JPH01130592U - - Google Patents
Info
- Publication number
- JPH01130592U JPH01130592U JP2661688U JP2661688U JPH01130592U JP H01130592 U JPH01130592 U JP H01130592U JP 2661688 U JP2661688 U JP 2661688U JP 2661688 U JP2661688 U JP 2661688U JP H01130592 U JPH01130592 U JP H01130592U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- ceramic substrate
- circuit device
- adhesively fixed
- circuit member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988026616U JPH064634Y2 (ja) | 1988-02-29 | 1988-02-29 | 電子回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988026616U JPH064634Y2 (ja) | 1988-02-29 | 1988-02-29 | 電子回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01130592U true JPH01130592U (fr) | 1989-09-05 |
| JPH064634Y2 JPH064634Y2 (ja) | 1994-02-02 |
Family
ID=31248405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988026616U Expired - Lifetime JPH064634Y2 (ja) | 1988-02-29 | 1988-02-29 | 電子回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064634Y2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022244065A1 (fr) * | 2021-05-17 | 2022-11-24 | 三菱電機株式会社 | Dispositif à semi-conducteur |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55127044A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Electric circuit substrate and its manufacture |
-
1988
- 1988-02-29 JP JP1988026616U patent/JPH064634Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55127044A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Electric circuit substrate and its manufacture |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022244065A1 (fr) * | 2021-05-17 | 2022-11-24 | 三菱電機株式会社 | Dispositif à semi-conducteur |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH064634Y2 (ja) | 1994-02-02 |