JPH01130595A - Electromagnetic shielding laminated body - Google Patents
Electromagnetic shielding laminated bodyInfo
- Publication number
- JPH01130595A JPH01130595A JP28842287A JP28842287A JPH01130595A JP H01130595 A JPH01130595 A JP H01130595A JP 28842287 A JP28842287 A JP 28842287A JP 28842287 A JP28842287 A JP 28842287A JP H01130595 A JPH01130595 A JP H01130595A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic shielding
- layer
- conductive polymer
- metal
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 20
- 230000000694 effects Effects 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 13
- 238000010030 laminating Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 4
- 239000002313 adhesive film Substances 0.000 abstract description 3
- 239000002390 adhesive tape Substances 0.000 abstract description 3
- 239000002322 conducting polymer Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 15
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 11
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 8
- -1 benzene Chemical compound 0.000 description 7
- 238000005868 electrolysis reaction Methods 0.000 description 7
- 239000003792 electrolyte Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 229920000128 polypyrrole Polymers 0.000 description 6
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000012744 reinforcing agent Substances 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- JSZOAYXJRCEYSX-UHFFFAOYSA-N 1-nitropropane Chemical compound CCC[N+]([O-])=O JSZOAYXJRCEYSX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004792 Prolene Substances 0.000 description 1
- PBCJIPOGFJYBJE-UHFFFAOYSA-N acetonitrile;hydrate Chemical compound O.CC#N PBCJIPOGFJYBJE-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000000855 fermentation Methods 0.000 description 1
- 230000004151 fermentation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002390 heteroarenes Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- MCSAJNNLRCFZED-UHFFFAOYSA-N nitroethane Chemical compound CC[N+]([O-])=O MCSAJNNLRCFZED-UHFFFAOYSA-N 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical group [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- HIEHAIZHJZLEPQ-UHFFFAOYSA-M sodium;naphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 HIEHAIZHJZLEPQ-UHFFFAOYSA-M 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】 ［技術分野］ 本発明は、電磁シールド材に関する。[Detailed description of the invention] [Technical field] The present invention relates to an electromagnetic shielding material.
［従来技術］
コンピューターを初めとする各種電子機器には、ＩＣ，
ＬＳＩなどが使用されているが、そこで発生する高周波
パルスの電子波が外部に漏洩し、周辺機器に大きな影響
を与える。[Prior Art] Various electronic devices including computers include ICs,
Although LSIs and other devices are used, the high-frequency pulsed electronic waves generated there leak to the outside and have a major impact on peripheral devices.
従来、このような電子機器からの電磁波の外部への漏洩
を防止するめだめの機器筐体でのいわゆるＥＭＩ対策と
して、主に２つの方法が考えられている。Conventionally, two main methods have been considered as so-called EMI countermeasures for the electronic equipment housing to prevent leakage of electromagnetic waves from such electronic equipment to the outside.
一つはプラスチック成型品の表面に導電性被膜を形成す
る表面処理方法で、もう一つは導電性フィラーをプラス
チック中に導入する複合化プラスチック導電剤の成型加
工法である。One is a surface treatment method that forms a conductive film on the surface of a plastic molded product, and the other is a molding method for a composite plastic conductive agent that incorporates a conductive filler into the plastic.
しかしながら、この前者の表面処理手法において、例え
ば金属メツキ法を用いる場合には、メツキ可能な樹脂の
種類が限定され、また、部分的なメツキは難しく、高価
である。ざらに導電性塗料を用いることも考えられるが
、厚さ５０μｍ以上に塗布しないと均質な塗膜にならず
、十分なシールド効果が得られない等の゛欠点がある。However, in the former surface treatment method, for example, when a metal plating method is used, the types of resins that can be plated are limited, and partial plating is difficult and expensive. Although it is conceivable to use a roughly conductive paint, there are drawbacks such as the fact that unless it is applied to a thickness of 50 μm or more, a homogeneous paint film will not be obtained and a sufficient shielding effect will not be obtained.
又、後者の成型加工法においては、３０〜４０％のフィ
ラーを混入する必要があるので、機械的強度の高いもの
が得られないという問題がある。Moreover, in the latter molding method, it is necessary to mix 30 to 40% filler, so there is a problem that a product with high mechanical strength cannot be obtained.
