダイボンダやワイヤボンダ等の
他の半導体装置の製造装置であっても良く、上記実施例
と同様の効果を奏する。Further, in the above embodiment, the case of a resin sealing device for a semiconductor device has been described, but other semiconductor device manufacturing devices such as a die bonder or a wire bonder may be used, and the same effects as in the above embodiment can be obtained.
以上の様に、この発明によれば、集塵機の吸引能力に合
わせて開口面積を任意に設定できる様に構成したので、
エアの流れの制御が安価で容易にでき、外部への発塵が
防止出来るものが得られる効果がある。As described above, according to the present invention, since the opening area can be set arbitrarily according to the suction capacity of the dust collector,
The effect is that air flow can be controlled easily and inexpensively, and that dust generation to the outside can be prevented.
第１図はこの発明の一実施例による半導体製造装置を示
す側面図、第２図は従来の半導体装置を示す側面図であ
る。
図中、（１）は上型、（２）は下型、（３）は上プラテ
ン、α５）はシャッタである。
尚、各図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a side view showing a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a side view showing a conventional semiconductor device. In the figure, (1) is an upper mold, (2) is a lower mold, (3) is an upper platen, and α5) is a shutter. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (2)
、又は樹脂封止する半導体製造装置に於いて、発塵部分
を防塵カバーで包囲し、且つ集塵装置で吸引すると共に
、上記防塵カバーの開口部面積をシャッタで増減するこ
とを特徴とする半導体製造装置。(1) In semiconductor manufacturing equipment in which semiconductor elements are bonded or resin-sealed on a lead frame, a dust-generating part is surrounded by a dust-proof cover, and a dust collector is used to suck it up, and the opening of the dust-proof cover is A semiconductor manufacturing device characterized by increasing/decreasing the area using a shutter.
ィングした後に樹脂封止する半導体製造装置に於いて、
樹脂封止金型周辺を防塵カバーで包囲し、且つ集塵装置
で吸引すると共に上記防塵カバーの開口部面積をシャッ
タで増減又は、開閉することを特徴とする半導体製造装
置。(2) In semiconductor manufacturing equipment that wire-bonds a semiconductor element onto a lead frame and then seals it with resin,
A semiconductor manufacturing apparatus characterized in that a resin-sealed mold is surrounded by a dust-proof cover, and a dust collector is used to suck the dust, and an opening area of the dust-proof cover is increased/decreased or opened/closed by a shutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30369087A JPH01144638A (en) | 1987-11-30 | 1987-11-30 | Manufacturing apparatus for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30369087A JPH01144638A (en) | 1987-11-30 | 1987-11-30 | Manufacturing apparatus for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01144638A true JPH01144638A (en) | 1989-06-06 |
Family
ID=17924068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30369087A Pending JPH01144638A (en) | 1987-11-30 | 1987-11-30 | Manufacturing apparatus for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01144638A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11069374B2 (en) | 2017-05-12 | 2021-07-20 | Nhk Spring Co., Ltd. | Method of restoring suspension of hard disk drive |
-
1987
- 1987-11-30 JP JP30369087A patent/JPH01144638A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11069374B2 (en) | 2017-05-12 | 2021-07-20 | Nhk Spring Co., Ltd. | Method of restoring suspension of hard disk drive |
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