JPH01130552U - - Google Patents
Info
- Publication number
- JPH01130552U JPH01130552U JP2661788U JP2661788U JPH01130552U JP H01130552 U JPH01130552 U JP H01130552U JP 2661788 U JP2661788 U JP 2661788U JP 2661788 U JP2661788 U JP 2661788U JP H01130552 U JPH01130552 U JP H01130552U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- power semiconductor
- semiconductor chip
- fixed
- thermally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2661788U JPH01130552U (US06521211-20030218-C00004.png) | 1988-02-29 | 1988-02-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2661788U JPH01130552U (US06521211-20030218-C00004.png) | 1988-02-29 | 1988-02-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130552U true JPH01130552U (US06521211-20030218-C00004.png) | 1989-09-05 |
Family
ID=31248407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2661788U Pending JPH01130552U (US06521211-20030218-C00004.png) | 1988-02-29 | 1988-02-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130552U (US06521211-20030218-C00004.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56140633A (en) * | 1980-04-04 | 1981-11-04 | Nec Corp | Electronic device |
| JPS5740965A (en) * | 1980-08-26 | 1982-03-06 | Nec Corp | Hybrid integrated circuit device |
-
1988
- 1988-02-29 JP JP2661788U patent/JPH01130552U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56140633A (en) * | 1980-04-04 | 1981-11-04 | Nec Corp | Electronic device |
| JPS5740965A (en) * | 1980-08-26 | 1982-03-06 | Nec Corp | Hybrid integrated circuit device |
