JPH01130549U - - Google Patents
Info
- Publication number
- JPH01130549U JPH01130549U JP2778188U JP2778188U JPH01130549U JP H01130549 U JPH01130549 U JP H01130549U JP 2778188 U JP2778188 U JP 2778188U JP 2778188 U JP2778188 U JP 2778188U JP H01130549 U JPH01130549 U JP H01130549U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- chip
- elastic
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2778188U JPH01130549U (pt) | 1988-03-01 | 1988-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2778188U JPH01130549U (pt) | 1988-03-01 | 1988-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130549U true JPH01130549U (pt) | 1989-09-05 |
Family
ID=31250575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2778188U Pending JPH01130549U (pt) | 1988-03-01 | 1988-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130549U (pt) |
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1988
- 1988-03-01 JP JP2778188U patent/JPH01130549U/ja active Pending