JPH01135666U - - Google Patents
Info
- Publication number
- JPH01135666U JPH01135666U JP3178988U JP3178988U JPH01135666U JP H01135666 U JPH01135666 U JP H01135666U JP 3178988 U JP3178988 U JP 3178988U JP 3178988 U JP3178988 U JP 3178988U JP H01135666 U JPH01135666 U JP H01135666U
- Authority
- JP
- Japan
- Prior art keywords
- board
- edge
- land
- along
- removed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は本考案の一実施例を示したもので、第１
図はその概略斜視図、第２図は原形の基板の概略
斜視図、第３図は丸鋸で削除部を形成する状態を
示した斜視図、第４図は基板に端子板を接合して
前者のランドと後者のランドとの半田付をした状
態を示した概略斜視図、第５図は第４図のＡ―Ａ
線拡大断面図である。
１……基板、２ａ，２ｂ，６……ランド、３…
…削除部、４……丸鋸、５……端子板、７……半
田。
The drawing shows one embodiment of the present invention.
The figure is a schematic perspective view of the board, Figure 2 is a schematic perspective view of the original board, Figure 3 is a perspective view showing the removed portion being formed with a circular saw, and Figure 4 is a terminal board bonded to the board. A schematic perspective view showing the soldered state of the former land and the latter land, Figure 5 is A-A in Figure 4.
It is a line enlarged sectional view. 1...Substrate, 2a, 2b, 6...Land, 3...
...Deleted portion, 4...Circular saw, 5...Terminal board, 7...Solder.
Claims (1)
半田付接続すべき板端に沿つたランドについて、
上記ランドが沿つている板端の基板部材を板端と
平行に板厚程度削除し、削除部分に貼着していた
上記ランドのパターン箔を削除部分の端面側に折
曲げた基板の半田付用構造。 Regarding the land along the edge of the board that should be soldered to other parts to be bonded to the back side of the board pattern,
Soldering of the board by removing the board member at the edge of the board along which the above land runs parallel to the board edge, and bending the pattern foil of the above land that was pasted to the removed part to the end face side of the removed part. Structure for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3178988U JPH01135666U (en) | 1988-03-10 | 1988-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3178988U JPH01135666U (en) | 1988-03-10 | 1988-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135666U true JPH01135666U (en) | 1989-09-18 |
Family
ID=31257907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3178988U Pending JPH01135666U (en) | 1988-03-10 | 1988-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135666U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926272B2 (en) * | 1977-03-08 | 1984-06-26 | 東洋醸造株式会社 | Coenzyme Q extraction method |
-
1988
- 1988-03-10 JP JP3178988U patent/JPH01135666U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926272B2 (en) * | 1977-03-08 | 1984-06-26 | 東洋醸造株式会社 | Coenzyme Q extraction method |