JPH01134938A - Sealing for multichip module - Google Patents
Sealing for multichip moduleInfo
- Publication number
- JPH01134938A JPH01134938A JP29336787A JP29336787A JPH01134938A JP H01134938 A JPH01134938 A JP H01134938A JP 29336787 A JP29336787 A JP 29336787A JP 29336787 A JP29336787 A JP 29336787A JP H01134938 A JPH01134938 A JP H01134938A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chips
- tab
- chip
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229920002050 silicone resin Polymers 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 2
- 238000013036 cure process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＴＡＢ方式で製作されたＩＣチップ（以下で
はＴＡＢ ＩＣチップという）を高密度実装するマル
チチップモジュールの封止方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for sealing a multi-chip module in which IC chips manufactured by the TAB method (hereinafter referred to as TAB IC chips) are mounted at high density.
従来、この種のマルチチップモジュールの封止方法は、
液状樹脂をボッティング法によってＴＡＢ ＩＣチッ
プの周辺に滴下し、その後キユア処理を行なって封止を
したり、ＴＡＢ ＩＣチップを包含する外形を有する
樹脂枠をＴＡＢ ＩＣチップの周辺に載置して、その
後、液状樹脂をボッティング法によって樹脂枠内に滴下
して、その後キユア処理を行ない、封止をしていた。Conventionally, the sealing method for this kind of multi-chip module is
Liquid resin is dropped around the TAB IC chip using a botting method, and then a cure process is performed to seal it, or a resin frame with an external shape that encompasses the TAB IC chip is placed around the TAB IC chip. After that, liquid resin was dropped into the resin frame by a botting method, and then a curing process was performed to seal it.
このような従来のマルチチップモジュールの封止方法の
うち、前者のポツティングによってＴＡＢ ＩＣチッ
プの周辺に液状樹脂を直接滴下する方法は、液状樹脂の
調合や粘度の管理が複雑であると同時に作業の俺率が悪
いという問題があった。Among these conventional multi-chip module sealing methods, the former method of directly dropping liquid resin around the TAB IC chip by potting requires complicated mixing of the liquid resin and control of viscosity, and at the same time is labor intensive. There was a problem with my poor performance.
また、後者の樹脂枠をａ置した後に、液状樹脂をボッテ
ィングによって樹脂枠内に直接滴下する方法は、液状樹
脂の管理は行ない易いが、樹脂枠を取り付ける工程が増
えるという問題があった。In addition, the latter method of directly dropping liquid resin into the resin frame by botting after placing the resin frame in place makes it easy to manage the liquid resin, but has the problem of increasing the number of steps for attaching the resin frame.
本発明の目的は、上記の問題に鑑み、作業能率の向上と
、作業工程の低減が可能であり、製造条件を安定化でき
る製造方法を提供することにある。In view of the above problems, an object of the present invention is to provide a manufacturing method that can improve work efficiency, reduce the number of work steps, and stabilize manufacturing conditions.
本発明は、基板上にＴＡＢ ＩＣチップを実装するマ
ルチチップモジュールの樹脂対土において、個々のＴＡ
Ｂ ＩＣチップもしくは適宜複数個のＴＡＢ ＩＣ
チップを包含して、熱可溶は性の枠状固定樹脂を周辺に
載置し、加熱することでマルチチップを封止するもので
ある。The present invention is a multi-chip module in which TAB IC chips are mounted on a substrate.
B IC chip or multiple TAB ICs as appropriate
A thermofusible frame-shaped fixing resin is placed around the chip, and the multi-chip is sealed by heating.
本発明は、ＴＡＢ ＩＣチップを囲み周辺に配置した
熱可溶性の枠状固定樹脂をチップ実装状態で加熱するこ
とで、樹脂が融解しＴＡＢＩＣチップをおおい封止が完
了する。In the present invention, by heating a thermofusible frame-shaped fixing resin surrounding and surrounding the TAB IC chip while the chip is mounted, the resin melts and the sealing is completed by covering the TABIC chip.
以下に１本発明の実施例を図面を参照して説明する。第
１図（、ａ）〜（ｂ）は、本発明の第１実施例の主要工
程を示す要部断面図である。An embodiment of the present invention will be described below with reference to the drawings. FIGS. 1(a) and 1(b) are sectional views of main parts showing the main steps of the first embodiment of the present invention.