一方、ポリアセチレン、ポリチオフェン、ポリピロール
などの導電性高分子は、微量の不純物をドーピングする
と金属層の電気伝導度を持つようになることが知られて
いるが、これらのほとんどは、空気中での安定性が悪く
金属状態を長く保つことができず、かつ機械的強度が十
分でなくまた磁界シールド効果が十分ではなく、実用化
には至っていない。On the other hand, conductive polymers such as polyacetylene, polythiophene, and polypyrrole are known to have the electrical conductivity of a metal layer when doped with a small amount of impurity, but most of these are stable in air. It has poor properties and cannot maintain its metallic state for a long period of time, has insufficient mechanical strength, and has insufficient magnetic field shielding effect, so it has not been put into practical use.
また機器に応じ必要な部分のみを電磁シールドする金属
箔テープが市販されているものの、金属のみでは箔に傷
が付き易いため信頼性の高いシールド効果を得るために
はある程度の厚みが必要であるため、シールド材の重量
は重くなりまた高価なものとなってしまう。また、金属
油に樹脂をコートして金属箔を保護したテープもめるが
、フレキシビリティに欠ける。Additionally, although metal foil tapes are available on the market that provide electromagnetic shielding for only the necessary parts depending on the device, the foil is easily damaged when using only metal, so a certain amount of thickness is required to obtain a reliable shielding effect. Therefore, the shielding material becomes heavy and expensive. Also, tapes made by coating metal oil with resin to protect metal foils are used, but they lack flexibility.
［目 的］
本発明は、上記した従来の問題点に鑑み、軽量かつ強靭
な電磁シールドを目的とするものである。[Objective] In view of the above-mentioned conventional problems, the present invention aims at providing a lightweight and strong electromagnetic shield.
［構 成］
本発明者は、従来より上記課題を解決するため研究を重
ねてきたが、導電性高分子層と金属層を積層することに
より、軽量、薄型、強靭な電磁シールド効果の高い電磁
シールド材を提供し得ることを見出し、本発明に至った
。[Structure] The present inventor has been conducting research to solve the above problems, and found that by laminating a conductive polymer layer and a metal layer, a lightweight, thin, strong electromagnetic shield with high electromagnetic shielding effect was created. It was discovered that a shielding material can be provided, leading to the present invention.
すなわち、本発明は、導電性高分子層と金属層を有する
ことを特徴とする電磁シールド積層体でおる。That is, the present invention is an electromagnetic shielding laminate characterized by having a conductive polymer layer and a metal layer.
本発明に用いる導電性高分子材料としては例えば、アセ
チレン、ピロール、チオフェン、ベンゼンあるいはこれ
らの誘導体を原料とした導電性高分子またはこれらの重
合体と電解質アニオンからなる重合錯体を挙げることが
できる。Examples of the conductive polymer material used in the present invention include conductive polymers made from acetylene, pyrrole, thiophene, benzene, or derivatives thereof, or polymer complexes consisting of these polymers and electrolyte anions.
これらの導電性高分子材料は化学的重合法や電解重合法
などにより製造することができるが、化学的重合法を行
った場合、導電性高分子材料は一般的に粉末で得られる
ために金属層上への塗布などを必要とするため均一であ
る程度の厚さの導電性高分子層を形成することが難しい
。These conductive polymer materials can be manufactured by chemical polymerization methods, electrolytic polymerization methods, etc. However, when chemical polymerization methods are used, conductive polymer materials are generally obtained in powder form, so they cannot be manufactured using metals. Since it requires coating on the layer, it is difficult to form a uniform conductive polymer layer with a certain thickness.
一方、電解重合法により製造した場合、通常、電解電極
上に均質な膜状に生成し、電気的門械的接触も良好であ
るので電解電極として本発明の構成要素である金属層を
用いて電解重合することにより導電性高分子層の製造と
同時に電磁シールド材が！！！造されることになり、製
造コスト上極めて有利になる。また、電解電極を任意の
形状にすることにより、任意の形状の電磁シールド材が
製造される。On the other hand, when produced by the electrolytic polymerization method, the metal layer, which is a component of the present invention, is usually formed on the electrolytic electrode as a homogeneous film and has good electrical and mechanical contact. Through electrolytic polymerization, electromagnetic shielding materials can be produced simultaneously with the production of conductive polymer layers! ! ! This makes it extremely advantageous in terms of manufacturing costs. Further, by forming the electrolytic electrode into an arbitrary shape, an electromagnetic shielding material having an arbitrary shape can be manufactured.
