JPH01142165A - Siding board - Google Patents
Siding boardInfo
- Publication number
- JPH01142165A JPH01142165A JP30104787A JP30104787A JPH01142165A JP H01142165 A JPH01142165 A JP H01142165A JP 30104787 A JP30104787 A JP 30104787A JP 30104787 A JP30104787 A JP 30104787A JP H01142165 A JPH01142165 A JP H01142165A
- Authority
- JP
- Japan
- Prior art keywords
- board
- siding board
- backing material
- backing
- core material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 67
- 239000011162 core material Substances 0.000 claims abstract description 19
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 9
- 239000000057 synthetic resin Substances 0.000 claims abstract description 9
- 239000006260 foam Substances 0.000 claims description 10
- 238000005187 foaming Methods 0.000 abstract description 2
- 230000008602 contraction Effects 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- FJMNNXLGOUYVHO-UHFFFAOYSA-N aluminum zinc Chemical compound [Al].[Zn] FJMNNXLGOUYVHO-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229910001562 pearlite Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- NVIFVTYDZMXWGX-UHFFFAOYSA-N sodium metaborate Chemical compound [Na+].[O-]B=O NVIFVTYDZMXWGX-UHFFFAOYSA-N 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Finishing Walls (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は建築、構築物の内、外装材に用いられるサイデ
ィングボードに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a siding board used as an exterior material for buildings and structures.
一般に、建築、構築物の内、外装材として軽量で断熱性
を有するサイディングボードが多く用いられている。こ
のサイディングボードは、金属薄板、プラスチックを断
面略樋状に成形して表面材とし、この表面材の裏面（樋
状部分）に合成樹脂発泡体等の芯材を充填し、芯材の裏
面にシート状物等の裏面材を積層し一体化したものであ
った。Generally, siding boards, which are lightweight and have heat insulating properties, are often used as exterior materials in buildings and structures. This siding board is made by forming a thin metal plate or plastic into a roughly gutter-shaped cross section as the surface material, filling the back side of this surface material (gutter-shaped part) with a core material such as synthetic resin foam, and filling the back side of the core material with It was made by laminating and integrating backing materials such as sheet-like materials.
しかしながら、この種サイディングボードは、表面材、
芯材、裏面材という異なる材質の積層体であり、各々の
伸縮度合の違いによりサイディングボード全体の変形を
招く欠点があった。特にこの現象は裏面材の温度、湿度
による伸縮に起因することが大である。すなわち、芯材
として用いる合成樹脂発泡体はクツション性があるため
、その伸縮は自分自身で吸収し、サイディングボード全
体の変形まで敗らないが、裏面材の伸縮、特に収縮は表
面材に直接的に影響し、凸反りとなる欠点があった。However, this type of siding board has a surface material,
The siding board is a laminate made of different materials, a core material and a backing material, and has the disadvantage that the difference in the degree of expansion and contraction of each material causes deformation of the entire siding board. In particular, this phenomenon is largely due to expansion and contraction of the backing material due to temperature and humidity. In other words, since the synthetic resin foam used as the core material has cushioning properties, it absorbs its expansion and contraction by itself and does not cause deformation of the entire siding board, but the expansion and contraction of the backing material, especially the contraction, is directly affected by the surface material. This had the disadvantage of affecting the surface area and causing convex warpage.
Ｃ問題点を解決するための手段〕
本発明はこのような欠点を除去するため、サイディング
ボードの裏面材としてエンボス加工を施したものを用い
ることにより、裏面材の伸縮をエンボス模様の凹凸によ
って吸収し、サイディングボード全体の変形を防止する
と共に、サイディングボード裏面の意匠性を向上し、か
つ、芯材と裏面材の接着強度を強化したサイディングボ
ードを提案するものである。Means for Solving Problem C] In order to eliminate such drawbacks, the present invention uses an embossed material as the backing material of the siding board, so that the expansion and contraction of the backing material is absorbed by the unevenness of the embossed pattern. The present invention proposes a siding board that prevents deformation of the entire siding board, improves the design of the back surface of the siding board, and strengthens the adhesive strength between the core material and the back material.
