JPH01140049A - Inspecting apparatus for external appearance - Google Patents
Inspecting apparatus for external appearanceInfo
- Publication number
- JPH01140049A JPH01140049A JP62298658A JP29865887A JPH01140049A JP H01140049 A JPH01140049 A JP H01140049A JP 62298658 A JP62298658 A JP 62298658A JP 29865887 A JP29865887 A JP 29865887A JP H01140049 A JPH01140049 A JP H01140049A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- distance
- detector
- data
- distance detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims abstract description 12
- 238000005070 sampling Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 2
- 238000001514 detection method Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は集積回路(以下、ICと略す)パッケージの外
観検査に関し、特にリード形状の検査に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the visual inspection of integrated circuit (hereinafter abbreviated as IC) packages, and particularly to the inspection of lead shapes.
従来、この種のリード形状の検査では、第4図のように
IC2の上面から投光機1でリード2aの先端部付近に
投光し、IC2の下面の受光機3で受光するという透過
形検出方法で、IC2を定速で移動しリード2aの有無
を時間的変化でとらえ、処理部4で各リード2aの有無
の時間をリード幅又は、リード間隔に換算してリードの
ピッチ方向のみの検査をしていた。Conventionally, this type of lead shape inspection has been carried out using a transmission method, in which light is emitted from the top surface of the IC 2 near the tip of the lead 2a using a projector 1, and the light is received by a receiver 3 on the bottom surface of the IC 2, as shown in FIG. In the detection method, the IC 2 is moved at a constant speed to detect the presence or absence of the lead 2a as a temporal change, and the processing unit 4 converts the presence or absence of each lead 2a into the lead width or lead interval and calculates only the pitch direction of the leads. I was doing an inspection.
上述した従来の検査方法では、リードのピッチ方向のみ
の検査しか行えず、リードの面方向の検査は別の検査方
法で行わなければならないという欠点があった。The above-described conventional inspection method has the disadvantage that it is possible to inspect only the pitch direction of the lead, and inspection in the planar direction of the lead must be performed using a different inspection method.
本発明の目的は前記問題点を解決した外観検査装置を提
供することにある。An object of the present invention is to provide an appearance inspection device that solves the above problems.
[発明の従来技術に対する相違点〕
上述した従来の検査装置に対し、本発明はリードのピッ
チ方向とリードの面方向の検査を同一の装置で実現でき
るという相違点を有する。[Differences between the Invention and the Prior Art] The present invention differs from the conventional inspection apparatus described above in that the inspection in the lead pitch direction and the lead surface direction can be performed using the same apparatus.
本発明は投光部と受光部が一体化された距離検出機と、
集積回路又は距離検出機を定速に移動させる機構と、集
積回路のリード面と距離検出機までの距離データを一定
時間間隔でサンプリングしそのデータを蓄える記憶部を
含む、そのデータを読みだし各リード幅、各リード間隔
及び各リードの幅の中心と距離検出機までの距離を求め
るための処理部とを有することを特徴とする外観検査装
置である。The present invention provides a distance detector in which a light emitting part and a light receiving part are integrated;
It includes a mechanism for moving the integrated circuit or the distance detector at a constant speed, and a storage section that samples distance data between the lead surface of the integrated circuit and the distance detector at regular time intervals and stores the data. This is an external appearance inspection device characterized by having a processing section for determining the lead width, the interval between each lead, and the distance between the center of the width of each lead and a distance detector.
以下、本発明の実施例を図により説明する。 Embodiments of the present invention will be described below with reference to the drawings.
(実施例1)
第1図において、本発明は、投光部と受光部が一体化さ
れた距離検出機5と、該距離検出機5をIC(集積回路
)2のリード28面に対し垂直に位置する位置機構6と
、IC2を定速に移動させる機構7と、ICのリード面
と距離検出機までの距離データを一定時間間隔でサンプ
リングしそのデータを蓄える記憶部を含み、そのデータ
を読みだし各リード幅、各リード間隔及び各リード幅の
中心と距離検出機までの距離を求めるための処理部4を
備えている。(Embodiment 1) In FIG. 1, the present invention includes a distance detector 5 in which a light emitter and a light receiver are integrated, and a distance detector 5 that is perpendicular to the surface of the lead 28 of an IC (integrated circuit) 2. It includes a positioning mechanism 6 located at , a mechanism 7 that moves the IC 2 at a constant speed, and a storage section that samples distance data between the IC lead surface and the distance detector at regular time intervals and stores the data. It is equipped with a processing section 4 for determining the width of each read lead, the interval between each lead, and the distance between the center of each lead width and the distance detector.
