JPH01143164A - Printed wiring board for surface mount - Google Patents
Printed wiring board for surface mountInfo
- Publication number
- JPH01143164A JPH01143164A JP62300999A JP30099987A JPH01143164A JP H01143164 A JPH01143164 A JP H01143164A JP 62300999 A JP62300999 A JP 62300999A JP 30099987 A JP30099987 A JP 30099987A JP H01143164 A JPH01143164 A JP H01143164A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- surface mount
- pattern
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント配線板に関し、特に表面実装部品を
塔載するためのパッドを有する表面実装用プリント配線
板に関するものであるヤ（従来の技術）
第２図に示すように、表面実装部品（ｃｌ）か搭載され
るプリント配線板には、前記（ｃｌ）の端子部をはんだ
付けするためのパッド（ｐｉ）（ｐ２）が形成される。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board, and particularly to a printed wiring board for surface mounting having pads for mounting surface mount components (compared to conventional printed wiring boards). Technology) As shown in Figure 2, pads (pi) (p2) for soldering the terminal portions of the (cl) are formed on the printed wiring board on which the surface mount components (cl) are mounted. .
又、パッドとパッドを電気的に接続して、部品間の電気
信号を伝えるために形成されるのが信号パターン（ｓＩ
）（ｓＺ）（ｓ３）である。それに対して、部品に電［
′ｉｌｔ圧を供給するために形成されるのか電源パター
ン（ｄｌ）（ｄ２）である。−船釣に電源パターンを流
れる電流は、信号パターンを流れる電流の千倍程度にも
達する。そのため電源パターンの幅はできるだけ太くす
ることで電気的損失を小さくするように設計される。又
、信号パターンは高密度な配線を実現するために細くな
る傾向にある。従って、前記表面実装部品用のバ・アト
には。Additionally, signal patterns (sI) are formed to electrically connect pads and transmit electrical signals between components.
)(sZ)(s3). On the other hand, parts are
The power supply patterns (dl) (d2) are formed to supply the 'ilt pressure. -The current that flows through the power supply pattern during boat fishing reaches about 1,000 times the current that flows through the signal pattern. Therefore, the width of the power supply pattern is designed to be as wide as possible to reduce electrical loss. Furthermore, signal patterns tend to become thinner in order to realize high-density wiring. Therefore, in the bar for the surface mount components.
第２図に示したように各種の太さのパターンか接続され
ることになる。As shown in FIG. 2, patterns of various thicknesses are connected.
（本発明か解決しようとする問題点）
ｔｔＳ３図の（ｃ）に二端子の表面実装部品の実装図を
示す。表面実装部品（ｃｌ）の端子（ｔｌ）（Ｌ２）は
、はんだ（ｈｌ）（ｈｌ）によってパッド（ｐｌ）（ｐ
ｌ）と接合され−Ｃいる。−船釣に表面実装部品（ｃｌ
）のはんだ付けは、ペースト状のはんだをパッド（ｐｌ
）（ｐｌ）上に塗布し、その上に表面実装部品（ｃｌ）
をのせ、赤外線ビーム等でパッドとはんだを加熱するこ
とによって、はんだをリフローさせ、表面実装部品の端
子（ｔｌ）（ｔ２）とパッド（ｐｌ）（ｐｌ）を接合す
る方法を取っている。しかしながらこの方法では、第３
図（ｂ）に示したように、パッド（ｐｌ）の接続パター
ンが電源パターンでありパッド（ｐｌ）の接続パターン
か信号パターンである場合には、パッドからｔａ続パタ
ーンへ逃げる８暦がパッド（ｐｌ）よりパッド（ｐｌ）
の方か大きくなる。従ってパッドの温度り昇時間に差か
生じて、はんだ（ｈｌ）よりはんだ（ｈｌ）の方が先に
リフローすることになる。その結果第３図（、ｌ）に示
した様に、はんだ（ｈｌ）の表面張力で表面実装部品か
引っ張られて立ってしまうツームストーン現象か起こり
問題となっていた。(Problems to be Solved by the Invention) Figure ttS3 (c) shows a mounting diagram of a two-terminal surface mount component. The terminal (tl) (L2) of the surface mount component (cl) is connected to the pad (pl) (p
l) and -C. -Surface mount parts (cl) for boat fishing
), apply paste solder to the pad (pl
) (pl) and surface mount components (cl) on top of it.
