JPH01133738A - Polyester film for printed circuit board - Google Patents
Polyester film for printed circuit boardInfo
- Publication number
- JPH01133738A JPH01133738A JP62292498A JP29249887A JPH01133738A JP H01133738 A JPH01133738 A JP H01133738A JP 62292498 A JP62292498 A JP 62292498A JP 29249887 A JP29249887 A JP 29249887A JP H01133738 A JPH01133738 A JP H01133738A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyester
- coating layer
- polyester film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006267 polyester film Polymers 0.000 title claims abstract description 25
- 229920000728 polyester Polymers 0.000 claims abstract description 36
- 239000011247 coating layer Substances 0.000 claims abstract description 24
- 239000002245 particle Substances 0.000 claims abstract description 18
- 239000010954 inorganic particle Substances 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920000642 polymer Polymers 0.000 claims description 10
- -1 methacrylic acid compound Chemical class 0.000 claims description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 238000004132 cross linking Methods 0.000 abstract description 11
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 239000004925 Acrylic resin Substances 0.000 abstract description 5
- 229920000178 Acrylic resin Polymers 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 29
- 239000000084 colloidal system Substances 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 17
- 238000000034 method Methods 0.000 description 15
- 239000000976 ink Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 8
- 239000003973 paint Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229920000298 Cellophane Polymers 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000007756 gravure coating Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- YNULEHPRJFDRBI-UHFFFAOYSA-N (1-ethenoxy-2-methylpropan-2-yl)urea Chemical compound NC(=O)NC(C)(C)COC=C YNULEHPRJFDRBI-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical group C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 description 1
- RAADBCJYJHQQBI-UHFFFAOYSA-N 2-sulfoterephthalic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C(S(O)(=O)=O)=C1 RAADBCJYJHQQBI-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- HBLRZDACQHNPJT-UHFFFAOYSA-N 4-sulfonaphthalene-2,7-dicarboxylic acid Chemical compound OS(=O)(=O)C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 HBLRZDACQHNPJT-UHFFFAOYSA-N 0.000 description 1
- CARJPEPCULYFFP-UHFFFAOYSA-N 5-Sulfo-1,3-benzenedicarboxylic acid Chemical class OC(=O)C1=CC(C(O)=O)=CC(S(O)(=O)=O)=C1 CARJPEPCULYFFP-UHFFFAOYSA-N 0.000 description 1
- BCTDCDYHRUIHSF-UHFFFAOYSA-N 5-ethenoxypentan-1-ol Chemical compound OCCCCCOC=C BCTDCDYHRUIHSF-UHFFFAOYSA-N 0.000 description 1
- ASPUDHDPXIBNAP-UHFFFAOYSA-N 6-ethenoxyhexan-1-ol Chemical compound OCCCCCCOC=C ASPUDHDPXIBNAP-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000003254 anti-foaming effect Effects 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FDJZLUVCWCJZTC-UHFFFAOYSA-N ethenoxyurea Chemical compound NC(=O)NOC=C FDJZLUVCWCJZTC-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は配線基盤用ポリエステルフィルム、更に詳しく
は導電層、抵抗体層、絶縁層、印刷インキ層との接着性
を改良した配線基盤用ポリエステルに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a polyester film for wiring boards, more specifically, a polyester film for wiring boards that has improved adhesion to a conductive layer, a resistor layer, an insulating layer, and a printing ink layer. Regarding.
(従来の技術〕
二軸延伸ポリエステルフィルムは、その優れた電気絶縁
性、耐熱性、寸法安定性、耐薬品性を生かして、フレキ
シブル配線基盤やメンブレンスイッチとして用いられて
きた。特に近年は、銅を積層しラッチングする方法に加
えて、導電ペースト、導電用インキ、抵抗体用インキ、
絶縁体用インキ、マーキングインキを、印刷するという
方法が用いられている。それに伴い各種インキとの接着
性を改良したポリエステル、例えばポリエステル系共重
合体薄膜を設りるという方法(例えば特開昭62−16
2540号公報)おるいはウレタン系樹脂を塗布′する
という方法(例えば特開昭62−173253号公報)
が提案されている。(Prior art) Biaxially stretched polyester films have been used as flexible wiring boards and membrane switches, taking advantage of their excellent electrical insulation, heat resistance, dimensional stability, and chemical resistance. In addition to laminating and latching methods, we also offer conductive paste, conductive ink, resistor ink,
A method of printing insulator ink and marking ink is used. Along with this, a method of providing a thin film of polyester, such as a polyester copolymer, with improved adhesion to various inks (for example, JP-A-62-16
No. 2540) or a method of applying urethane resin (for example, JP-A-62-173253)
is proposed.
しかし、上記従来のポリエステルフィルムは、依然とし
て接着性が不十分である、寸法安定性を付与するためア
ニールする際、あるいはインキを硬化させるため加熱す
る際、相互に固着してしまうという欠点があった。However, the above-mentioned conventional polyester films still have drawbacks such as insufficient adhesion and sticking to each other when annealing to give dimensional stability or heating to harden ink. .
本発明は、導体用、抵抗体用、あるいは絶縁体用のイン
キやポリマペーストに対する接着性か良好でかつフィル
ム相互の固着を起こさない配線基盤用ポリエステルフィ
ルムを提供することを目的とする。An object of the present invention is to provide a polyester film for wiring boards that has good adhesion to ink or polymer paste for conductors, resistors, or insulators, and does not cause the films to stick to each other.
本発明は、中心線平均粗さが0.02〜0.50μmで
ある二軸延伸ポリエステルフィルムの少なくとも片面に
、平均粒径0..08〜2.2μmの無機粒子(a)と
架橋されたポリエステル共重合体(b)を主体とする成
分よりなり、該無機粒子(a)の平均粒径(D)と層の
厚さ(d)の比(D/d)が1.1〜80の範囲にある
被覆層を設けたことを特長とする配線基盤用ポリエステ
ルフィルムである。In the present invention, at least one side of a biaxially stretched polyester film having a centerline average roughness of 0.02 to 0.50 μm is coated with an average grain size of 0.00 μm. .. It consists of a component mainly consisting of inorganic particles (a) of 08 to 2.2 μm and a crosslinked polyester copolymer (b), and the average particle diameter (D) of the inorganic particles (a) and the layer thickness (d ) is provided with a coating layer having a ratio (D/d) of 1.1 to 80.