この電解重合方法は、一般には例えば、Ｊ。This electrolytic polymerization method is generally described in, for example, J.
Ｅ ｌ ｅｃｔｒｏｃｈｅｍ、 Ｓｏｃ、 、 Ｖｏｌ
、 １３０． Ｎｏ、 １５０６−１５０９（１９８３
）、Ｅｌｅｃｔｒｏｃｈｅｍ、Ａｃｔａ、 、Ｖｏｌ、
２７．Ｎｏ、 １．６ｌ−６５（１９８２） 、Ｊ、Ｃ
ｈｅｍ、Ｓｏｃ、、Ｃｈｅｍ、Ｃｏｍｍｕｎ、、１１９
９−（１９８４）などに示されているが、単量体と電解
質とを溶媒に溶解した液を所定の電解槽に入れ、電極を
浸漬し、陽極醸化あるいは陰極還元による電解重合反応
を起こさせることによって行うことができる。El electrochem, Soc, , Vol.
, 130. No. 1506-1509 (1983
), Electrochem, Acta, , Vol.
27. No. 1.6l-65 (1982), J.C.
hem,Soc,,Chem,Commun,,119
9-(1984), a solution in which a monomer and an electrolyte are dissolved in a solvent is placed in a designated electrolytic bath, and electrodes are immersed to cause an electrolytic polymerization reaction by anodic fermentation or cathodic reduction. This can be done by letting
単量体としては、ピロール、チオフェンなど複素芳香族
系化合物、ベンゼンなど芳香族系化合物及びこれら誘導
体を例示することができる。Examples of the monomer include heteroaromatic compounds such as pyrrole and thiophene, aromatic compounds such as benzene, and derivatives thereof.
電解質としては、例えばアニオンとして、ＢＦ４− 、
ＡＳＦ６″″、ＳｂＦも″″、ＰＦ６−１ＣＩ０４″″
、５０４２−および芳香族スルホン酸アニオン金属錯体
アニオン、また、カチオンとしてＨｌ、４級アンモニウ
ムカチオン、リチウム、ナトリウムまたはカリウムなど
を例示することかできるが、特にこれらに限定されるも
のではない。As the electrolyte, for example, as an anion, BF4-,
ASF6″″, SbF also″″, PF6-1CI04″″
, 5042- and aromatic sulfonic acid anions, metal complex anions, and cations such as H1, quaternary ammonium cations, lithium, sodium, and potassium, but are not particularly limited thereto.
また、溶媒としては、例えば、水、アセトニトリル、ベ
ンゾニトリル、プロレンカーボネイト、γ−ブチロラク
トン、ジクロルメタン、ジオキサン、ジメチルホルムア
ミド、あるいはニトロメタン、ニトロエタン、ニトロプ
ロパン、ニトロベンゼンなどのニトロ系溶媒などを挙げ
ることができるが、特にこれらに限定されるものではな
い。Examples of the solvent include water, acetonitrile, benzonitrile, prolene carbonate, γ-butyrolactone, dichloromethane, dioxane, dimethylformamide, and nitro solvents such as nitromethane, nitroethane, nitropropane, and nitrobenzene. However, it is not particularly limited to these.
この中でも、単量体としてピロール系化合物、電解質と
して、芳香族スルホン酸アニオン、金属錯体アニオン、
溶媒の水あるいは、アセトニトリルを用いたポリピロー
ルが機械的強度に優れ、また電界シールド効果も高い。Among these, pyrrole compounds are used as monomers, aromatic sulfonic acid anions, metal complex anions, and electrolytes are used as monomers.
Polypyrrole using water or acetonitrile as a solvent has excellent mechanical strength and also has a high electric field shielding effect.
電解重合方法としては、定電圧電解法、定電流電解法、
定電位電解法、電位掃引法などいずれもが可能ではある
が、定電流電解法が量産性から考えて好ましい。Electrolytic polymerization methods include constant voltage electrolysis, constant current electrolysis,
Although both the constant potential electrolysis method and the potential sweep method are possible, the constant current electrolysis method is preferable in terms of mass productivity.
