JPH01135740U - - Google Patents
Info
- Publication number
- JPH01135740U JPH01135740U JP3072888U JP3072888U JPH01135740U JP H01135740 U JPH01135740 U JP H01135740U JP 3072888 U JP3072888 U JP 3072888U JP 3072888 U JP3072888 U JP 3072888U JP H01135740 U JPH01135740 U JP H01135740U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- chips
- wiring layer
- adhesively
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3072888U JPH01135740U (ko) | 1988-03-08 | 1988-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3072888U JPH01135740U (ko) | 1988-03-08 | 1988-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135740U true JPH01135740U (ko) | 1989-09-18 |
Family
ID=31256046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3072888U Pending JPH01135740U (ko) | 1988-03-08 | 1988-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135740U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001274315A (ja) * | 2000-03-24 | 2001-10-05 | Sony Corp | 半導体装置及びその製造方法 |
-
1988
- 1988-03-08 JP JP3072888U patent/JPH01135740U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001274315A (ja) * | 2000-03-24 | 2001-10-05 | Sony Corp | 半導体装置及びその製造方法 |