本発明の二軸延伸ポリエステルフィルムに使用するポリ
エステルは、エチレンテレフタレート、エチレンα、β
−ビス(2−クロルフェノキシ)エタン−4,4°−ジ
カルボキシレート、エチレンα、β−ビス(フェノキシ
〉エタン−4,4−ジカルボキシレート、エチレン2,
6−ナフタレート単位から選ばれた少なくとも一種の構
造単位を主要構成成分とする。The polyester used in the biaxially stretched polyester film of the present invention is ethylene terephthalate, ethylene α, β
-bis(2-chlorophenoxy)ethane-4,4°-dicarboxylate, ethylene α,β-bis(phenoxy>ethane-4,4-dicarboxylate, ethylene 2,
The main component is at least one structural unit selected from 6-naphthalate units.
また、本発明を阻害しない範囲内、好ましくは10モル
%以内でおれば、上記以外の他成分が共重合されていて
もよい。Further, other components other than those mentioned above may be copolymerized within a range that does not impede the present invention, preferably within 10 mol%.
本発明に使用するポリエステルフィルムは上記組成物を
主成分とするが、本発明の目的を阻害しない範囲内で、
他種ポリマをブレンドしてもよいし、また酸化防止剤、
熱安定剤、滑剤、紫外線吸収剤、核生成剤などの無機ま
たは有機添加剤が通常添加される程度添加されていても
よい。The polyester film used in the present invention has the above-mentioned composition as a main component, but within a range that does not impede the purpose of the present invention,
Other types of polymers may be blended, and antioxidants,
Inorganic or organic additives such as heat stabilizers, lubricants, ultraviolet absorbers, nucleating agents, etc. may be added to the extent that they are normally added.
本発明のフィルムを構成するポリエステルフィルムは、
常法により、少なくとも二軸配向させたものであり、厚
みは2〜600μmが好ましく、25〜250μmの範
囲がより好ましく基材ベースとしての実用面での取り扱
い性に優れている。The polyester film constituting the film of the present invention is
It is at least biaxially oriented by a conventional method, and the thickness is preferably 2 to 600 μm, more preferably 25 to 250 μm, and is excellent in practical handling as a base material.
本発明の二軸延伸ポリエステルフィルムは、中心線平均
粗さが0.02〜0.50μm、好ましくは0.05〜
0.15μm1更に好ましくは0゜08〜0.13μm
の範囲にあることが必要である。中心線平均粗さが小さ
すぎると、加熱によりフィルムが容易に相互に固着して
しまうため好ましくないのでおる。一方、中心線平均粗
さが大きすぎると、各種インキ、ポリマペーストの塗布
の均一性が悪化し、電気絶縁性が悪化するため好ましく
ない。The biaxially stretched polyester film of the present invention has a center line average roughness of 0.02 to 0.50 μm, preferably 0.05 to 0.50 μm.
0.15 μm, more preferably 0°08 to 0.13 μm
It is necessary to be within the range of . If the center line average roughness is too small, the films will easily stick to each other due to heating, which is undesirable. On the other hand, if the centerline average roughness is too large, the uniformity of application of various inks and polymer pastes will deteriorate, and electrical insulation will deteriorate, which is not preferable.
上記の中心線平均粗さを有する二軸延伸ポリエステルフ
ィルムは、ポリエステルに無機粒子を添加して製膜する
方法等の公知の方法により製造することができる。A biaxially stretched polyester film having the above-mentioned centerline average roughness can be produced by a known method such as a method of adding inorganic particles to polyester to form a film.
本発明の被覆層は、無機粒子(a)と架橋されたポリエ
ステル共重合体(b)を主体とする成分よりなる。該被
覆層は、本発明の目的・効果を損なわない範囲で、(a
)と(b)以外の物質を添加してもよいが、(a)と(
b)以外の物質の添加量は被覆層中40重量%未満、好
ましくは20重量%未満、より好ましくは5重量%未満
である。The coating layer of the present invention consists of components mainly composed of inorganic particles (a) and a crosslinked polyester copolymer (b). The coating layer may contain (a
) and (b) may be added, but (a) and (
The amount of substances other than b) added in the coating layer is less than 40% by weight, preferably less than 20% by weight, more preferably less than 5% by weight.
(a)と(b)以外に添加する物質は特に限定されない
が、代表例としては、ウレタン系樹脂、非架橋性ポリエ
ステル樹脂、アクリル樹脂、ビニル系樹脂、スチレン系
樹脂等の各種樹脂、消泡剤、塗布性改良剤、増粘剤、帯
電防止剤、酸化防止剤、紫外線吸収剤、染料、顔料など
を挙げることが可能でおるが、ポリエステル共重合体(
b)としてアクリル系マクロマーをグラフトさせた架橋
性ポリエステル共重合体を使用する場合、アクリル系樹
脂、特に水分散性アクリル樹脂を使用するのが好ましい
。Substances to be added other than (a) and (b) are not particularly limited, but representative examples include various resins such as urethane resins, non-crosslinked polyester resins, acrylic resins, vinyl resins, styrene resins, antifoaming resins, etc. agent, coating properties improver, thickener, antistatic agent, antioxidant, ultraviolet absorber, dye, pigment, etc., but polyester copolymer (
When using a crosslinkable polyester copolymer grafted with an acrylic macromer as b), it is preferable to use an acrylic resin, particularly a water-dispersible acrylic resin.
また、本発明における被覆層の厚み(d)は、無機粒子
の平均粒径(D)との比(D/d)が1゜1〜80にあ
ればよいのであり特に限定されないが、0.005〜0
.30μmが好ましく、0゜01〜0.1μmの範囲が
より好ましい。Further, the thickness (d) of the coating layer in the present invention is not particularly limited as long as the ratio (D/d) to the average particle diameter (D) of the inorganic particles is 1°1 to 80. 005~0
.. The thickness is preferably 30 μm, and more preferably 0.01 to 0.1 μm.
