JPH01138596U - - Google Patents
Info
- Publication number
- JPH01138596U JPH01138596U JP3172688U JP3172688U JPH01138596U JP H01138596 U JPH01138596 U JP H01138596U JP 3172688 U JP3172688 U JP 3172688U JP 3172688 U JP3172688 U JP 3172688U JP H01138596 U JPH01138596 U JP H01138596U
- Authority
- JP
- Japan
- Prior art keywords
- disc blade
- idler
- contact
- tape
- adjusting roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000035515 penetration Effects 0.000 claims 1
Landscapes
- Details Of Cutting Devices (AREA)
- Nonmetal Cutting Devices (AREA)
Description
第１図１，２は本考案の機能を説明する装置の
模式的な正面図と側断面図、第２図１，２は本考
案の一実施例を説明する装置の正面図と側断面図
、第３図１，２は従来のテープ切断装置を説明す
る模式的な平面図と断面図である。
図において、１はテープ、２はフレーム、３は
ウエハ、４は円板刃、５はアイドラ、６，７はく
い込み量の調整コロ、８はアイドラと調整コロを
保持する母体、９はスプリング、１０は円板刃の
回転軸、１１は駆動回転軸、１２は円板刃の回転
軸の支点である。
1 and 2 are a schematic front view and a side sectional view of the device to explain the functions of the present invention, and FIG. 2 1 and 2 are a front view and a side sectional view of the device to explain an embodiment of the present invention. , FIGS. 1 and 2 are a schematic plan view and a cross-sectional view illustrating a conventional tape cutting device. In the figure, 1 is a tape, 2 is a frame, 3 is a wafer, 4 is a disc blade, 5 is an idler, 6 and 7 are adjustment rollers for the biting amount, 8 is a base body that holds the idler and adjustment rollers, 9 is a spring, 10 is a rotating shaft of the disk blade, 11 is a drive rotating shaft, and 12 is a fulcrum of the rotating shaft of the disk blade.
Claims (1)
する装置であつて、該円板刃のテープに対するく
い込み量調整機構を有し、 該調整機構は、テープ上に回転可能なアイドラ
ーと、該アイドラーの両側に移動及び固定可能な
２個の調整コロとが同一母体に設けられてなり、
且つ該調整コロを該円板刃の周囲に接触させる手
段を有し、 該アイドラーをテープに、該調整コロを該円板
刃の周囲に接触させ、該調整コロの固定位置を移
動させてくい込み量を調整するようにしたことを
特徴とするテープ切断装置。[Claims for Utility Model Registration] A device having a disc blade that rotates around a movable rotation axis, which has a mechanism for adjusting the amount of penetration of the disc blade into the tape; An idler that can be rotated and two adjustment rollers that can be moved and fixed on both sides of the idler are provided on the same base body,
and means for bringing the adjusting roller into contact with the periphery of the disc blade, the idler being brought into contact with the tape, the adjusting roller being brought into contact with the periphery of the disc blade, and the fixing position of the adjusting roller being moved to bite. A tape cutting device characterized in that the amount can be adjusted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3172688U JPH074148Y2 (en) | 1988-03-10 | 1988-03-10 | Tape cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3172688U JPH074148Y2 (en) | 1988-03-10 | 1988-03-10 | Tape cutting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01138596U true JPH01138596U (en) | 1989-09-21 |
| JPH074148Y2 JPH074148Y2 (en) | 1995-02-01 |
Family
ID=31257798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3172688U Expired - Lifetime JPH074148Y2 (en) | 1988-03-10 | 1988-03-10 | Tape cutting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH074148Y2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008066523A (en) * | 2006-09-07 | 2008-03-21 | Nitto Denko Corp | Adhesive tape cutting method, and adhesive tape sticking apparatus employing the same |
| JP2008078287A (en) * | 2006-09-20 | 2008-04-03 | Nitto Denko Corp | Adhesive tape cutting method and adhesive tape joining apparatus using the same |
| JP2010005781A (en) * | 2008-05-28 | 2010-01-14 | Shin Etsu Polymer Co Ltd | Cutter for support tape of semiconductor wafer |
| JP2010074115A (en) * | 2008-08-21 | 2010-04-02 | Tokyo Seimitsu Co Ltd | Work separating method and cutting machine |
| JP2010074114A (en) * | 2008-08-21 | 2010-04-02 | Tokyo Seimitsu Co Ltd | Cutting method |
| JP2012114465A (en) * | 2012-03-09 | 2012-06-14 | Nitto Denko Corp | Adhesive tape cutting method and adhesive tape pasting device |
| JP2014226743A (en) * | 2013-05-21 | 2014-12-08 | 三星ダイヤモンド工業株式会社 | Cutter unit, cutting device, cutting method, and holder |
| JP2019098435A (en) * | 2017-11-29 | 2019-06-24 | 三星ダイヤモンド工業株式会社 | Cutting head and cutting device |
-
1988
- 1988-03-10 JP JP3172688U patent/JPH074148Y2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008066523A (en) * | 2006-09-07 | 2008-03-21 | Nitto Denko Corp | Adhesive tape cutting method, and adhesive tape sticking apparatus employing the same |
| JP2008078287A (en) * | 2006-09-20 | 2008-04-03 | Nitto Denko Corp | Adhesive tape cutting method and adhesive tape joining apparatus using the same |
| JP2010005781A (en) * | 2008-05-28 | 2010-01-14 | Shin Etsu Polymer Co Ltd | Cutter for support tape of semiconductor wafer |
| JP2010074115A (en) * | 2008-08-21 | 2010-04-02 | Tokyo Seimitsu Co Ltd | Work separating method and cutting machine |
| JP2010074114A (en) * | 2008-08-21 | 2010-04-02 | Tokyo Seimitsu Co Ltd | Cutting method |
| JP2012114465A (en) * | 2012-03-09 | 2012-06-14 | Nitto Denko Corp | Adhesive tape cutting method and adhesive tape pasting device |
| JP2014226743A (en) * | 2013-05-21 | 2014-12-08 | 三星ダイヤモンド工業株式会社 | Cutter unit, cutting device, cutting method, and holder |
| JP2019098435A (en) * | 2017-11-29 | 2019-06-24 | 三星ダイヤモンド工業株式会社 | Cutting head and cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH074148Y2 (en) | 1995-02-01 |