以下に図面を用いて本発明に係るサイディングボード（
以下、単にボードという）について詳細に説明する。す
なわち第１図は上記ボードＡの代表的一実施例であり、
１は表面材で例えば表面処理鋼板、鋼板に亜鉛・ニッケ
ル合金をメツキした鋼板、アルミ・亜鉛合金メツキ鋼板
（商品名ガルファン、ガルバリウム鋼板、スーパージン
ク）、アルミニウム板、アルミニウム合金板、銅板等の
金属薄板、または合成樹脂板の１種がらなり、この板材
をロール成形、プレス、押し出し、引き抜き、射出成形
等により断面を略樋状に成形したものである。なお、表
面材１の素材としては平板、エンボス加工されたものの
いずれでもよいものである。さらに説明を加えると、第
１図におけるボードＡでは、表面材１は略樋状部に成形
した化粧面２の両側縁に雄型連結部３、雌型連結部４を
形成し、ボードＡを施工する際、雄、雌型連結部３．４
を嵌合、係止することにより壁体を構成するものである
。５は芯材であり、少なくとも表面材ｌに充填し、主に
断熱材として機能するものである。The siding board according to the present invention (
(hereinafter simply referred to as the board) will be explained in detail. That is, FIG. 1 is a typical embodiment of the above board A,
1 is a surface material, such as a surface-treated steel plate, a steel plate plated with a zinc-nickel alloy, an aluminum-zinc alloy plated steel plate (product name Galfan, Galvalume steel plate, Super Zinc), an aluminum plate, an aluminum alloy plate, a copper plate, etc. It is made of one type of thin plate or synthetic resin plate, and is formed into a generally gutter-like cross section by roll forming, pressing, extrusion, drawing, injection molding, etc. The material for the surface material 1 may be either a flat plate or an embossed material. To explain further, in the board A shown in FIG. When installing, connect the male and female joints 3.4
The wall body is constructed by fitting and locking the two. 5 is a core material, which is filled in at least the surface material 1 and mainly functions as a heat insulating material.
その素材としてはポリウレタンフォーム、ポリイソシア
ヌレートフオーム、ポリウレアフオーム、ポリスチレン
フオーム、フェノールフオーム、ポリイミドフオーム等
の合成樹脂発泡体を主材料とし、必要に応じて、これに
難燃剤、難燃助剤（硼砂、メタ硼酸ソーダ、三酸化アン
チモン、炭酸カルシウム、水酸化アルミニウム）、ベン
トナイト、パーライト粒、シラスバルーンの１種以上を
添加したものなどからなるものである。また６は裏面材
で芯材５の裏面を被覆し、ボードＡを積層体とすること
により機械強度を向上すると共に、芯材５の耐候性を向
上するものである。その素材としては例えば、アスベス
ト紙、クラフト紙、アスファルトフェルト、金属板、金
属箔（Ａ Ｉｔ ％ Ｐｅ、Ｐｂ５Ｃｕ） 、合成樹脂
シート、ゴムシート、布シート、石膏紙、水酸化アルミ
紙、ガラス繊維不織布等の１種、または２種以上をラミ
ネートしたシート状物からなるものである。さらに説明
を加えると、裏面材６は、例えばスタッコ模様、木肌模
様、ドドメ模様、クレータ−模様等のエンボス模様７を
施したものである。このエンボス模様７は凸部１ａｓ凹
部７ｂよりなり、ボードＡの裏面の意匠性を向上し、か
つ、裏面材６の伸縮をボードＡ全体にまで及ばないよう
にすることができる。すなわちエンボス模様７は、第２
図（ａ）、（ｂ）に概念を示すように、裏面材６が収縮
した際、（ａ）図に示すようにエンボス模様７の凸部７
ａが破線から実線の位置に変化し、裏面材６全体の幅を
変化させないようにする。また裏面材６が膨張した際は
山）図に示すようにエンボス模様７が破線から実線の位
置に変化し、裏面材６の全体の幅に変化をさせないよう
にする。すなわち、エンボス模様７は裏面材６の温度、
湿度等による伸縮を吸収し、ボードＡの変化を阻止する
のに役立つものである。さらにエンボス模様７は、芯材
５と裏面材６の接触面積を太き（すると共に、凹凸によ
るアンカー効果により接着強度を強化するのに役立ち、
また、ボードＡの積層複合強度を強化するのにも役立つ
ものである。しかも、裏面材６は、芯材５を表面材ｌと
裏面材６間で芯材５である合成樹脂発泡体の原料をバッ
チ方式、連続ライン方式等で反応、発泡、成形する際の
離型材としても機能するものである。Its main material is synthetic resin foam such as polyurethane foam, polyisocyanurate foam, polyurea foam, polystyrene foam, phenol foam, polyimide foam, etc., and flame retardants and flame retardant aids (borax) are used as necessary. , sodium metaborate, antimony trioxide, calcium carbonate, aluminum hydroxide), bentonite, pearlite grains, and shirasu balloons. In addition, 6 covers the back surface of the core material 5 with a back material and makes the board A a laminate to improve the mechanical strength and the weather resistance of the core material 5. The materials include, for example, asbestos paper, kraft paper, asphalt felt, metal plate, metal foil (A It % Pe, Pb5Cu), synthetic resin sheet, rubber sheet, cloth sheet, gypsum paper, aluminum hydroxide paper, glass fiber nonwoven fabric. It consists of a sheet-like material laminated with one or more of the following. To explain further, the back material 6 has an embossed pattern 7 such as a stucco pattern, a wood pattern, a dome pattern, a crater pattern, etc., for example. This embossed pattern 7 is composed of convex portions 1as and concave portions 7b, and can improve the design of the back surface of the board A, and can prevent the expansion and contraction of the back material 6 from extending to the entire board A. In other words, the embossed pattern 7 is
As conceptually shown in Figures (a) and (b), when the back material 6 contracts, the convex portions 7 of the embossed pattern 7 as shown in Figure (a)
a changes from the position of the broken line to the position of the solid line, so that the width of the entire back material 6 does not change. Furthermore, when the backing material 6 expands, the embossed pattern 7 changes from the broken line to the solid line as shown in the figure, so that the overall width of the backing material 6 does not change. That is, the embossed pattern 7 has a temperature of the back material 6,
This serves to absorb expansion and contraction due to humidity, etc., and prevent board A from changing. Furthermore, the embossed pattern 7 thickens the contact area between the core material 5 and the back material 6 (and also serves to strengthen the adhesive strength due to the anchor effect of the unevenness).
