JPH01139429U - - Google Patents

Info

Publication number
JPH01139429U
JPH01139429U JP1988034631U JP3463188U JPH01139429U JP H01139429 U JPH01139429 U JP H01139429U JP 1988034631 U JP1988034631 U JP 1988034631U JP 3463188 U JP3463188 U JP 3463188U JP H01139429 U JPH01139429 U JP H01139429U
Authority
JP
Japan
Prior art keywords
component
substrate
board
main surface
surplus space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988034631U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988034631U priority Critical patent/JPH01139429U/ja
Publication of JPH01139429U publication Critical patent/JPH01139429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1988034631U 1988-03-16 1988-03-16 Pending JPH01139429U (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988034631U JPH01139429U (da) 1988-03-16 1988-03-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988034631U JPH01139429U (da) 1988-03-16 1988-03-16

Publications (1)

Publication Number Publication Date
JPH01139429U true JPH01139429U (da) 1989-09-22

Family

ID=31261331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988034631U Pending JPH01139429U (da) 1988-03-16 1988-03-16

Country Status (1)

Country Link
JP (1) JPH01139429U (da)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023112366A1 (ja) * 2021-12-17 2023-06-22 パナソニックＩｐマネジメント株式会社 実装基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5973740A (ja) * 1982-10-19 1984-04-26 Nippon Denso Co Ltd 化学及び物理量電気変換装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5973740A (ja) * 1982-10-19 1984-04-26 Nippon Denso Co Ltd 化学及び物理量電気変換装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023112366A1 (ja) * 2021-12-17 2023-06-22 パナソニックＩｐマネジメント株式会社 実装基板

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