電極を構成する材料としては、例えばＡＵ、Ｐｔ、Ｎｉ
、ＡＩ、ステンレス鋼、ＳｎＯ２、Ｉｎ２Ｏ３、炭素体
などを挙げることができるが、先に示した様に電極に本
発明の電磁シールド材の金属層に当る金属箔を用いるこ
とを考えると厚さは３０μｍ以下が好ましく、重量、経
済性を考慮してＡ１が最も好ましい。一般にＡ１金属表
面には、絶縁性の酸化被膜を形成し、電解用電極として
は不適切であるが、機械的研摩、電解研摩、Ｍ処理など
により酸化被膜を除去し、電解用電極とすることができ
るが、待に機械的研摩、電解研摩をすることにより、Ａ
１表面にはミクロな複雑な凹凸を形成し、表面積は増大
することができ、これを電極として電解重合を行った場
合、重合する導電性高分子はＡ１表面のミクロな凹凸を
埋没させるように重合していくので、Ａ１金属と導電性
高分子との接合はより良好となる。Examples of materials constituting the electrode include AU, Pt, and Ni.
, AI, stainless steel, SnO2, In2O3, carbon material, etc. However, considering that the metal foil corresponding to the metal layer of the electromagnetic shielding material of the present invention is used for the electrode as shown earlier, the thickness is The thickness is preferably 30 μm or less, and A1 is most preferred in consideration of weight and economical efficiency. Generally, an insulating oxide film is formed on the surface of A1 metal, making it unsuitable for use as an electrode for electrolysis, but the oxide film can be removed by mechanical polishing, electrolytic polishing, M treatment, etc., and used as an electrode for electrolysis. However, by first performing mechanical polishing and electrolytic polishing, A
Complex microscopic irregularities can be formed on the surface of A1, increasing the surface area, and when electrolytic polymerization is performed using this as an electrode, the conductive polymer that polymerizes will bury the microscopic irregularities on the A1 surface. As the polymerization progresses, the bond between the A1 metal and the conductive polymer becomes better.
また、本発明に使用する金属層を構成する金属としては
、上記のように電解重合時の金属電極が好ましいが、そ
の他の金属としてはＣＬＪ。Further, as the metal constituting the metal layer used in the present invention, the metal electrode used in electrolytic polymerization as described above is preferable, but other metals include CLJ.
１：ｅ、Ｍｇなどを例示することができる。1:e, Mg, etc. can be exemplified.
これらの金Ｒ層は、それ単独においても電磁シールド効
果を示すが、前述したような電界シールド効果を有し、
また機械的強度の強い導電性高分子層を積層することに
より強靭で軽量薄型であり、電磁シールド効果の高い電
磁シールド積層体が提供できる。These gold R layers exhibit an electromagnetic shielding effect by themselves, but they also have the electric field shielding effect as described above,
Furthermore, by laminating electrically conductive polymer layers with high mechanical strength, it is possible to provide an electromagnetic shielding laminate that is strong, lightweight, and thin, and has a high electromagnetic shielding effect.
本発明の電磁シールド積層体の構成としては、目的に応
じて種々の態様があるが、以下に代表的な構成例を挙げ
て、図面により説明する。Although there are various configurations of the electromagnetic shielding laminate of the present invention depending on the purpose, typical configuration examples will be described below with reference to the drawings.
第１図〜第４図は、粘着テープ又は粘着フィルムとして
用いた例、第５図はボックス状構造体として用いた例で
ある。1 to 4 show examples of use as an adhesive tape or adhesive film, and FIG. 5 shows an example of use as a box-like structure.
第１図、第２図の積層体は、粘着剤層２上に導電性高分
子４、ＡＩ層３を形成したものである。The laminates shown in FIGS. 1 and 2 have a conductive polymer 4 and an AI layer 3 formed on an adhesive layer 2.
例えば、粘着剤としてアクリルエマルジョンのようなも
のを上記層のフィルムにコーティングした後、剥離紙１
でラミネートすることによって製造される。For example, after coating the film of the above layer with something like acrylic emulsion as an adhesive, release paper
Manufactured by laminating.
