JPH01133769U - - Google Patents
Info
- Publication number
- JPH01133769U JPH01133769U JP2750388U JP2750388U JPH01133769U JP H01133769 U JPH01133769 U JP H01133769U JP 2750388 U JP2750388 U JP 2750388U JP 2750388 U JP2750388 U JP 2750388U JP H01133769 U JPH01133769 U JP H01133769U
- Authority
- JP
- Japan
- Prior art keywords
- bridging
- lands
- circuit board
- radius
- prevention means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2750388U JPH01133769U (cs) | 1988-03-03 | 1988-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2750388U JPH01133769U (cs) | 1988-03-03 | 1988-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133769U true JPH01133769U (cs) | 1989-09-12 |
Family
ID=31250052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2750388U Pending JPH01133769U (cs) | 1988-03-03 | 1988-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133769U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288311A (ja) * | 2007-05-16 | 2008-11-27 | Casio Hitachi Mobile Communications Co Ltd | ランド形状 |
-
1988
- 1988-03-03 JP JP2750388U patent/JPH01133769U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288311A (ja) * | 2007-05-16 | 2008-11-27 | Casio Hitachi Mobile Communications Co Ltd | ランド形状 |