JPH01137439U - - Google Patents
Info
- Publication number
- JPH01137439U JPH01137439U JP3459388U JP3459388U JPH01137439U JP H01137439 U JPH01137439 U JP H01137439U JP 3459388 U JP3459388 U JP 3459388U JP 3459388 U JP3459388 U JP 3459388U JP H01137439 U JPH01137439 U JP H01137439U
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- teflon
- polyimide
- electrode
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 239000004809 Teflon Substances 0.000 claims 2
- 229920006362 Teflon® Polymers 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 239000002390 adhesive tape Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図ａ，ｂ，ｃは本考案の一実施例による表
面温センサを示す上面図、側面図および正面図、
第２図ａ，ｂは同樹脂ケースの上面図と断面図、
第３図ａ，ｂは同主要部の側面図と斜視図、第４
図は同表面温センサの使用例を示す側面図、第５
図ａ，ｂは従来の表面温センサを示す正面図と側
面図である。
１……樹脂ケース、２……保護テープ、３……
保護フイルム、４ａ，４ｂ……突起部、５……感
熱素子、６……シリコン系樹脂、７……発泡成形
体又はゴム成形体、８……切欠溝、９ａ，９ｂ…
…素子リード線、１０ａ，１０ｂ……中継端子、
１１ａ，１１ｂ……引出し線、１２……半田。
Figures 1a, b, and c are top, side, and front views showing a surface temperature sensor according to an embodiment of the present invention;
Figures 2a and b are a top view and a cross-sectional view of the same resin case,
Figures 3a and b are side and perspective views of the main parts;
The figure is a side view showing an example of the use of the same surface temperature sensor.
Figures a and b are a front view and a side view of a conventional surface temperature sensor. 1... Resin case, 2... Protective tape, 3...
Protective film, 4a, 4b...Protrusion, 5...Thermosensitive element, 6...Silicon resin, 7...Foam molded product or rubber molded product, 8...Notch groove, 9a, 9b...
...Element lead wire, 10a, 10b...Relay terminal,
11a, 11b...Leader line, 12...Solder.
Claims (1)
し、上記電極に一対の素子リード線を電気的に接
続して成る感熱素子を切欠溝を形成した弾力性を
有する発泡成形体又はゴム成形体の上記切欠溝に
基板面を上面にシリコン系樹脂で平坦に固定し、
２つの突起部を形成した樹脂ケースの収納部へ収
納固定し素子面にポリイミド系又はテフロン系の
保護フイルムを介在させるとともにポリイミド系
又はテフロン系の粘着テープを上記素子面と面位
置又は素子面より少し低めの上記樹脂のケースの
対向する２つの突起部に貼付け、素子リード線を
引出し線と半田接続して成る表面温センサ。 The above-mentioned elastic foam molded product or rubber molded product has a heat-sensitive element formed by forming an electrode and a heat-sensitive film on one side of a ceramic substrate and electrically connecting a pair of element lead wires to the electrode with a cutout groove. Fix the board surface flat in the notch groove on the top surface with silicone resin,
It is stored and fixed in the storage part of a resin case formed with two protrusions, a polyimide-based or Teflon-based protective film is interposed on the element surface, and a polyimide-based or Teflon-based adhesive tape is attached to the element surface and the surface position or from the element surface. This is a surface temperature sensor that is attached to two opposing protrusions of the above-mentioned slightly lower resin case, and the element lead wire is connected to the lead wire by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3459388U JPH01137439U (en) | 1988-03-16 | 1988-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3459388U JPH01137439U (en) | 1988-03-16 | 1988-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01137439U true JPH01137439U (en) | 1989-09-20 |
Family
ID=31261294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3459388U Pending JPH01137439U (en) | 1988-03-16 | 1988-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01137439U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395935U (en) * | 1990-01-23 | 1991-09-30 |
-
1988
- 1988-03-16 JP JP3459388U patent/JPH01137439U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395935U (en) * | 1990-01-23 | 1991-09-30 |
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