（ａ）に示すように、ＴＡＢ方式でつくられたＴＡＢ
ＩＣチップ２のリードを基板１上にパルスヒート法、
レーザ溶接法、ベーパフェーズ法等によって基板に接着
する。そして、加熱されることによって融解する熱可溶
性の例えば未硬化のエポキシ樹脂、シリコン樹脂等でな
る枠状固定樹脂３でＴＡＢ ＩＣチップ２を包含する
。この枠状固定樹脂３はＴＡＢ ＩＣチップ２の外形
をガイドにしてその外周に載置するだけでよく、特別な
位置決めや仮接着等を行なわなくてよい、そして、（ｂ
）に示すように、恒温槽（図示せず）で例えば１５０℃
で３〜４時間ベークを行ない、枠状固定樹脂３を融解さ
せると、樹脂はＴＡＢ ＩＣＣ２２プ２の全面をおお
い封止し、樹脂パッケージ４が完成する。As shown in (a), TAB made by TAB method
The leads of the IC chip 2 are placed on the substrate 1 using the pulse heating method.
Adhere to the substrate by laser welding, vapor phase method, etc. Then, the TAB IC chip 2 is surrounded by a frame-shaped fixing resin 3 made of a thermosoluble material such as uncured epoxy resin or silicone resin that melts when heated. This frame-shaped fixed resin 3 only needs to be placed on the outer periphery of the TAB IC chip 2 using its outer shape as a guide, and there is no need for special positioning or temporary adhesion.
), for example, at 150°C in a constant temperature bath (not shown).
When the frame-shaped fixing resin 3 is melted by baking for 3 to 4 hours, the resin covers and seals the entire surface of the TAB ICC 22, and the resin package 4 is completed.
この時、枠状固定樹脂３を融解させるのに、長時間のベ
ータを必要とするが、恒温槽でバッチ処理を行なうこと
ができるので、生産性には悪影！を与えない、枠状固定
樹脂３はＴＡＢ ＩＣチップ２を包含する円環型であ
って、その内径はＴＡＢ ＩＣチップ２の外形寸法に
対して、片側テ＋ ０ 、３〜０ 、５ｍ／ｍ程度の余
裕があれば良く、また、その枠厚は１ ｍ ／ ｍ程度
で樹脂枠の軸方向厚さ寸法をＴＡＢＩＣチップ２の基板
からの高さに対して＋０．１〜＋ ０ 、２ ｍ ／
ｍ程度厚くする。従って、ベーク後の封止外形寸法は、
はぼＴＡＢ ＩＣチップ２と等しい薄型の樹脂パッケ
ージ４がえられる。なお円環型でなく、底面のある円筒
型のものでもよい。At this time, a long period of time is required to melt the frame-shaped fixed resin 3, but since batch processing can be performed in a constant temperature bath, it has a negative impact on productivity! The frame-shaped fixing resin 3 that does not give any The thickness of the frame should be about 1 m/m, and the axial thickness of the resin frame should be +0.1 to +0.2 m relative to the height of the TABIC chip 2 from the substrate. /
Make it about m thick. Therefore, the external dimensions of the seal after baking are:
A thin resin package 4 equivalent to the TAB IC chip 2 is obtained. Note that instead of the annular shape, a cylindrical shape with a bottom surface may be used.
次に第２実施例の製造方法を第２図を参照して説明する
。第２図（ａ）〜（ｂ）は、第２実施例の主要工程を示
す要部断面図である。この第２実施例は、基板ｌ上に実
装されるＴＡＢＩＣチップ２の個数が例えば１０〜３０
個と多数の場合で、１個のＴＡＢ ＩＣチップ２に対
して１個の枠状固定樹脂３を載置してｌ、％たので、作
業性が悪く、自動化の適用が困難であるので、基板ｌに
実装されるＴＡＢ ＩＣチップ２の配置に応じ、複数
個のチップをおおう形状を有する枠状固定樹脂３′を使
用して、第１実施例と同様にベーク法によって封止を行
なうものである。マルチチップの全数を１つの枠状固定
樹脂を使用して封止するが、数個にわけて枠状固定樹脂
を使用して封止するかはマルチチップの配置１歩留等か
ら製造適宜にすることができる。Next, the manufacturing method of the second embodiment will be explained with reference to FIG. FIGS. 2(a) and 2(b) are sectional views of main parts showing the main steps of the second embodiment. In this second embodiment, the number of TABIC chips 2 mounted on the substrate l is, for example, 10 to 30.
