JPH01139429U - - Google Patents
Info
- Publication number
- JPH01139429U JPH01139429U JP1988034631U JP3463188U JPH01139429U JP H01139429 U JPH01139429 U JP H01139429U JP 1988034631 U JP1988034631 U JP 1988034631U JP 3463188 U JP3463188 U JP 3463188U JP H01139429 U JPH01139429 U JP H01139429U
- Authority
- JP
- Japan
- Prior art keywords
- component
- substrate
- board
- main surface
- surplus space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988034631U JPH01139429U (enExample) | 1988-03-16 | 1988-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988034631U JPH01139429U (enExample) | 1988-03-16 | 1988-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139429U true JPH01139429U (enExample) | 1989-09-22 |
Family
ID=31261331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988034631U Pending JPH01139429U (enExample) | 1988-03-16 | 1988-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139429U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023112366A1 (ja) * | 2021-12-17 | 2023-06-22 | パナソニックＩｐマネジメント株式会社 | 実装基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5973740A (ja) * | 1982-10-19 | 1984-04-26 | Nippon Denso Co Ltd | 化学及び物理量電気変換装置 |
-
1988
- 1988-03-16 JP JP1988034631U patent/JPH01139429U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5973740A (ja) * | 1982-10-19 | 1984-04-26 | Nippon Denso Co Ltd | 化学及び物理量電気変換装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023112366A1 (ja) * | 2021-12-17 | 2023-06-22 | パナソニックＩｐマネジメント株式会社 | 実装基板 |
| JP2023090363A (ja) * | 2021-12-17 | 2023-06-29 | パナソニックＩｐマネジメント株式会社 | 実装基板 |