A method is used in which the terminals (tl) (t2) of the surface mount component and the pads (pl) (pl) are bonded by reflowing the solder by heating the pad and solder with an infrared beam or the like. However, in this method, the third
As shown in figure (b), when the connection pattern of the pad (pl) is a power supply pattern and the connection pattern of the pad (pl) is a signal pattern, the 8 calendars that escape from the pad to the ta continuation pattern are the pad ( pad(pl) from pl)
It gets bigger. Therefore, there is a difference in the temperature rise time of the pad, and the solder (hl) reflows earlier than the solder (hl). As a result, as shown in FIG. 3 (1), a tombstone phenomenon occurred in which the surface mount components were pulled and stood up due to the surface tension of the solder (hl), which caused a problem.
（問題点を解決するための手段及び作用）以上の問題点
を解決するために本発明か採った手段は、互いに対向す
る一対のパッドの少なくとも−・方のパッドが電源用パ
ターンに接続されており、前記一対のパッドに表面実装
部品の二つの端子をはんだによって接続する表面実装用
プリント配線板において、前記ＴｒＬ源用パターンに接
続されるべきパッドを、このパッドの幅よりも細い接続
パターンによって接続することによって、はんだ付は時
にパッドから接続パターンへ逃げる熱量を抑え、はんだ
リフローの時間を均一にして、ツームストーン現象を抑
えようというものである。(Means and effects for solving the problems) The means taken by the present invention to solve the above problems is that at least one pad of a pair of pads facing each other is connected to a power supply pattern. In a surface mount printed wiring board in which two terminals of a surface mount component are connected to the pair of pads by solder, the pad to be connected to the TrL source pattern is connected by a connection pattern narrower than the width of the pad. By connecting, soldering is sometimes done to reduce the amount of heat escaping from the pad to the connection pattern, equalize the solder reflow time, and reduce tombstoning.
なお、前記表面実装部品用の一対のパッドは一般的に同
し面積を有しているか、［−述の接続パターンの種類に
関係なく１例えば一方のパッドかもう一方のバー）１−
の二倍以北もの面積を有しているような場合には、パッ
ド自体の温度１昇時間に差異か生じるため１本発明によ
ってもツームストーン現象か生じることかある。It should be noted that the pair of pads for the surface mount component generally have the same area, or [- regardless of the type of connection pattern mentioned above, e.g. one pad or the other bar]1-
If the pad has an area more than twice as large as the pad itself, the tombstone phenomenon may occur even with the present invention because there will be a difference in the time it takes for the temperature of the pad itself to rise.
（χ雄側）
第４図（ａ）〜（ｃ）に本発明の実施例を示す。いずれ
も、表面実装部品用パッドと電源パターンとの接続例で
あり、表面実装部品用パッドの幅よりも細い接続パター
ンにより接続されている。（ａ）はパッド（ｐｌ）の片
側で電源パターン（ｄｌ）と接続する場合を、（ｄ）は
パッド（ｐｌ）か電源パターン（ｄｌ）によって囲まれ
る場合を、ヌ（Ｃ）はパッドの形状か大きくなって複数
の接続パターンを有する場合の実施例である。(χ Male side) Examples of the present invention are shown in FIGS. 4(a) to 4(c). All of these are examples of connections between pads for surface mount components and power supply patterns, and are connected by connection patterns that are narrower than the width of the pads for surface mount components. (a) shows the case where the pad (pl) is connected to the power supply pattern (dl) on one side, (d) shows the case where it is surrounded by the pad (pl) or the power supply pattern (dl), and (C) shows the shape of the pad. This is an example in which the number of connection patterns becomes larger and has a plurality of connection patterns.
（発ＩＪＩの効果）
本発明の表面実装用プリント配線数は１表面実装部品の
実装時におきる表面実装部品用パッドから接続パターン
への熱の流れを抑え、はんだリフローの時間を均一にす
ることにより、ツームストーン現象を抑えることがてき
るものである。(Effects of IJI generation) The number of printed wiring lines for surface mount of the present invention is reduced by suppressing the flow of heat from the pad for surface mount components to the connection pattern that occurs when mounting surface mount components, and by making the solder reflow time uniform. , which can suppress the tombstone phenomenon.