ここで架橋されたポリエステル共重合体とはポリエステ
ル末端のカルボキシル基、水酸基と反応してポリエステ
ルを架橋させる公知の架橋剤を添加配合して加熱おるい
は紫外線、電子線などによって架橋させたポリエステル
共重合体を挙げることができるが、ポリエステル共重合
体に反応性基を導入し、単独あるいは架橋触媒を用い加
熱などによって自己架橋させたものが特に好適である。Here, the crosslinked polyester copolymer is a polyester that is crosslinked by heating, ultraviolet rays, electron beams, etc. by adding a known crosslinking agent that crosslinks the polyester by reacting with the carboxyl group and hydroxyl group at the end of the polyester. Examples include polymers, but particularly preferred are polyester copolymers in which reactive groups are introduced and self-crosslinked either alone or by heating using a crosslinking catalyst.
前者のポリエステル共重合体としては末端にカルボキシ
ル基、水酸基を有する通常のポリエステル共重合体であ
り、ジカルボン酸成分とグリコール成分を重縮合して得
られるもので特に限定するものではない。The former polyester copolymer is a normal polyester copolymer having a carboxyl group or a hydroxyl group at the terminal, and is obtained by polycondensing a dicarboxylic acid component and a glycol component, and is not particularly limited.
ジカルボン酸成分としては芳香族、脂肪族、脂環族のジ
カルボン酸でおり、例えばテレフタル酸、イソフタル酸
、オルソフタル酸、2,6−ナフタレンジカルボン酸、
アジピン酸、セバシン酸、コハク酸、グルタル19.1
.3−シクロペンタンジカルボン酸、1,3−シクロヘ
キサンジカルボン酸、ドデカンジカルボン酸、アゼライ
ン酸などを挙げることができる。またポリエステル共重
合体の水溶化、あるいは水系分散性を付与するためスル
ホン酸金属塩基含有ジカルボン酸を共重合成分として用
いることもできる。例えばスルホテレフタル酸、5−ス
ルホイソフタル酸、4−スルホインフタル酸、4−スル
ホナフタレン2,7−ジカルボン酸、5(4−スルホフ
ェノキシ)イソフタル酸などの金属塩が挙げられる。The dicarboxylic acid component includes aromatic, aliphatic, and alicyclic dicarboxylic acids, such as terephthalic acid, isophthalic acid, orthophthalic acid, 2,6-naphthalenedicarboxylic acid,
Adipic acid, sebacic acid, succinic acid, glutaric acid 19.1
.. Examples include 3-cyclopentanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, dodecanedicarboxylic acid, and azelaic acid. Further, in order to make the polyester copolymer water-soluble or to impart water-based dispersibility, a dicarboxylic acid containing a sulfonic acid metal group can also be used as a copolymerization component. Examples include metal salts of sulfoterephthalic acid, 5-sulfoisophthalic acid, 4-sulfoiphthalic acid, 4-sulfonaphthalene 2,7-dicarboxylic acid, and 5(4-sulfophenoxy)isophthalic acid.
前述のジカルボン酸と反応させるグリコール成分として
は炭素数2〜8の脂肪族グリコール、または炭素数6〜
12の脂環族ゲルコールであり、具体例としてはエチレ
ングリコール、1,2−プロピレングリコール、1,3
−プロパンジオール、1,4−ブンタンジオール、ネオ
ペンチルグリコール、1,6−ヘキサンジオール、1,
2−シクロヘキサンジメタツール、1,3−シクロヘキ
サンジメタツール、1,4−シクロヘキサンジメタツー
ル、叶キシリレングリコール、ジエチレングリコール、
トリエチレンゲルコールなどである。これらグリコール
成分の一部にポリエチレングリコール、ポリプロピレン
グリコール、ボリテ1〜ラメチレングリコールを用いた
ものであってもよい。The glycol component to be reacted with the dicarboxylic acid mentioned above is an aliphatic glycol having 2 to 8 carbon atoms, or an aliphatic glycol having 6 to 8 carbon atoms.
12 alicyclic gelcols, specific examples include ethylene glycol, 1,2-propylene glycol, 1,3
-propanediol, 1,4-butanediol, neopentyl glycol, 1,6-hexanediol, 1,
2-cyclohexane dimetatool, 1,3-cyclohexane dimetatool, 1,4-cyclohexane dimetatool, Kano xylylene glycol, diethylene glycol,
Such as triethylene gelcol. Polyethylene glycol, polypropylene glycol, and bolite 1 to ramethylene glycol may be used as part of these glycol components.
上記ジカルボン酸およびグリコール成分より得られるポ
リエステル共重合体は、水もしくは有機溶剤又は水と有
機溶剤の混合溶媒などに溶解あるいは分散して使用され
る。The polyester copolymer obtained from the above dicarboxylic acid and glycol component is used after being dissolved or dispersed in water, an organic solvent, or a mixed solvent of water and an organic solvent.
これらの共重合ポリエステルは架橋性の点から末端基の
多いものが好ましく、水酸価が3〜200mgKOH/
gポリマー、好ましくは5〜100mCIKOH/CI
ポリマーでおる。水酸価が3以下の場合には反応性に乏
しく、200を越える場合には塗膜の強靭性が劣る。ま
た共重合ポリエステルのガラス転移点は10〜90’C
,好ましくは40〜70’Cである場合、好適な耐湿密
着性を示す。These copolymerized polyesters preferably have many terminal groups from the viewpoint of crosslinkability, and have a hydroxyl value of 3 to 200 mgKOH/
g polymer, preferably 5-100 mCIKOH/CI
Made of polymer. When the hydroxyl value is 3 or less, reactivity is poor, and when it exceeds 200, the toughness of the coating film is poor. In addition, the glass transition point of copolymerized polyester is 10 to 90'C.
, preferably from 40 to 70'C, exhibits suitable moisture-resistant adhesion.
