JPH01128958U - - Google Patents

Info

Publication number
JPH01128958U
JPH01128958U JP2194688U JP2194688U JPH01128958U JP H01128958 U JPH01128958 U JP H01128958U JP 2194688 U JP2194688 U JP 2194688U JP 2194688 U JP2194688 U JP 2194688U JP H01128958 U JPH01128958 U JP H01128958U
Authority
JP
Japan
Prior art keywords
soldered
immersed
reaction
tilting
pulling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2194688U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2194688U priority Critical patent/JPH01128958U/ja
Publication of JPH01128958U publication Critical patent/JPH01128958U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図〜第３図は本考案にかかる半田付け装置
を用いた半田付け工程の説明図である。 １ａ，１ｂ……エアシリンダ、２……支持板、
３ａ，３ｂ……アーム、４……ヒンジ、５……反
応槽、６……ヒーター、７……プリント回路基板
、８……部品、９……反応液、１０……反応液滴
。 1 to 3 are explanatory diagrams of a soldering process using a soldering device according to the present invention. 1a, 1b...Air cylinder, 2...Support plate,
3a, 3b... Arm, 4... Hinge, 5... Reaction tank, 6... Heater, 7... Printed circuit board, 8... Parts, 9... Reaction liquid, 10... Reaction droplet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被半田付け物を有機酸素金属塩を含む反応液に
浸漬し、反応後に引き上げる半田付け装置におい
て、引き上げ時に、被半田付け物を浸漬状態から
傾けて引き上げる機構を有することを特徴とする
半田付け装置。 A soldering device in which an object to be soldered is immersed in a reaction solution containing an organic oxygen metal salt and pulled up after the reaction, characterized by having a mechanism for tilting and lifting the object to be soldered from the immersed state at the time of pulling up. .
JP2194688U 1988-02-22 1988-02-22 Pending JPH01128958U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2194688U JPH01128958U (en) 1988-02-22 1988-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2194688U JPH01128958U (en) 1988-02-22 1988-02-22

Publications (1)

Publication Number Publication Date
JPH01128958U true JPH01128958U (en) 1989-09-01

Family

ID=31239623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2194688U Pending JPH01128958U (en) 1988-02-22 1988-02-22

Country Status (1)

Country Link
JP (1) JPH01128958U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0481270A (en) * 1990-07-19 1992-03-13 Uchiyama Kikai Seisakusho:Kk Solder dipping device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54218A (en) * 1978-03-17 1979-01-05 Hitachi Metals Ltd Production of nip ring for pipe joint
JPS543148A (en) * 1977-06-08 1979-01-11 Asahi Chem Ind Co Ltd Thermoplastic elastomeric composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS543148A (en) * 1977-06-08 1979-01-11 Asahi Chem Ind Co Ltd Thermoplastic elastomeric composition
JPS54218A (en) * 1978-03-17 1979-01-05 Hitachi Metals Ltd Production of nip ring for pipe joint

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0481270A (en) * 1990-07-19 1992-03-13 Uchiyama Kikai Seisakusho:Kk Solder dipping device

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