It also helps to strengthen the laminated composite strength of board A. In addition, the back material 6 is a mold release material used when reacting, foaming, and molding the raw material of the synthetic resin foam that is the core material 5 between the surface material 1 and the back material 6 in a batch method, continuous line method, etc. It also functions as
以上説明したのは本発明に係るボードＡの一実施例にす
ぎず、第３図（ＩＩ）〜（０）〜第７図（ａ）〜（Ｃ１
に示すように形成することもできる。すなわち第３図（
ａ） 〜（０）、第４図（ａ） 〜（Ｚ）は表面材ｌの
変形例であり、第３図（ａ）〜（０）は化粧面２の変形
例であり、意匠性、デザイン性の向上を図るため任意に
成形したものであり、また第４図（ａ）〜（１）は雄、
雌型連結部３．４の変形例である。また第５図（ａ）〜
（ｆ）は芯材５の変形例であり、特に（ａ）〜（ｄ）は
芯材５を表面材１の樋状部分以外にも充填したボードＡ
である。さらに第６図（ａｌ〜（０）は裏面材６の配役
状態を説明するものであり、（ａ）図は裏面材６の少な
くとも一端縁を芯材５と表面材１との中間に位置するよ
うにしたボードＡ、（ｂ）図は裏面材６の少なくとも一
端縁を表面材１で挟持したボードＡ、（０１図は裏面材
６の端縁を表面材１の端縁より突出させたボードＡであ
る。さらに第７図（ａｌ〜（Ｃ）は裏面材６に孔７ｃを
形成したものであり、芯材５である合成樹脂発泡体が発
泡、硬化する際の、余剰の発泡剤によるガス、あるいは
合成樹脂発泡体を吐出、または裏面材６を積層する際に
、芯材５中に巻き込まれた空気を孔７ｃより外部へ放出
することもできる。なお、第３図（ａ）〜（０）〜第６
図（ａ）〜（Ｃ）ではエンボス模様７を省略して示して
いる。勿論、第３図（ａ）〜（０）〜第７図（ａ）〜（
Ｃ）を各々組み合わせたボードＡとすることもできる。What has been described above is only one embodiment of the board A according to the present invention, and FIGS. 3(II) to (0) to FIGS. 7(a) to (C1
It can also be formed as shown in FIG. In other words, Figure 3 (
a) to (0) and FIG. 4(a) to (Z) are modified examples of the surface material 1, and FIG. 3(a) to (0) are modified examples of the decorative surface 2, and the designability, They are arbitrarily shaped to improve the design, and Figures 4 (a) to (1) are male,
This is a modification of the female coupling part 3.4. Also, Figure 5(a)~
(f) is a modified example of the core material 5, and in particular (a) to (d) are board A in which the core material 5 is filled in areas other than the gutter-shaped portion of the surface material 1.
It is. Further, FIGS. 6(al to (0)) are for explaining the placement state of the backing material 6, and FIG. (B) shows a board A in which at least one edge of the back material 6 is sandwiched between the surface materials 1, (Fig. 01 shows a board in which the edge of the back material 6 protrudes from the edge of the surface material 1. A.Furthermore, FIGS. 7A to 7C show holes 7c formed in the backing material 6. When discharging gas or synthetic resin foam or laminating the backing material 6, the air caught in the core material 5 can also be released to the outside through the holes 7c. (0)~6th
In Figures (a) to (C), the embossed pattern 7 is omitted. Of course, Fig. 3(a) to (0) to Fig. 7(a) to (
Board A may be a combination of C).