第３図は、第１図の導電性高分子の上に、ざらに保護層
５を形成しｈものである。このような保護層５を設ける
ことにより保存性、耐炎性、対屈折性を向上させること
ができるので、その材料は目的に応じて適宜選択される
。In FIG. 3, a protective layer 5 is roughly formed on the conductive polymer shown in FIG. 1. By providing such a protective layer 5, the storage stability, flame resistance, and anti-refraction properties can be improved, so the material thereof is appropriately selected depending on the purpose.
第４図は、プラスチックを所定のボックス形状に成型し
たちの６を補強剤として用い、この上に導電性高分子４
、Ａ１１３を配置したもので、シールドボックスとして
応用可能である。Figure 4 shows plastic molded into a predetermined box shape, 6 is used as a reinforcing agent, and conductive polymer 4 is placed on top of this as a reinforcing agent.
, A113 are arranged, and can be applied as a shield box.
このようなボックス状のものは、用途に応じて形状を適
宜選択可能である。The shape of such a box shape can be appropriately selected depending on the purpose.
以下に実施例を挙げ、本発明をさらに詳細に説明する。The present invention will be explained in more detail with reference to Examples below.
［実施例１］
酸化被膜を取り除いである厚さ２０μ乳のエツチドアル
ミ箔を正極、負極をＮｉ板とし、０．０５Ｈパラトルエ
ンスルホン醒０．１Ｍピロールをアセトニトリルに溶解
させた溶液を電解液として４ｖ定電圧電解により２０μ
ｍのポリピロールをＡ１上に合成した。この積層体フィ
ルムにアクリル樹脂系粘着剤アロンタック［東亜合成社
製Ｓ−１２１］を約４μの厚さに塗布し、１５ｏｆｉｘ
１５０ｇ。[Example 1] Etched aluminum foil with a thickness of 20 μm from which the oxide film has been removed was used as the positive electrode, a Ni plate was used as the negative electrode, and a solution of 0.1M pyrrole dissolved in 0.05H paratoluene sulfone dissolved in acetonitrile was used as the electrolyte at 4V. 20μ by constant voltage electrolysis
m polypyrrole was synthesized on A1. An acrylic resin adhesive Arontack [S-121 manufactured by Toagosei Co., Ltd.] was applied to this laminate film to a thickness of about 4μ, and 15ofix
150g.
厚さ２ｓのアクリル板に固定した後、タケダ理研法によ
り減衰率（ｄＢ）を測定して電磁シールド効果及び耐折
強ざを測定した。After fixing it on an acrylic plate with a thickness of 2 seconds, the attenuation rate (dB) was measured using the Takeda Riken method to measure the electromagnetic shielding effect and bending strength.
［実施例２］
実施例１のＡＩの代りに、市販のアルミホイル（厚さ１
０μｍ）をエメリー紙により研摩し酸化被膜を取り除い
たものを正極に用いる以外は実施例１と同じ電解液で厚
さ３０μｍのポリピロールを合成して電磁シールド材を
製造し実施例１と同様にして電磁シールド効果及び耐折
強ざを測定した。[Example 2] Instead of AI in Example 1, commercially available aluminum foil (thickness 1
An electromagnetic shielding material was produced by synthesizing polypyrrole with a thickness of 30 μm using the same electrolyte as in Example 1, except that the material (0 μm) was polished with emery paper to remove the oxide film and used as the positive electrode. The electromagnetic shielding effect and bending strength were measured.
［実施例３］
実施例１の０．０５Ｍパラトルエンスルホン酸をパラト
ルエンスルホン酸ナトリウムに換える以外は実施例１と
同様にして電子シールド材を製造し電磁シールド効果及
び耐折強ざを測定した。[Example 3] An electronic shielding material was manufactured in the same manner as in Example 1 except that 0.05M para-toluenesulfonic acid in Example 1 was replaced with sodium para-toluenesulfonate, and the electromagnetic shielding effect and bending strength were measured. .