ポリエステル共重合体を架橋するための架橋剤としては
末端のカルボキシル基、水酸基と反応し三次元化するも
のでおれば特に限定しないが代表例としてはメチロール
化あるいはアルキロール化した尿素系、メラミン系、ア
クリルアミド系、ポリアミド系樹脂、およびエポキシ化
合物、インシアネート化合物、アジリジン化合物などを
あげることができる。その中でも基材との密着性、特に
湿密着性の点でメチロール化メラミン、インシアネート
化合物の使用が好ましい。添加する架橋剤の量は架橋剤
の種類によって適宜選択されるが通常ポリエステル共重
合体の末端量に対し当量に加えるのが好ましく通常はポ
リエステル共重合体に対し固形分比で2〜30部、好ま
しくは5〜20部である。The crosslinking agent for crosslinking the polyester copolymer is not particularly limited as long as it reacts with the terminal carboxyl group or hydroxyl group to make it three-dimensional, but representative examples include methylolated or alkylolated urea type, and melamine type. , acrylamide-based resins, polyamide-based resins, epoxy compounds, incyanate compounds, aziridine compounds, and the like. Among these, methylolated melamine and incyanate compounds are preferably used from the viewpoint of adhesion to the substrate, especially wet adhesion. The amount of the crosslinking agent to be added is appropriately selected depending on the type of crosslinking agent, but it is preferably added in an equivalent amount to the terminal amount of the polyester copolymer, and usually 2 to 30 parts by solid content relative to the polyester copolymer. Preferably it is 5 to 20 parts.
また特に好適である反応性基を導入したポリエステル共
重合体とは幹ポリマーであるポリエステル共重合体に反
応性官能基、自己架橋型官能基、親水性基などの官能基
を有する下記の化合物を導入したものでおる。カルボキ
シル基またはその塩、必るいは酸無水物基を有する化合
物としてはアクリル酸、メタクリル酸、イタコン酸、マ
レイン酸、フマル酸、クロトン酸なと及びそれらのマク
ロマーである。一方アミド基あるいはアルキロール化さ
れたアミド基を有する化合物としてはアクリルアミド、
メタクリルアミド、N−メチルメタクリルアミド、メチ
ロール化アクリルアミド、メチロール化メタクリルアミ
ド、ウレイドビニルエーテル、β−ウレイドイソブヂル
ビニルエーテル、ウレイドエチルアクリレートなど及び
それらのマクロマーがあげられる。また水酸基を有する
化合物としてはβ−ヒドロキシエチルメタクリレート、
β−ヒドロキシプロピルアクリレ−1〜、β−ヒドロキ
シプロピルメタクリレ−1〜、β−ヒドロキシビニルエ
ーテル、5−ヒドロキシペンチルビニルエーテル、6−
ヒトロキシヘキシルビニルエーテル、ポリエチレングリ
コールモノアクリレート、ポリエチレングリコールモノ
メタクリレート、ポリプロピレングリコールモノアクリ
レート、ポリプロピレングリコールモノメタアクリレー
トなど及びそれらのマクロマーをめげることができる。Particularly suitable polyester copolymers into which reactive groups have been introduced are the following compounds that have functional groups such as reactive functional groups, self-crosslinking functional groups, and hydrophilic groups in the polyester copolymer that is the backbone polymer. This is what was introduced. Compounds having a carboxyl group or a salt thereof, or an acid anhydride group include acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and macromers thereof. On the other hand, compounds having an amide group or an alkylolated amide group include acrylamide,
Examples include methacrylamide, N-methylmethacrylamide, methylolated acrylamide, methylolated methacrylamide, ureido vinyl ether, β-ureido isobutyl vinyl ether, ureido ethyl acrylate, and macromers thereof. In addition, as compounds having a hydroxyl group, β-hydroxyethyl methacrylate,
β-hydroxypropyl acrylate-1~, β-hydroxypropyl methacrylate-1~, β-hydroxy vinyl ether, 5-hydroxypentyl vinyl ether, 6-
Hydroxyhexyl vinyl ether, polyethylene glycol monoacrylate, polyethylene glycol monomethacrylate, polypropylene glycol monoacrylate, polypropylene glycol monomethacrylate, etc., and macromers thereof can be excluded.
エポキシ基を有する化合物としてはグリシジルアクリレ
ート、グリシジルメタクリレートなど及びそれらのマク
ロマーかあげられる。当然以上各種上ツマ−の共重合さ
れたマクロマーを使用してもよいことはいうまでもない
。Examples of compounds having an epoxy group include glycidyl acrylate, glycidyl methacrylate, and macromers thereof. It goes without saying that macromers copolymerized with various types of polymers may also be used.
これらの反応性基の中で、塗材との密着性の点で、メタ
クリル酸、アクリル酸、メチロール化アクリルアミド、
グリシジルアクリレートもしくはグリシジルメタクリレ
ート又はそれらのマクロマーのグラフト化物か特に好ま
しい。Among these reactive groups, methacrylic acid, acrylic acid, methylolated acrylamide,
Glycidyl acrylate or glycidyl methacrylate or grafted products of macromers thereof are particularly preferred.
これらの反応性基を有刃るポリエステル共重合体は塗布
後、加熱などにより架橋することができるが架橋触媒を
併用するとより架橋が進むため更に好ましい。架橋触媒
としては塩化アンモニウム、硝酸アンモニウム、クエン
酸、蓚酸、p−トルエンスルホン酸、ジアルキルスズ路
体などを用いることかできる。添加覆る架橋触媒の量は
固形分比でポリエステル共重合体の0.5〜5部、好ま
しくは1〜3部である。After coating, the polyester copolymer having these reactive groups can be crosslinked by heating, etc., but it is more preferable to use a crosslinking catalyst in combination because the crosslinking will proceed further. As the crosslinking catalyst, ammonium chloride, ammonium nitrate, citric acid, oxalic acid, p-toluenesulfonic acid, dialkyl tin compounds, etc. can be used. The amount of crosslinking catalyst added is 0.5 to 5 parts, preferably 1 to 3 parts, based on the solid content of the polyester copolymer.