第1図は本発明の実施例1(フラットパッケージの場合
)の斜視図である。FIG. 1 is a perspective view of Embodiment 1 (in the case of a flat package) of the present invention.
今、距離検出機5の真下を定速で移動機構7が移動する
とする。このときのデータ採取に関し、IC2の各リー
ド2aを通過する時間に対し十分短い時間でサンプリン
グし距離検出機5下を移動機構7が通過し始め、通過し
終るまでのサンプリング時間に対する距離検出機5とリ
ード2a濠での距離データを処理部4に蓄える。Now, assume that the moving mechanism 7 moves directly below the distance detector 5 at a constant speed. Regarding data collection at this time, the distance detector 5 is sampled in a sufficiently short time compared to the time it takes to pass through each lead 2a of the IC 2, and the distance detector 5 is sampled for the sampling time from when the moving mechanism 7 starts passing under the distance detector 5 until it finishes passing. and distance data at the lead 2a moat are stored in the processing section 4.
次に、第2図(ICの側面図)を用いて検出方法を説明
する。Next, the detection method will be explained using FIG. 2 (side view of the IC).
まず距離検出機5とリード28面までの理想距離を予め
求めておきその値に対して上限及び下限を設定し、蓄え
られたデータを読みだし各距離データがその範囲内に入
っているか入っていないかを比較する。First, find the ideal distance between the distance detector 5 and the lead 28 surface in advance, set the upper and lower limits for that value, read out the stored data, and check whether each distance data is within the range. Compare to see if there are any.
入っているデータ領域はリード部で、入っていないデー
タ領域はリード間又はリード欠損部である。BASEは
距離検出機の基準位置を示す。The data area that contains the data is the lead part, and the data area that does not contain the data is between the leads or the lead missing part. BASE indicates the reference position of the distance detector.
今、距離検出機5が通過し始めたときからの距離データ
P□〜P4を順に調べてゆき、リード無しの状態からリ
ード有りの状態への変化点(TR,、TR,、TR,、
TR,)及びリード有りの状態からリード無しの状態へ
の変化点(TF、 、 TF、 、 TF3. TF4
)を求め、これヨリ各リード幅(wz 9wt tW3
tw4)及びリード間隔(Ql。Now, sequentially examine the distance data P□ to P4 from when the distance detector 5 started passing, and find the change point from the state without a lead to the state with a lead (TR,, TR,, TR, ,
TR, ) and the change point from the leaded state to the leadless state (TF, , TF, , TF3. TF4
), and each lead width (wz 9wt tW3
tw4) and lead spacing (Ql.
Q2. Q、 )を求める。Q2. Find Q, ).
リード幅及びリード間隔とサンプリング時間との相関を
予め求めておけば上記で求めたリード間隔(L 、Qz
、Qg )を予め設定しである規格と比較することに
より、リードのピッチ方向の検査ができる。If the correlation between the lead width, lead spacing, and sampling time is determined in advance, the lead spacing (L, Qz
, Qg) with a preset standard, the lead pitch direction can be inspected.
マタ、リード幅(す2.l’2 、l’3 、lI’4
)の中心に位置するデータ(I+1.H2,H3,H4
)を求め、予め設定しである規格と比較することにより
リードの面方向の検査ができる。Mata, lead width (S2.l'2, l'3, lI'4
) located at the center of the data (I+1.H2, H3, H4
) and compare it with a preset standard to inspect the surface direction of the lead.
(実施例2)
次に、実施例2として、第3図にデュアルインラインパ
ッケージに適用した例を示す。検出方法は上述と同様で
ある。(Example 2) Next, as Example 2, an example in which the present invention is applied to a dual in-line package is shown in FIG. The detection method is the same as described above.
尚、実施例ではIC2を定速に移動させたが、距離検出
機5を定速に移動させてもよい。In the embodiment, the IC 2 is moved at a constant speed, but the distance detector 5 may be moved at a constant speed.
