JPH01142427U - - Google Patents
Info
- Publication number
- JPH01142427U JPH01142427U JP1988039475U JP3947588U JPH01142427U JP H01142427 U JPH01142427 U JP H01142427U JP 1988039475 U JP1988039475 U JP 1988039475U JP 3947588 U JP3947588 U JP 3947588U JP H01142427 U JPH01142427 U JP H01142427U
- Authority
- JP
- Japan
- Prior art keywords
- semi
- adhesive layer
- cured adhesive
- base material
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 2
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988039475U JPH0343217Y2 (US20080094685A1-20080424-C00004.png) | 1988-03-25 | 1988-03-25 | |
| GB8904802A GB2216435A (en) | 1988-03-25 | 1989-03-02 | Prepreg sheet |
| EP89302115A EP0334499A3 (en) | 1988-03-25 | 1989-03-02 | A prepreg sheet |
| AU31302/89A AU3130289A (en) | 1988-03-25 | 1989-03-14 | A prepreg sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988039475U JPH0343217Y2 (US20080094685A1-20080424-C00004.png) | 1988-03-25 | 1988-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01142427U true JPH01142427U (US20080094685A1-20080424-C00004.png) | 1989-09-29 |
| JPH0343217Y2 JPH0343217Y2 (US20080094685A1-20080424-C00004.png) | 1991-09-10 |
Family
ID=12554090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988039475U Expired JPH0343217Y2 (US20080094685A1-20080424-C00004.png) | 1988-03-25 | 1988-03-25 |
Country Status (4)
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT400550B (de) * | 1992-05-15 | 1996-01-25 | Isovolta | Komprimierbares prepreg auf der basis von mit duromeren kunstharzen imprägnierten flächigen trägermaterialien, ein verfahren zu dessen herstellung sowie dessen verwendung |
| EP1220586A3 (en) * | 2000-12-28 | 2004-05-12 | Nitto Denko Corporation | Wiring board prepreg and manufacturing method thereof |
| US6500529B1 (en) | 2001-09-14 | 2002-12-31 | Tonoga, Ltd. | Low signal loss bonding ply for multilayer circuit boards |
| US6783841B2 (en) | 2001-09-14 | 2004-08-31 | Tonoga, Inc. | Low signal loss bonding ply for multilayer circuit boards |
| GB2475352B8 (en) | 2009-12-14 | 2012-10-03 | Gurit Ltd | Repair of composite materials. |
| GB2475428B (en) * | 2009-12-14 | 2012-02-15 | Gurit Uk Ltd | Repair of composite materials |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1186218A (en) * | 1966-06-08 | 1970-04-02 | Dynamit Nobel Ag | Improvements in or relating to Printed Circuits. |
| US4024305A (en) * | 1975-06-04 | 1977-05-17 | International Business Machines Corporation | Method for producing a resin rich epoxy prepreg and laminate |
| JPS5628215A (en) * | 1979-08-17 | 1981-03-19 | Hitachi Chem Co Ltd | Preparation of imide prepolymer |
| JPS59101359A (ja) * | 1982-12-02 | 1984-06-11 | 日本発条株式会社 | Ｆｒｐ板およびその製造方法 |
| US4680220A (en) * | 1985-02-26 | 1987-07-14 | W. L. Gore & Associates, Inc. | Dielectric materials |
| US4772509A (en) * | 1987-04-13 | 1988-09-20 | Japan Gore-Tex, Inc. | Printed circuit board base material |
-
1988
- 1988-03-25 JP JP1988039475U patent/JPH0343217Y2/ja not_active Expired
-
1989
- 1989-03-02 EP EP89302115A patent/EP0334499A3/en not_active Withdrawn
- 1989-03-02 GB GB8904802A patent/GB2216435A/en not_active Withdrawn
- 1989-03-14 AU AU31302/89A patent/AU3130289A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP0334499A2 (en) | 1989-09-27 |
| AU3130289A (en) | 1989-09-28 |
| GB8904802D0 (en) | 1989-04-12 |
| JPH0343217Y2 (US20080094685A1-20080424-C00004.png) | 1991-09-10 |
| GB2216435A (en) | 1989-10-11 |
| EP0334499A3 (en) | 1990-05-23 |