架橋剤を加えたポリエステル共重合体および反応性基を
導入したポリエステル共重合体は基材に塗布後、加熱、
紫外線、電子線などによって架橋されるか通常は加熱に
よる方法が一般的である。After applying the polyester copolymer containing a crosslinking agent and the polyester copolymer containing a reactive group to the substrate, heating and
Common methods include crosslinking with ultraviolet rays, electron beams, etc., or heating.
加熱は本発明の目的が達成できる程度に架橋される条イ
1であればよく特に限定しないが通常60〜260’C
で0.1秒〜15分、好ましくは100〜240’Cで
1秒〜2分である。基材フィルムが二軸延伸されたポリ
エステルフィルムである場合にその製造工程中で塗布後
、乾燥、熱処理を行なえは高温での架橋が可能でおるた
め更に好ましい。Heating is not particularly limited as long as the strip 1 is crosslinked to the extent that the purpose of the present invention can be achieved, but is usually 60 to 260°C.
The temperature is 0.1 seconds to 15 minutes, preferably 1 second to 2 minutes at 100 to 240'C. When the base film is a biaxially stretched polyester film, it is more preferable to perform drying and heat treatment after coating during the manufacturing process because crosslinking at high temperatures is possible.
本発明に使用する無機粒子(a)の平均粒径(D>は、
0.08〜2.2μmであり、好ましくは0.08〜0
.6μmである。平均粒径(D)が0.08μm未満で
【Jl、フィルムの耐ブロッキング性が不十分となり、
更には粒子の凝集性が高まるため、粗大異物の発生によ
って、電気絶縁性が悪化するため好ましくない。一方、
2.2μmを越えるものは、フィルム表面が顕著に粗れ
、同様に電気絶縁性が悪化するため好ましくない。The average particle diameter (D>) of the inorganic particles (a) used in the present invention is
0.08 to 2.2 μm, preferably 0.08 to 0
.. It is 6 μm. When the average particle diameter (D) is less than 0.08 μm, the blocking resistance of the film becomes insufficient,
Furthermore, since the agglomeration of the particles increases, the generation of coarse foreign matter deteriorates electrical insulation, which is not preferable. on the other hand,
If it exceeds 2.2 μm, the surface of the film will become noticeably rough and the electrical insulation properties will similarly deteriorate, which is not preferable.
なお、ここでいう平均粒径とは、遠心沈降式粒度分布測
定装置(島津製作所■製5A−CP2型)を用いて測定
したものである。In addition, the average particle diameter here is measured using a centrifugal sedimentation type particle size distribution analyzer (Model 5A-CP2 manufactured by Shimadzu Corporation).
本発明におりる無機粒子(a)の種類は特に限定されな
いが、代表的粒子としては、タルク、カオリン、重質も
しくは軽質もしくは合成の炭酸カルシウム、酸化チタン
、シリカ、フッ化リチウム、フッ化カルシウム、硫酸バ
リウム、アルミナ、ジルコニア、リン酸カルシウム又は
天然もしくは合成の膨潤性もしくは非膨潤性のマイカを
挙げることができる。しかしその中でも塗料に対する分
散性の点から水中でコロイド状で存在する無機コロイド
を使用するのが分散性の点からみて好ましい。The type of inorganic particles (a) used in the present invention is not particularly limited, but representative particles include talc, kaolin, heavy, light or synthetic calcium carbonate, titanium oxide, silica, lithium fluoride, calcium fluoride. , barium sulfate, alumina, zirconia, calcium phosphate or natural or synthetic swellable or non-swellable mica. However, from the viewpoint of dispersibility in paints, it is preferable to use inorganic colloids that exist in colloidal form in water.
ここでいう無機コロイドとは、共存出版社化学大辞典に
定義されているものであり、粒子1個中に105〜10
9個の原子を含むものである。元素により金属コロイド
、あるいは酸化物コロイド、あるいは水酸化物コロイド
として得られる。金属コロイドとしては、金、パラジウ
ム、白金、銀、イオウなどが好ましく使用され、酸化物
コロイド、水酸化物コロイド、炭酸塩コロイド、硫酸塩
コロイドとしては、亜鉛、マグネシウム、ケイ素、カル
シウム、アルミニウム、ストロンチウム、バリウム、ジ
ルコニウム、チタン、マンガン、鉄、]バルト、ニッケ
ル、スズなどの酸化物コロイド、水酸化物コロイド、炭
酸塩コロイド、硫酸塩コロイドが本発明に好ましく使用
される。例えば四ハロゲン化ケイ素を水中に加えるか、
ケイ酸アルカリの水溶液に徐々に濃塩酸を加えるなどの
操作により得られるケイ酸コロイドが本発明には極めて
好ましく使用される。The inorganic colloid mentioned here is defined in the Chemistry Dictionary published by Coexistence Publishing Co., Ltd., and there are 105 to 100 colloids in one particle.
It contains nine atoms. Depending on the element, it can be obtained as a metal colloid, oxide colloid, or hydroxide colloid. Preferably used metal colloids include gold, palladium, platinum, silver, and sulfur; examples of oxide colloids, hydroxide colloids, carbonate colloids, and sulfate colloids include zinc, magnesium, silicon, calcium, aluminum, and strontium. , barium, zirconium, titanium, manganese, iron, ]balt, nickel, tin, etc., oxide colloids, hydroxide colloids, carbonate colloids, and sulfate colloids are preferably used in the present invention. For example, adding silicon tetrahalide to water,
A silicate colloid obtained by gradually adding concentrated hydrochloric acid to an aqueous solution of an alkali silicate is very preferably used in the present invention.
無機コロイドの平均粒径は0.08−0.6μm1好ま
しくは0.11〜0.3μm1より好ましくは0.15
〜0.25μmの範囲であることが望ましい。これは平
均粒径が0.08〜0.6μmである場合、無機コロイ
ド粒子の水溶液中での安定性がすぐれるため好ましいの
である。The average particle size of the inorganic colloid is 0.08-0.6 μm, preferably 0.11-0.3 μm, more preferably 0.15
A range of 0.25 μm is desirable. This is preferable when the average particle diameter is 0.08 to 0.6 μm because the stability of the inorganic colloid particles in an aqueous solution is excellent.