In the case of a large number of TAB IC chips, one frame-shaped fixing resin 3 is placed on one TAB IC chip 2, which results in poor workability and makes it difficult to apply automation. According to the arrangement of the TAB IC chips 2 mounted on the substrate l, a frame-shaped fixing resin 3' having a shape that covers a plurality of chips is used, and sealing is performed by the baking method as in the first embodiment. It is. The entire number of multi-chips is sealed using one frame-shaped fixing resin, but whether to seal them in several pieces using frame-shaped fixing resin depends on the manufacturing process depending on the multi-chip arrangement 1 yield etc. can do.
以上説明したように１本発明の封止方法はＴＡＢ Ｉ
Ｃチップを包含して、熱可溶性の枠状固定樹脂をＴＡＢ
ＩＣの周辺に載置して、加熱することで枠状固定樹
脂を融解し、ＴＡＢＩＣチップを封止するものである。As explained above, the sealing method of the present invention is TAB I
TAB the heat-soluble frame-shaped fixing resin to include the C-chip.
It is placed around the IC and heated to melt the frame-shaped fixing resin and seal the TABIC chip.
生産管理上は加熱温度制御の他、枠状固定樹脂の寸法を
管理するだけで高い歩留が得られ、また作業工程の低減
が可能な優れた効果がある。In terms of production management, in addition to controlling the heating temperature, simply controlling the dimensions of the frame-shaped fixed resin has the excellent effect of achieving a high yield and reducing the number of work steps.
第１図は本発明の第１実施例の主要工程断面図、第２図
は第２実施例の主要工程断面図である。
１・・・基板、
２・・・ＴＡＢ ＩＣチップ、
３．３′・・・枠状固定樹脂。
特許出願人 日本電気株式会社
代理人 弁理士 内 原 晋第１図FIG. 1 is a cross-sectional view of the main steps of the first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the main steps of the second embodiment. 1... Board, 2... TAB IC chip, 3.3'... Frame-shaped fixing resin. Patent applicant: NEC Corporation Representative: Susumu Uchihara, patent attorney Figure 1
Claims (1)
のＴＡＢＩＣチップもしくは適宜複数個のＴＡＢＩＣチ
ップを包含して、熱可溶性の枠状固定樹脂を周辺に載置
し、加熱することでマルチチップを封止することを特徴
とするマルチチップモジュールの封止方法。[Claims] In resin sealing of a multi-chip module in which a plurality of TABIC chips are mounted on a substrate, a thermofusible frame-shaped fixing resin is used to enclose individual TABIC chips or a plurality of TABIC chips as appropriate. A method for sealing a multi-chip module, characterized by sealing the multi-chip by placing the multi-chip on its periphery and heating it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29336787A JPH01134938A (en) | 1987-11-19 | 1987-11-19 | Sealing for multichip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29336787A JPH01134938A (en) | 1987-11-19 | 1987-11-19 | Sealing for multichip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01134938A true JPH01134938A (en) | 1989-05-26 |
Family
ID=17793865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29336787A Pending JPH01134938A (en) | 1987-11-19 | 1987-11-19 | Sealing for multichip module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01134938A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164328A (en) * | 1990-06-25 | 1992-11-17 | Motorola, Inc. | Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip |
| JP2004152983A (en) * | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | Semiconductor device and its manufacturing method |
| US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
| US7271546B2 (en) | 2001-07-16 | 2007-09-18 | Harison Toshiba Lighting Corporation | Lighting device for dielectric barrier discharge lamp |
-
1987
- 1987-11-19 JP JP29336787A patent/JPH01134938A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164328A (en) * | 1990-06-25 | 1992-11-17 | Motorola, Inc. | Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip |
| US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
| US7271546B2 (en) | 2001-07-16 | 2007-09-18 | Harison Toshiba Lighting Corporation | Lighting device for dielectric barrier discharge lamp |
| JP2004152983A (en) * | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | Semiconductor device and its manufacturing method |
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