第１ Ｔｈｅは本発明の代表的な実施例を示す部分平面
図２第２図は従来の表面実装用プリント配線板のパター
ン例を示す部分モ面図、第３図の（ａ）（ｂ）、（ｃ）
及び（ｄ）のそれぞれは従来の表面実装部品の実装時に
おけるツームストーン現象を説明する部分平面］Ａ及び
部分ｗｔＦｌｉ而図であ面。
また、第４図の（ａ）、（ｂ）及び（Ｃ）のそれぞれは
本発明の他の実施例を示す部分平面図である。
符 号 の 説 明
ｃｌ〜ｃ３・・・表面実装部品、ｐ１〜ｐ１・−・表面
実装部品用パッド、Ｓ１〜Ｓ３・・・信号パターン、
ｄｌ〜ｄ ２−・・電源パターン、ｈｌ〜ｈ２・−７１
を源接続用スルーホール。1. The is a partial plan view showing a typical embodiment of the present invention. 2. FIG. 2 is a partial plan view showing an example of a pattern of a conventional printed wiring board for surface mounting. ,(c)
and (d) are partial planes A and WtFli diagrams respectively explaining the tombstone phenomenon during mounting of conventional surface mount components. 4A, 4B, and 4C are partial plan views showing other embodiments of the present invention. Explanation of symbols cl to c3...Surface mount components, p1 to p1...Pads for surface mount components, S1 to S3...Signal patterns,
dl~d2-...Power supply pattern, hl~h2・-71
Through-hole for source connection.
Claims (1)
ドが電源用パターンに接続されており、前記一対のパッ
ドに表面実装部品の二つの端子をはんだによって接続す
る表面実装用プリント配線板において、前記電源用パタ
ーンに接続されるべきパッドを、このパッドの幅よりも
細い接続パターンによって接続したことを特徴とする表
面実装用プリント配線板。In a surface mounting printed wiring board in which at least one pad of a pair of pads facing each other is connected to a power supply pattern, and two terminals of a surface mount component are connected to the pair of pads by solder, the power supply pattern A printed wiring board for surface mounting, characterized in that a pad to be connected to the pad is connected by a connection pattern narrower than the width of the pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62300999A JPH01143164A (en) | 1987-11-27 | 1987-11-27 | Printed wiring board for surface mount |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62300999A JPH01143164A (en) | 1987-11-27 | 1987-11-27 | Printed wiring board for surface mount |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143164A true JPH01143164A (en) | 1989-06-05 |
Family
ID=17891609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62300999A Pending JPH01143164A (en) | 1987-11-27 | 1987-11-27 | Printed wiring board for surface mount |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143164A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243714A (en) * | 1992-03-02 | 1993-09-21 | Casio Comput Co Ltd | Film wiring board and its manufacture |
| WO1998033365A1 (en) * | 1997-01-28 | 1998-07-30 | Telefonaktiebolaget Lm Ericsson (Publ) | A circuit board assembly having surface-mount radio frequency components |
| WO1999059387A1 (en) * | 1998-05-08 | 1999-11-18 | Nokia Networks Oy | A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| JP2013074156A (en) * | 2011-09-28 | 2013-04-22 | Denso Corp | Electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858379B2 (en) * | 1975-07-14 | 1983-12-24 | 旭化成株式会社 | Flame retardant polyester composition |
| JPS6146766B2 (en) * | 1981-12-28 | 1986-10-16 | Komatsu Mfg Co Ltd |
-
1987
- 1987-11-27 JP JP62300999A patent/JPH01143164A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858379B2 (en) * | 1975-07-14 | 1983-12-24 | 旭化成株式会社 | Flame retardant polyester composition |
| JPS6146766B2 (en) * | 1981-12-28 | 1986-10-16 | Komatsu Mfg Co Ltd |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243714A (en) * | 1992-03-02 | 1993-09-21 | Casio Comput Co Ltd | Film wiring board and its manufacture |
| WO1998033365A1 (en) * | 1997-01-28 | 1998-07-30 | Telefonaktiebolaget Lm Ericsson (Publ) | A circuit board assembly having surface-mount radio frequency components |
| WO1999059387A1 (en) * | 1998-05-08 | 1999-11-18 | Nokia Networks Oy | A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| JP2013074156A (en) * | 2011-09-28 | 2013-04-22 | Denso Corp | Electronic device |
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