JPH01140846U - - Google Patents
Info
- Publication number
- JPH01140846U JPH01140846U JP3771788U JP3771788U JPH01140846U JP H01140846 U JPH01140846 U JP H01140846U JP 3771788 U JP3771788 U JP 3771788U JP 3771788 U JP3771788 U JP 3771788U JP H01140846 U JPH01140846 U JP H01140846U
- Authority
- JP
- Japan
- Prior art keywords
- package
- pins
- view
- dual
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009977 dual effect Effects 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3771788U JPH01140846U (me) | 1988-03-22 | 1988-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3771788U JPH01140846U (me) | 1988-03-22 | 1988-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140846U true JPH01140846U (me) | 1989-09-27 |
Family
ID=31264292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3771788U Pending JPH01140846U (me) | 1988-03-22 | 1988-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140846U (me) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010016289A (ja) * | 2008-07-07 | 2010-01-21 | Mitsubishi Electric Corp | 半導体パッケージおよび半導体装置 |
-
1988
- 1988-03-22 JP JP3771788U patent/JPH01140846U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010016289A (ja) * | 2008-07-07 | 2010-01-21 | Mitsubishi Electric Corp | 半導体パッケージおよび半導体装置 |