JPH01139495U - - Google Patents
Info
- Publication number
- JPH01139495U JPH01139495U JP3607088U JP3607088U JPH01139495U JP H01139495 U JPH01139495 U JP H01139495U JP 3607088 U JP3607088 U JP 3607088U JP 3607088 U JP3607088 U JP 3607088U JP H01139495 U JPH01139495 U JP H01139495U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- outside
- dissipation structure
- heat dissipation
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を説明する図であり
、第２図のＡ―Ａ線断面図である。第２図は電子
機器の筐体を前方から示した斜視図、第３図は同
上の筐体を後方から示した斜視図、第４図は同上
の筐体を前面扉を除いて示した正面図である。第
５図は従来の放熱構造を示す第２図のＡ―Ａ線断
面図である。
１……電子機器の筐体、６……電源装置、７…
…プリント配線板、１３……第１のフアン、２１
……第２のフアン、３８……仕切部（エアダクト
）。
FIG. 1 is a diagram illustrating an embodiment of the present invention, and is a sectional view taken along the line AA in FIG. Figure 2 is a perspective view of the electronic device's casing from the front, Figure 3 is a perspective view of the same casing from the rear, and Figure 4 is a front view of the same casing with the front door removed. It is a diagram. FIG. 5 is a cross-sectional view taken along the line AA in FIG. 2, showing a conventional heat dissipation structure. 1... Housing of electronic equipment, 6... Power supply device, 7...
...Printed wiring board, 13...First fan, 21
...Second fan, 38...Partition part (air duct).
Claims (1)
電子機器とを収納する電子機器筐体の放熱構造に
おいて、前記電源装置より発生する熱を筐体外部
に放出する第１のフアンと前記電子機器より発生
する熱を筐体外部に放出する第２のフアンとを有
し、前記第１のフアンで筐体内に導入され筐体外
部に排出される空気の通路と前記第２のフアンで
筐体内に導入され筐体外部に排出される空気の通
路とが仕切部により仕切られていることを特徴と
する電子機器筐体の放熱構造。 In a heat dissipation structure for an electronic device housing that houses a power supply device and an electronic device supplied with power from the power supply device, the heat dissipation structure includes a first fan that radiates heat generated by the power supply device to the outside of the case, and and a second fan that releases the generated heat to the outside of the casing. A heat dissipation structure for an electronic device housing, characterized in that a passage for air introduced and exhausted to the outside of the housing is separated by a partition portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036070U JPH0642387Y2 (en) | 1988-03-18 | 1988-03-18 | Heat dissipation structure for electronic device housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036070U JPH0642387Y2 (en) | 1988-03-18 | 1988-03-18 | Heat dissipation structure for electronic device housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01139495U true JPH01139495U (en) | 1989-09-22 |
| JPH0642387Y2 JPH0642387Y2 (en) | 1994-11-02 |
Family
ID=31262687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988036070U Expired - Lifetime JPH0642387Y2 (en) | 1988-03-18 | 1988-03-18 | Heat dissipation structure for electronic device housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642387Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002360534A (en) * | 2001-06-04 | 2002-12-17 | Ge Medical Systems Global Technology Co Llc | Casing, current feeding device and magnetic resonance photographing device |
| WO2008084632A1 (en) * | 2007-01-10 | 2008-07-17 | Ntt Electronics Corporation | Electronic unit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6037294U (en) * | 1983-08-23 | 1985-03-14 | 富士通株式会社 | Cooling structure in electronic equipment |
| JPS60107898A (en) * | 1983-11-16 | 1985-06-13 | 株式会社日立製作所 | Cooling structure of electronic device |
-
1988
- 1988-03-18 JP JP1988036070U patent/JPH0642387Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6037294U (en) * | 1983-08-23 | 1985-03-14 | 富士通株式会社 | Cooling structure in electronic equipment |
| JPS60107898A (en) * | 1983-11-16 | 1985-06-13 | 株式会社日立製作所 | Cooling structure of electronic device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002360534A (en) * | 2001-06-04 | 2002-12-17 | Ge Medical Systems Global Technology Co Llc | Casing, current feeding device and magnetic resonance photographing device |
| WO2008084632A1 (en) * | 2007-01-10 | 2008-07-17 | Ntt Electronics Corporation | Electronic unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642387Y2 (en) | 1994-11-02 |
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