JPH01131537U - - Google Patents

Description

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of a first embodiment of a thermal recording head according to the present invention, FIGS.
5 are explanatory diagrams of a conventional thermal recording head, in which FIG. 3 is a side sectional view, FIG. 4 is a partial perspective view, and FIG.
FIG. 2 is an enlarged view of a portion indicated by arrow V in the figure. R...Roller platen, 1...Support plate, 1a...Insulating board support part, 1b...Printed wiring board support part, 1
c...Insulating substrate support surface, 1d...Printed wiring board supporting surface, 4...Insulating substrate, 4a...Individual electrode, 4b...Common electrode, 4c...Heating resistor, 5...Printed wiring board, 5a...Wiring, 7...Drive signal Input terminal (socket).

Amendment November 9, 1983 The scope of claims for utility model registration is amended as follows.

[Claims for Utility Model Registration] An insulating substrate 4 having a drive signal input terminal 7, an individual electrode 4a, a common electrode 4b, and a heating resistor 4c disposed between these electrodes 4a and 4b formed on the upper surface; An IC whose output terminal side is connected to the individual electrode 4a, and a printed wiring board 5 on which a wiring 5a connecting the input terminal side of this IC and the drive signal input terminal 7 are formed are supported. In the thermal recording head supported by a plate 1, the support plate 1 is an insulating substrate support surface that supports the insulating substrate 4 so that the heating resistor 4c on the insulating substrate 4 is brought into contact with the roller platen R. 1c and
On a second plane S2 different from the first plane S1 including this insulating substrate support surface _1c , and on the first plane _S2 .
A printed wiring board support surface ₁ formed at a position opposite to the side where the roller platen R is located when viewed from 1.
d, and the IC is disposed on a printed wiring board 5 supported on the printed wiring board support surface 1d. 2. The thermal recording head according to claim 1, wherein the printed wiring board support surface 1d is formed continuously with the insulating substrate support surface 1c and is inclined in a direction away from the roller platen R. The support plate 1 has an insulating substrate support surface 1c on the upper surface.
The insulating substrate supporting portion 1a and the printed wiring board supporting portion 1b are made of a metal material that is integrally formed with a thick insulating substrate supporting portion 1a having a thickness of 100 dB and a thin printed wiring board supporting portion 1b having a printed wiring board supporting surface 1d on the upper surface. 2. The thermal recording head according to item 1, wherein the thermal recording head is bent at the boundary of the head. The brief description of the drawing has been amended as follows. On page 16, line 10 of the specification, the phrase "first implementation" is corrected to read "one implementation."

Claims (1)

[Claims for Utility Model Registration] An insulating substrate 4 having a drive signal input terminal 7, an individual electrode 4a, a common electrode 4b, and a heating resistor 4c disposed between these electrodes 4a and 4b formed on the upper surface; An IC whose output terminal side is connected to the individual electrode 4a, and a printed wiring board 5 on which a wiring 5a connecting the input terminal side of this IC and the external signal input terminal 7 are formed are supported by the support plate 1. In the supported thermal recording head, the support plate 1 has an insulating substrate support surface 1c that supports the insulating substrate 4 so that the heating resistor 4c on the insulating substrate 4 is brought into contact with the roller platen R;
On a second plane S2 different from the first plane S1 including this insulating substrate support surface _1c , and on the first plane _S2 .
A printed wiring board support surface ₁ formed at a position opposite to the side where the roller platen R is located when viewed from 1.
d, and the IC is disposed on a printed wiring board 5 supported on the printed wiring board support surface 1d. 2. The thermal recording head according to claim 1, wherein the printed wiring board support surface 1d is formed continuously with the insulating board support surface 1c and is inclined in a direction away from the roller platen R. . The support plate 1 has an insulating substrate support surface 1c on the upper surface.
A metal material integrally formed with a thick insulating board support part 1a having a thickness of about 100 nm and a thin printed wiring board support part 1b having a printed wiring board support surface 1d on the upper surface is a metal material that is integrally formed with the insulating board support part 1a and the printed wiring board support part 1b. 2. The thermal recording head according to item 1, wherein the thermal recording head is bent at the boundary of the head.