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Priority to JP2940288UpriorityCriticalpatent/JPH01131538U/ja
Publication of JPH01131538UpublicationCriticalpatent/JPH01131538U/ja
Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same
Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same