以上説明したように本発明は、検出部に投光部と受光部
が一体化された距離検出機を使用することにより、リー
ドのピッチ方向とリードの面方向の検査を同一の装置で
同時にでき、従来の装置に比べ低価格で、シンプルな構
成で実現できる効果がある。As explained above, the present invention uses a distance detector in which a light emitting part and a light receiving part are integrated in the detection part, so that the pitch direction of the lead and the surface direction of the lead can be inspected simultaneously with the same device. , it has the advantage of being lower in price than conventional devices and can be achieved with a simple configuration.
第1図は本発明の実施例1の斜視図、第2図は本発明の
実施例1の側面図、第3図は本発明の実施例2の斜視図
、第4図は従来例の斜視図である。
2・・・集積回路 2a・・・リード4・・・
処理部 5・・・距離検出機7・・・移動機
構
BASE・・・距離検出機の基準位置
P、、P2.P、、P、・・・距離検出機と各リード間
隔部の距離データH,、H2,H,、H,・・・距離検
出機と各リード部の距離データLD1. LD2. L
D、 、 LD4・・・ICのリードTR1,TR,、
TR,、TR,・・・リード間隔部からリード部への変
化時間TFよ、TF、 、TF、 、TF4・・・リー
ド部からリード間隔部への変化時間w、 、w2.w、
、w、 ・・・リード部内の所要時間Q1. Q、
、 Q、・・・リード間隔部内の所要時間特許出願人
日本電気株式会社
代理人 弁理士菅野 中・′、ゲ
〜;−
第1図Fig. 1 is a perspective view of Embodiment 1 of the present invention, Fig. 2 is a side view of Embodiment 1 of the present invention, Fig. 3 is a perspective view of Embodiment 2 of the invention, and Fig. 4 is a perspective view of the conventional example. It is a diagram. 2...Integrated circuit 2a...Lead 4...
Processing unit 5...Distance detector 7...Movement mechanism BASE...Reference position P of distance detector,, P2. P,,P,...Distance data between the distance detector and each lead interval H,,H2,H,,H,...Distance data between the distance detector and each lead LD1. LD2. L
D, , LD4...IC leads TR1, TR,,
TR, , TR, . . . Change time from the lead interval portion to the lead portion TF, TF, , TF, , TF4 . . . Change time from the lead portion to the lead interval portion w, , w2. lol,
, w, . . . Required time in the lead section Q1. Q,
, Q, ... Required time within the lead spacing section Patent applicant
NEC Corporation Representative Patent Attorney Kanno Naka', Ge~;- Figure 1
Claims (1)
積回路又は距離検出機を定速に移動させる機構と、集積
回路のリード面と距離検出機までの距離データを一定時
間間隔でサンプリングしそのデータを蓄える記憶部を含
む、そのデータを読みだし各リード幅、各リード間隔及
び各リードの幅の中心と距離検出機までの距離を求める
ための処理部とを有することを特徴とする外観検査装置
。(1) A distance detector with an integrated light emitting part and a light receiving part, a mechanism for moving the integrated circuit or the distance detector at a constant speed, and distance data from the lead surface of the integrated circuit to the distance detector for a certain period of time. It includes a storage section for sampling at intervals and storing the data, and a processing section for reading out the data and determining the width of each lead, the interval between each lead, and the distance between the center of the width of each lead and the distance detector. Characteristic appearance inspection equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62298658A JPH01140049A (en) | 1987-11-26 | 1987-11-26 | Inspecting apparatus for external appearance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62298658A JPH01140049A (en) | 1987-11-26 | 1987-11-26 | Inspecting apparatus for external appearance |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01140049A true JPH01140049A (en) | 1989-06-01 |
Family
ID=17862588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62298658A Pending JPH01140049A (en) | 1987-11-26 | 1987-11-26 | Inspecting apparatus for external appearance |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01140049A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03189506A (en) * | 1989-12-19 | 1991-08-19 | Matsushita Electric Ind Co Ltd | Device and method for inspecting outward appearance of soldering state |
-
1987
- 1987-11-26 JP JP62298658A patent/JPH01140049A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03189506A (en) * | 1989-12-19 | 1991-08-19 | Matsushita Electric Ind Co Ltd | Device and method for inspecting outward appearance of soldering state |
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