JPH01142877U - - Google Patents
Info
- Publication number
- JPH01142877U JPH01142877U JP4014788U JP4014788U JPH01142877U JP H01142877 U JPH01142877 U JP H01142877U JP 4014788 U JP4014788 U JP 4014788U JP 4014788 U JP4014788 U JP 4014788U JP H01142877 U JPH01142877 U JP H01142877U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- resin molded
- lead
- electrode
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図は本考案の一実施例にかかる半導体検査
装置の分解斜視図、第２図は同実施例の―断
面図、第３図は従来の半導体検査装置の分解斜視
図である。
１……半導体装置、１ａ……樹脂モールド部、
２，３，４……リード、２ａ，３ａ，４ａ……折
曲部、２ａ，３ｂ，４ｂ……根本部、５……溝部
、６……カバー、７……電極、８……電極、９，
９……電極。
FIG. 1 is an exploded perspective view of a semiconductor testing device according to an embodiment of the present invention, FIG. 2 is a sectional view of the same embodiment, and FIG. 3 is an exploded perspective view of a conventional semiconductor testing device. 1...Semiconductor device, 1a...Resin mold part,
2, 3, 4... Lead, 2a, 3a, 4a... Bent part, 2a, 3b, 4b... Root part, 5... Groove, 6... Cover, 7... Electrode, 8... Electrode, 9,
9...Electrode.
Claims (1)
電気的特性検査を行う半導体検査装置において、 少なくとも上記半導体装置の樹脂モールド部か
ら延びる各リードの根本部に接触する電極を具備
してなる半導体検査装置。[Claims for Utility Model Registration] A semiconductor testing device that tests electrical characteristics through each lead of a resin molded semiconductor device, at least an electrode that contacts the base of each lead extending from the resin molded portion of the semiconductor device. A semiconductor inspection device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4014788U JPH01142877U (en) | 1988-03-25 | 1988-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4014788U JPH01142877U (en) | 1988-03-25 | 1988-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01142877U true JPH01142877U (en) | 1989-09-29 |
Family
ID=31266622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4014788U Pending JPH01142877U (en) | 1988-03-25 | 1988-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01142877U (en) |
-
1988
- 1988-03-25 JP JP4014788U patent/JPH01142877U/ja active Pending