本発明のフィルムは、被N@の無機粒子の平均粒径(D
)と被覆層厚み(d)との比(D/d)が1.1〜80
でなければならない。好ましくは2.0〜40、より好
ましくは3.0〜15の範囲である。(D/d)が1.
0末)黄では、積層フィルムの易滑性、耐ブロッキング
性が悪化するため好ましくない。一方、(D/d)が8
0以上では、易接着層の耐摩耗性が悪化し、粉が発生し
製品欠点となるため好ましくない。The film of the present invention has an average particle diameter (D
) and the coating layer thickness (d) (D/d) is 1.1 to 80
Must. Preferably it is in the range of 2.0-40, more preferably 3.0-15. (D/d) is 1.
(0) Yellow is not preferred because it deteriorates the slipperiness and anti-blocking properties of the laminated film. On the other hand, (D/d) is 8
If it is 0 or more, the abrasion resistance of the easy-adhesive layer deteriorates, and powder is generated, resulting in product defects, which is not preferable.
次に本発明のフィルムの代表的製造方法について説明す
るが、これに限定されるものではない。Next, a typical method for manufacturing the film of the present invention will be described, but the method is not limited thereto.
まず基材とする二軸延伸ポリエステルフィルムを用意す
る。このフィルムは、必要に応じ、空気中その他種々の
雰囲気中でコロナ放電処理を施しておいてもよい。また
ウレタン樹脂、エポキシ樹脂など公知のアンカー処理剤
を用いてアンカー処理を施しておいてもよいが通常は特
に必要ではない。該フィルム上に該被覆層を、グラビア
コート、リバースコート、スプレーコート等公知の方法
を用いてコーティングした後、60’C〜260℃で0
.1秒〜15分程度乾燥させる。First, a biaxially stretched polyester film to be used as a base material is prepared. This film may be subjected to corona discharge treatment in air or other various atmospheres, if necessary. Anchor treatment may be performed using a known anchor treatment agent such as urethane resin or epoxy resin, but this is usually not necessary. The coating layer is coated on the film using a known method such as gravure coating, reverse coating, or spray coating, and then heated at 60'C to 260C at 0.
.. Let dry for about 1 second to 15 minutes.
また該被N層を別途製膜しておき、市とからラミネート
しても良いが、コーティング層は、やや強度が不足であ
る点から、直接基材フィルム上にコーティングする方法
か好ましい。Alternatively, the N layer may be formed separately and laminated with a film, but since the strength of the coating layer is somewhat insufficient, it is preferable to directly coat the base film.
また基材フィルムの製造工程で塗布することが可能であ
る。すなわち−例を具体的に述べれば、一方向に延伸後
のポリエステルフィルムの少なくとも片面に塗布し、乾
燥した後おるいは乾燥しつつ直角方向に延伸した後、熱
処理を行なうか、あるいは直角方向に延伸を行った後、
前記一方向に再延伸し熱処理を行なう方法である。この
方法は、被覆層を薄くかつ均一に塗布することが可能で
ある点、及びポリエステル共重合体の架橋がすみやかに
かつ高度に進むため、特に好ましい。It is also possible to apply it during the manufacturing process of the base film. That is, to give a specific example, the polyester film is coated on at least one side of the polyester film after being stretched in one direction, and after drying, or after being stretched in the right angle direction while drying, heat treatment is performed; After stretching,
This is a method of re-stretching in one direction and performing heat treatment. This method is particularly preferred because it allows the coating layer to be applied thinly and uniformly, and because crosslinking of the polyester copolymer progresses rapidly and to a high degree.
なお、本発明に用いた特性値は、次の測定方法、評価基
準による。Note that the characteristic values used in the present invention are based on the following measurement method and evaluation criteria.
(1)耐ブロッキング性
フィルム両面に所定の被覆層を設けた厚さ110C1、
サイズA4大のフィルムを50枚重ね、雰囲気温度17
0’Cの熱風オーブン中で60分放置する。該サンプル
を室温で徐冷後1枚ずつはがす。その際相互に粘着する
ことなく熱処理前と同様、はがすことが可能なものを「
○」、それ以外をIXjとして判定する。(1) Anti-blocking film with a predetermined coating layer on both sides, thickness 110C1,
Stack 50 sheets of A4 size film and set the ambient temperature to 17.
Leave in a hot air oven at 0'C for 60 minutes. The samples are slowly cooled at room temperature and then peeled off one by one. At that time, the materials that can be peeled off like before heat treatment without sticking to each other are
○”, and the others are determined as IXj.
(2)常温密着性
所定の被覆層上に、下記の4種の塗料i)〜−17=
■)を各々塗布、硬化させた後1mm角のいわゆるゴバ
ン目をいれ、その部分をセロハンテープにチバン(41
製)で180°方向の強制剥離を行ない、以下の基準で
判定1ノだ。即ち、全剥離面積のうち15%未満しか剥
離しないものを「○」、それ以上剥離するものを「×」
とした。また剥離面積が5%未満の場合「◎」と判定し
た。ただし第1表中には4種の塗料のうち最も密着性が
悪い場合の結果を示した。(2) Room-temperature adhesion After applying each of the following four types of paints i) to -17=■) on the prescribed coating layer and curing, make a so-called goban of 1 mm square, and tape the area with cellophane tape. Chiban (41)
Forced peeling was performed in a 180° direction with a 180° direction (manufactured by Manufacturer Co., Ltd.), and the result was rated as 1 based on the following criteria. In other words, "○" means that less than 15% of the total peeled area is peeled off, and "×" means that more than 15% of the total peeled area peels off.