［実施例４］
実施例２の電解液を０．０５８αナフタレンスルホン酸
ナトリウムをアセトニトリル水（１：１）混合溶媒に溶
解したものを電解液に用いる以外は実施例２と同様にし
て電磁シールド材を製造し電磁シールド効果及び耐折強
ざを測定した。[Example 4] An electromagnetic shielding material was prepared in the same manner as in Example 2, except that the electrolyte of Example 2 was prepared by dissolving 0.058α sodium naphthalene sulfonate in a mixed solvent of acetonitrile water (1:1). The electromagnetic shielding effect and bending strength were measured.
［比較例１］
正極にネサガラス（３０Ω／ｃｄ）、対極をＮｉ板とし
、０．０５８パラトルエンスルホン酸、０．０１Ｈピロ
ールをアセトニトリルに溶解させた溶液中で４ｖ定電圧
により４０μｍのポリピロールを合成した。合成したポ
リピロールをネサガラスより剥離させたポリピロールの
電磁シールド効果及び耐折強さを実施例１と同じ方法で
確認した。[Comparative Example 1] Nesa glass (30Ω/cd) was used as the positive electrode, Ni plate was used as the counter electrode, and 40 μm polypyrrole was synthesized using a constant voltage of 4V in a solution in which 0.058 p-toluenesulfonic acid and 0.01H pyrrole were dissolved in acetonitrile. did. The electromagnetic shielding effect and folding strength of the synthesized polypyrrole was peeled from Nesa glass and the electromagnetic shielding effect and folding strength were confirmed in the same manner as in Example 1.
［比較例２］。[Comparative Example 2].
厚さ１０μｍの市販のＡＩ箔の電磁シールド効果及び耐
折強さを実施例１と同じ方法でｖＦ１認した。The electromagnetic shielding effect and folding strength of a commercially available AI foil with a thickness of 10 μm were evaluated by vF1 using the same method as in Example 1.
［効 果］
以上説明したように、本発明の電磁シールドフィルム積
層体は、軽量で薄型でありながら強靭であり、ざらに高
性能の電磁シールド効果をもたらすことができる。[Effects] As explained above, the electromagnetic shielding film laminate of the present invention is lightweight and thin, yet strong, and can provide a highly efficient electromagnetic shielding effect.
第１〜４図は、本発明の電磁シールド積層体を粘着テー
プあるいはフィルムとして利用した場合の例を説明する
図。
１・・・剥離紙、２・・・粘着剤、３・・・アルミニウ
ム層、４・・・導電性高分子層、５・・・保護層、６・
・・補強剤。1 to 4 are diagrams illustrating examples in which the electromagnetic shielding laminate of the present invention is used as an adhesive tape or film. DESCRIPTION OF SYMBOLS 1... Release paper, 2... Adhesive, 3... Aluminum layer, 4... Conductive polymer layer, 5... Protective layer, 6...
...Reinforcing agent.
Claims (1)
シールド積層体。An electromagnetic shielding laminate characterized by having a conductive polymer layer and a metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28842287A JPH01130595A (en) | 1987-11-17 | 1987-11-17 | Electromagnetic shielding laminated body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28842287A JPH01130595A (en) | 1987-11-17 | 1987-11-17 | Electromagnetic shielding laminated body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130595A true JPH01130595A (en) | 1989-05-23 |
Family
ID=17730014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28842287A Pending JPH01130595A (en) | 1987-11-17 | 1987-11-17 | Electromagnetic shielding laminated body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130595A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012124466A (en) * | 2010-11-18 | 2012-06-28 | Nitto Denko Corp | Adhesive film for semiconductor device and semiconductor device |
| JP2012186222A (en) * | 2011-03-03 | 2012-09-27 | Nagase Chemtex Corp | Molding electromagnetic wave shield sheet and electromagnetic wave shield molded body |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61219642A (en) * | 1985-03-26 | 1986-09-30 | 株式会社リコー | Electromagnetic shield laminate |
-
1987
- 1987-11-17 JP JP28842287A patent/JPH01130595A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61219642A (en) * | 1985-03-26 | 1986-09-30 | 株式会社リコー | Electromagnetic shield laminate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012124466A (en) * | 2010-11-18 | 2012-06-28 | Nitto Denko Corp | Adhesive film for semiconductor device and semiconductor device |
| JP2012186222A (en) * | 2011-03-03 | 2012-09-27 | Nagase Chemtex Corp | Molding electromagnetic wave shield sheet and electromagnetic wave shield molded body |
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