JPH01139443U - - Google Patents

Info

Publication number

JPH01139443U

JPH01139443U JP3591888U JP3591888U JPH01139443U JP H01139443 U JPH01139443 U JP H01139443U JP 3591888 U JP3591888 U JP 3591888U JP 3591888 U JP3591888 U JP 3591888U JP H01139443 U JPH01139443 U JP H01139443U

Authority

JP

Japan

Prior art keywords

package

lead

semiconductor device

protruding

bend

Prior art date

1988-03-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005452 bending Methods 0.000 claims description 3
• 239000004065 semiconductor Substances 0.000 claims description 3
• 238000007796 conventional method Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1

Cited By (1)