上述したように本発明に係るボードによれば、■裏面材
のエンボス模様が裏面材の伸縮を吸収するためボードの
変形がない、■裏面材のエンボス模様により裏面材と芯
材の接着強度が向上し、ボード全体の積層複合強度が向
上する。■ボードの裏面の意匠性が向上する。等の効果
、特徴がある。As mentioned above, according to the board according to the present invention, the embossed pattern on the backing material absorbs the expansion and contraction of the backing material, so the board does not deform; and the embossed pattern on the backing material increases the adhesive strength between the backing material and the core material. This improves the laminated composite strength of the entire board. ■Improves the design of the back side of the board. It has the following effects and characteristics.
第１図は本発明に係るサイディングボードの一実施例を
示す斜視図、第２図（ａ）、（ｂｌはエンボス模様の一
機能を説明する説明図、第３図（ａ）〜（０）、第４図
（ａｌ 〜＜１）、第５図（ａｌ 〜（ｆ）、第６図（
ａ） 〜（Ｃ）、第７図（ａ）〜（Ｃ１はその他の実施
例を示す説明図である。
Ａ・・・サイディングボード、１・・・表面材、５・・
・芯材、６・・・裏面材、７・・・エンボス模様。
第１ｒＸＪ
（Ａ
（幻 （ｂ）第
３図
第３図
第３図
（ｍｌ
（へ
第十図
ｒα）
第十図
第Ｓ図
第６図
（α）
Ａ
’Ｉｃ ’７
（Ｃ）
６ ＼
図
（しンFIG. 1 is a perspective view showing an embodiment of the siding board according to the present invention, FIGS. 2(a) and (bl are explanatory views explaining one function of the embossed pattern, and FIGS. 3(a) to (0)) , Fig. 4 (al ~<1), Fig. 5 (al ~ (f), Fig. 6 (
a) - (C), Fig. 7 (a) - (C1 is an explanatory diagram showing other embodiments. A... Siding board, 1... Surface material, 5...
- Core material, 6... Back material, 7... Embossed pattern. 1r (Shin
Claims (1)
くとも樋状部分に充填した合成樹脂発泡体からなる芯材
と、該芯材の裏面を被覆したシート状物からなる裏面材
とから構成したサイディングボードにおいて、前記裏面
材にエンボス加工を施していることを特徴とするサイデ
ィングボード。(1) A surface material formed into a substantially gutter-shaped cross section, a core material made of a synthetic resin foam filled in at least the gutter-shaped portion of the surface material, and a back material made of a sheet-like material covering the back surface of the core material. What is claimed is: 1. A siding board comprising: a siding board comprising: a siding board, wherein the back material is embossed;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62301047A JPH0754042B2 (en) | 1987-11-27 | 1987-11-27 | Siding board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62301047A JPH0754042B2 (en) | 1987-11-27 | 1987-11-27 | Siding board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01142165A true JPH01142165A (en) | 1989-06-05 |
| JPH0754042B2 JPH0754042B2 (en) | 1995-06-07 |
Family
ID=17892222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62301047A Expired - Fee Related JPH0754042B2 (en) | 1987-11-27 | 1987-11-27 | Siding board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0754042B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0437533A (en) * | 1990-06-02 | 1992-02-07 | Atsudo:Kk | Building material of panel for livestock barn |
| JPH055978U (en) * | 1991-07-08 | 1993-01-29 | 新星鋼業株式会社 | Siding material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS581535A (en) * | 1982-02-20 | 1983-01-06 | Takashi Ishikawa | Apparatus for preparing sandwitched panel |
| JPS58210250A (en) * | 1982-06-02 | 1983-12-07 | 村田 友昭 | Plate body for building |
| JPS61211451A (en) * | 1985-03-18 | 1986-09-19 | 株式会社アイジー技術研究所 | Siding board |
| JPS6216165A (en) * | 1985-07-15 | 1987-01-24 | Konishiroku Photo Ind Co Ltd | Image-supporting drum for thermal transfer |
-
1987
- 1987-11-27 JP JP62301047A patent/JPH0754042B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS581535A (en) * | 1982-02-20 | 1983-01-06 | Takashi Ishikawa | Apparatus for preparing sandwitched panel |
| JPS58210250A (en) * | 1982-06-02 | 1983-12-07 | 村田 友昭 | Plate body for building |
| JPS61211451A (en) * | 1985-03-18 | 1986-09-19 | 株式会社アイジー技術研究所 | Siding board |
| JPS6216165A (en) * | 1985-07-15 | 1987-01-24 | Konishiroku Photo Ind Co Ltd | Image-supporting drum for thermal transfer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0437533A (en) * | 1990-06-02 | 1992-02-07 | Atsudo:Kk | Building material of panel for livestock barn |
| JPH055978U (en) * | 1991-07-08 | 1993-01-29 | 新星鋼業株式会社 | Siding material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0754042B2 (en) | 1995-06-07 |
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| R250 | Receipt of annual fees |
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| R250 | Receipt of annual fees |
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| LAPS | Cancellation because of no payment of annual fees |