And so. Moreover, when the peeled area was less than 5%, it was judged as "◎". However, Table 1 shows the results for the case where the adhesion was the worst among the four types of paint.
i〉日本アチソン ED450SS (50%)M
L−25089(50%)
をスクリーン印刷法により7μmi布したのち、紫外線
照射装置(80W/cmx3灯、高さ150mmで7〜
8m/分処理)で硬化させた。i> Nippon Acheson ED450SS (50%) M
After applying L-25089 (50%) to a 7 μm cloth using the screen printing method, a UV irradiation device (80 W/cm x 3 lights, height 150 mm)
8 m/min processing).
ii)デュポン社の″バイロツクス”1400を6μm
塗布したのち、熱硬化させた。ii) DuPont's "Virox" 1400 6μm
After coating, it was heat cured.
山)セイコーアドバンス社 0VA−9119100部
5VX−12040部
を4μm塗布した後、i)と同様硬化させた。100 parts of Seiko Advance Co., Ltd. 0VA-9119, 5 VX-12040 parts was applied to a thickness of 4 μm, and then cured in the same manner as in i).
iv)東洋インキFD−33(i) 100
部FDレジューサーP 5部
を4μm塗布した後、i)と同様硬化させた。iv) Toyo Ink FD-33(i) 100
After applying 5 parts of FD Reducer P to a thickness of 4 μm, it was cured in the same manner as in i).
(3)耐湿密着性
被覆層上に前述の4種の塗料i)〜i1/)を各々塗布
、硬化させたフィルムを85°C195%RH下に4日
間放置した後、(2)と同様の評価を行い判定した。(3) The above-mentioned four types of paints i) to i1/) were applied on the moisture-resistant adhesion coating layer, and the cured film was left at 85°C and 195%RH for 4 days, and then the same coating layer as in (2) was applied. The evaluation was made and the judgment was made.
(4)耐摩耗性
テープ状にしたフィルムの被覆層表面を金属(SUS)
固定ガイド(5mmφ)に100回繰り返し接触走行さ
せた後、フィルム上に付着したスクラッチ量を観察し、
その数の多少で次の如く判断した。(4) The surface of the coating layer of the abrasion-resistant tape-shaped film is made of metal (SUS)
After repeatedly running in contact with a fixed guide (5 mmφ) 100 times, the amount of scratches attached to the film was observed.
Judgments were made based on the number as follows.
○ニスクラッチが少ない(耐久性良好)、Xニスクラッ
チが多い(耐久性不良)
(5)被覆層の厚みd(μm)
被覆層にセロハンテープを貼り、セロハンチープ端部の
被覆層をジメヂルホルムアミド等の溶剤で溶解除去する
。次いでセロハンテープを剥がし、セロハンテープで保
護された面と、溶解除去した面との境界を■小板研究所
製F丁−10高精度段差測定器により測定し、厚みを求
めた。○ Few varnish scratches (good durability), many X varnish scratches (poor durability) (5) Thickness of the coating layer d (μm) Apply cellophane tape to the coating layer, and tape the coating layer at the end of the cellophane chip. Dissolve and remove with a solvent such as formamide. Next, the cellophane tape was peeled off, and the boundary between the surface protected by the cellophane tape and the surface that had been dissolved and removed was measured using a F-10 high-precision step measuring device manufactured by Koita Research Institute, and the thickness was determined.
上記方法で困難な場合は、日立製作所製透過型電子顕微
鏡1」U−12型を用い、積層フィルムの超薄断面切片
を観察し、厚みを求めた。If the above method was difficult, an ultra-thin section of the laminated film was observed using a transmission electron microscope 1" U-12 model manufactured by Hitachi, Ltd., and the thickness was determined.
(6)中心線平均粗さ
J l5−B−0601に従い、■小板研究所製の触針
型表面粗さ計5D−3型を用い、カットオフ0.25m
m、測定長さ1mmで平均粗さRa (μm)を測定し
た。(6) Center line average roughness According to Jl5-B-0601, using a stylus type surface roughness meter 5D-3 manufactured by Koita Research Institute, cutoff 0.25 m.
The average roughness Ra (μm) was measured at a measurement length of 1 mm.
(7)絶縁破壊特性
日本アチソン■の「lectrodag 450SS
を膜厚25μmに塗布し、UVクランプ20W/cmx
2灯で6m/min (高さ150mm>で照射硬化
させた後、ASTM D−149Aに基づいて、絶縁
破壊電圧2000V−Ac/口をn−50で測定、その
最大と最少を除いたバラツキが平均破壊電圧の40%を
越える場合をrXJ、それより小さい場合「○」とした
。(7) Dielectric breakdown characteristics Nippon Acheson's "electrodag 450SS"
was applied to a film thickness of 25μm, and UV clamped at 20W/cmx.
After curing with irradiation at 6 m/min (height 150 mm) with 2 lamps, the dielectric breakdown voltage of 2000 V-Ac/mouth was measured with n-50 based on ASTM D-149A, and the variation excluding the maximum and minimum values was When it exceeds 40% of the average breakdown voltage, it is marked as rXJ, and when it is smaller than that, it is marked as "○".
本発明を以下の実施例、比較例を用いて説明するが、本
発明はこれらの実施例に限定されるものではない。The present invention will be explained using the following examples and comparative examples, but the present invention is not limited to these examples.
実施例1〜6、比較例1〜6
固有粘度0964のポリエチレンテレフタレートに平均
粒径0.15μmの酸化ケイ素を00OO8%(比較例
1)、0.018%(実施例1.4〜6、比較例3〜6
)、6.035%(実施例2>、0.06%(実施例3
)、0.14%(比較例2)添加、該樹脂を285°C
で溶融、表面温度50℃の冷却ドラム上に押出成形した
。このように得られたフィルムを縦方向に900Cで3
.8倍延伸した後、表面をコロナ放電処理した後、下記
の組成の塗料を水を溶媒としてグラビアコート法で塗布
した。その後該塗料を乾燥しつつ、横方向に100℃で
3.3倍延伸し、更に220’C雰囲気下で4%横方向
に弛緩させつつ熱処理を施し= 21−
た。Examples 1 to 6, Comparative Examples 1 to 6 Silicon oxide with an average particle size of 0.15 μm was added to polyethylene terephthalate with an intrinsic viscosity of 0964 at 8% (Comparative Example 1) and 0.018% (Examples 1.4 to 6, Comparative). Examples 3-6
), 6.035% (Example 2>, 0.06% (Example 3)
), 0.14% (Comparative Example 2) added, and the resin was heated at 285°C.
The mixture was melted at 50°C and extruded onto a cooling drum with a surface temperature of 50°C. The film thus obtained was heated in the longitudinal direction at 900C for 3
.. After stretching 8 times, the surface was subjected to corona discharge treatment, and then a paint having the composition shown below was applied by gravure coating using water as a solvent. Thereafter, while drying the paint, it was stretched 3.3 times in the transverse direction at 100 DEG C., and further heat-treated in an atmosphere of 220 DEG C. while relaxing it in the transverse direction by 4%.
使用した塗料の組成は次のとおりである。The composition of the paint used is as follows.
A、メタクリル酸とグリシジルアクリレ−1〜を各20
モル%マクロマーの形でグラフト結合させた水分散性ポ
リエステル共重合体く商品名:高松油脂■ペスレジン6
04G>100重量部
B、メラミン系架橋剤(商品名コニカラックMWIOL
F) 8重量部C,シリカゾル(但し
平均粒径は第1表中に示した) 2.
5重量部得られたフィルムについて各種物性を評価した
。A, methacrylic acid and glycidyl acrylate-1 to 20 each
Water-dispersible polyester copolymer grafted in the form of mol% macromer.Product name: Takamatsu Yushi ■Pess Resin 6
04G>100 parts by weight B, melamine crosslinking agent (trade name Konicalak MWIOL
F) 8 parts by weight C, silica sol (however, the average particle size is shown in Table 1) 2.
Various physical properties of the film obtained in an amount of 5 parts by weight were evaluated.
結果を第1表に示す。The results are shown in Table 1.
第1表にみるごとく、本発明範囲にある場合のみ良好な
特性を示すことか判る。また特に実施例2の場合耐ブロ
ッキング性、絶縁破壊特性が特に良好であった。As shown in Table 1, it can be seen that good characteristics are exhibited only when the properties are within the range of the present invention. Moreover, especially in the case of Example 2, blocking resistance and dielectric breakdown properties were particularly good.
実施例6
実施例2と同じ製法で製膜した。ただし塗料は一軸延伸
フィルムではなく、熱処理を施した二軸延伸フィルム上
にグラビアコート法で塗布、150°Cで乾燥した。こ
のようにして得られたフィルムを同様評価した。密着性
は実施例2に比べるとやや劣るが同様良好な特性を示し
た。Example 6 A film was formed using the same method as in Example 2. However, the paint was applied not to a uniaxially stretched film but to a heat-treated biaxially stretched film using a gravure coating method and dried at 150°C. The film thus obtained was similarly evaluated. Although the adhesion was slightly inferior to that of Example 2, it showed similarly good characteristics.
本発明においては、特定の中心線平均粗さとした二軸延
伸ポリエステルフィルム上に、所定の被覆層を設けたの
で、次のように優れた作用効果を奏し、配線基盤用とし
て好適である。In the present invention, since a predetermined coating layer is provided on a biaxially stretched polyester film having a specific center line average roughness, it exhibits the following excellent effects and is suitable for use as a wiring board.
(1)各種インキ、ポリマペーストとの密着性に優れる
。(1) Excellent adhesion with various inks and polymer pastes.
(2)その密着性が、高温高湿雰囲気下でも殆ど変化し
ない。(2) Its adhesion hardly changes even under high temperature and high humidity atmosphere.
(3)耐ブロッキング性に優れる。(3) Excellent blocking resistance.
Claims (3)
二軸延伸ポリエステルフィルムの少なくとも片面に、平
均粒径0.08〜2.2μmの無機粒子(a)と架橋さ
れたポリエステル共重合体(b)を主成分とする成分よ
りなり、該無機粒子(a)の平均粒径(D)と層の厚さ
(d)の比(D/d)が1.1〜80の範囲にある被覆
層を設けたことを特徴とする配線基盤用ポリエステルフ
ィルム。(1) At least one side of a biaxially stretched polyester film having a center line average roughness of 0.02 to 0.50 μm is coated with inorganic particles (a) having an average particle size of 0.08 to 2.2 μm and a crosslinked polyester film. It consists of a component whose main component is a polymer (b), and the ratio (D/d) of the average particle diameter (D) of the inorganic particles (a) to the layer thickness (d) is in the range of 1.1 to 80. A polyester film for wiring boards, characterized by being provided with a coating layer.
求の範囲第1項記載の配線基盤用ポリエステルフィルム
。(2) The polyester film for a wiring board according to claim 1, wherein the coating layer is stretched.
はメタクリル酸化合物をグラフトしてなることを特徴と
する特許請求の範囲第1項記載の配線基盤用ポリエステ
ルフィルム。(3) The polyester film for a wiring board according to claim 1, characterized in that the polyester copolymer is grafted with a crosslinkable acrylic acid or methacrylic acid compound.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62292498A JPH07119098B2 (en) | 1987-11-19 | 1987-11-19 | Polyester film for wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62292498A JPH07119098B2 (en) | 1987-11-19 | 1987-11-19 | Polyester film for wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01133738A true JPH01133738A (en) | 1989-05-25 |
JPH07119098B2 JPH07119098B2 (en) | 1995-12-20 |
Family
ID=17782599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62292498A Expired - Lifetime JPH07119098B2 (en) | 1987-11-19 | 1987-11-19 | Polyester film for wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07119098B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0315543A (en) * | 1989-06-13 | 1991-01-23 | Toray Ind Inc | Polyester film for power-board |
-
1987
- 1987-11-19 JP JP62292498A patent/JPH07119098B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0315543A (en) * | 1989-06-13 | 1991-01-23 | Toray Ind Inc | Polyester film for power-board |
Also Published As
Publication number | Publication date |
---|---|
JPH07119098B2 (en) | 1995-12-20 |
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