JPH01128586A - Printed board connecting method - Google Patents
Printed board connecting methodInfo
- Publication number
- JPH01128586A JPH01128586A JP62285523A JP28552387A JPH01128586A JP H01128586 A JPH01128586 A JP H01128586A JP 62285523 A JP62285523 A JP 62285523A JP 28552387 A JP28552387 A JP 28552387A JP H01128586 A JPH01128586 A JP H01128586A
- Authority
- JP
- Japan
- Prior art keywords
- pole
- printed circuit
- board
- wiring patterns
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 description 21
- 230000000694 effects Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、プリント基板の電気的接続方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for electrically connecting printed circuit boards.
従来、プリント基板を着脱可能に接続するやり方として
、コネクタを用いているが、通常配線パターンのピンチ
が１．２７ｍ以上となり、結合部分が大型となる欠点を
有している。Conventionally, connectors have been used to removably connect printed circuit boards, but they have the drawback that the pinch of the wiring pattern is usually 1.27 m or more, and the connecting portion is large.
また、配線パターンのピッチが１．２Ｌ＋ｎ以下の着脱
可能な接続法として、プリント基板の対向する電極間に
、清明なシリコーンゴムシートの厚み方向に金属細線を
埋め込んだ異方導電性の精密ゴムコネクタを挾み、外側
から適当な圧力を加えて、夫々の電極を接続できる手段
（例えば、東し、精密ゴムコネクタエラスチック）が公
知であるが、加圧機構が必要であり、位置合わせに特別
な治具が必要であるため、簡単に着脱は行なうことはで
きない。In addition, as a removable connection method with a wiring pattern pitch of 1.2L+n or less, an anisotropically conductive precision rubber connector in which fine metal wires are embedded in the thickness direction of a clear silicone rubber sheet between opposing electrodes of a printed circuit board. There are known means to connect each electrode by sandwiching the electrodes and applying appropriate pressure from the outside (for example, precision rubber connector elastic), but this requires a pressure mechanism and requires special alignment. Since it requires a jig, it cannot be easily attached and detached.
本発明は、配線パターンのピッチが小さい場合にも、二
つのプリント基板の電極間の位置合せを行ないかつ適当
な力で着脱容易に接続しうる小型で薄板状からなるプリ
ント基板の接続方法を提供するものである。The present invention provides a method for connecting small and thin printed circuit boards that can align the electrodes of two printed circuit boards and connect them easily with appropriate force even when the pitch of the wiring patterns is small. It is something to do.
本発明は、前記目的を達成するため、二枚のプリント基
板を着脱可能に電気的に接続することができるプリント
基板接続法において、夫々のプリント基板の一面に接続
される配線パターンを形成すると共に、夫々のプリント
基板の他面に配線パターンの位置ぎめをなしうる一定ピ
ンチで且つ異なる極性の磁石を隣接配列し、二つのプリ
ント基板に設けた磁石の吸着力の作用位置を配線パター
ンの接続位置としたことを特徴とするものである。In order to achieve the above object, the present invention provides a printed circuit board connection method that enables two printed circuit boards to be electrically connected in a detachable manner, in which a wiring pattern to be connected to one surface of each printed circuit board is formed and On the other side of each printed circuit board, magnets with a certain pinch and different polarity are arranged adjacently to each other to position the wiring pattern, and the position where the attractive force of the magnets provided on the two printed circuit boards acts is determined as the connection position of the wiring pattern. It is characterized by the following.
第１図には、本発明の二枚のプリント基板の接続端の接
合前の状態を斜視図により示し、第２図では、二枚のプ
リント基板が接合された状態での拡大した断面を示して
いる。FIG. 1 shows a perspective view of the connecting ends of two printed circuit boards of the present invention before they are joined together, and FIG. 2 shows an enlarged cross-section of the two printed circuit boards joined together. ing.
上方のプリント基板（以下上基板という）１と下方のプ
リント基板（以下下基板という）２の夫々に形成した配
線パターン３，３・・・、４，４・・・を介して上基板
１と下基板２とを接続するために、上基板１と下基板２
の各接続端における配線パターン３，３・・・、４，４
・・・を形成した反対面の部分に、磁石群５ （５ａ、
５ｂ、５ｃ、５ｄ、５ｅ。The upper printed circuit board (hereinafter referred to as upper board) 1 and the lower printed circuit board (hereinafter referred to as lower board) 2 are connected to each other via wiring patterns 3, 3, 4, 4, . In order to connect the lower board 2, the upper board 1 and the lower board 2 are connected.
Wiring patterns 3, 3..., 4, 4 at each connection end of
... is formed on the opposite surface, magnet group 5 (5a,
5b, 5c, 5d, 5e.
・・・）と磁石群６ （６ａ、６ｂ、６ｃ、６ｄ、６ｅ
。) and magnet group 6 (6a, 6b, 6c, 6d, 6e
.
・・・）とが夫々設けられている。) are provided respectively.
上基板１の磁石群５は、下基板２の対向面に対して順次
Ｓ極、Ｎ極、Ｓ極、Ｎ極、・・・を位置させるように、
各磁石５ ａ、５ ｂ Ｈ５Ｃｙ ５ ｄ Ｈ５０Ｈ・
・・を交互にＮ Ｓ 、 Ｓ Ｎ 、 Ｎ Ｓ・・・の
極性として一定ピッチで配置し、下基板２の磁石群６は
、上基板１の対向面に対して順次Ｎ極、Ｓ極、Ｎ極、Ｓ
極。The magnet group 5 of the upper substrate 1 is arranged such that the S pole, N pole, S pole, N pole, etc. are sequentially positioned with respect to the opposing surface of the lower substrate 2.
Each magnet 5 a, 5 b H5Cy 5 d H50H・
... are arranged at a constant pitch with the polarities of N S , S N , N S ... alternately, and the magnet group 6 of the lower substrate 2 has N pole, S pole, N pole, S
very.
・・・を位置させるように、各磁石６ａ、６ｂ、６ｃ＋
５ ｄ 、 ５ ｅ 、−・−を交互にＳ Ｎ 、 Ｎ
Ｓ 、 Ｓ Ｎ 、 −の極性として一定ピンチで配
置している。Each magnet 6a, 6b, 6c+
5 d, 5 e, -・- alternately SN, N
The polarities of S, SN, and - are arranged with a certain pinch.
このため、二つの上・下基板１．２の配線パターン３，
３・・・、４，４・・・は、第２図に示されるように、
磁石５ａ 、６ａの対向面をＳ極、Ｎ極、磁石５ｂ、６
ｂの対向面をＮ極、Ｓ極、磁石５ｃ。For this reason, the wiring pattern 3 of the two upper and lower boards 1.2,
3..., 4, 4... are as shown in FIG.
The opposing surfaces of magnets 5a and 6a are S pole and N pole, and magnets 5b and 6
The opposite surface of b is the north pole and the south pole, and the magnet 5c.
６ｃの対向面をＳ極、Ｎ極・・・とし、対向面の各吸着
力により位置ぎめされて正しい位置で結合される。上基
板１の磁石５ｂに着目すると、下基板２の磁石６ａ、６
ｃとは反発力が作用し、磁石６ｂと吸着力が働き、この
ような作用が上基板１と下基板２との間において、全体
として位置ぎめの作用を与え、上下方向の吸着力となっ
て、よ基板１と下基板２とを正しい位置で固定すること
ができる。The facing surfaces of 6c are set as S poles, N poles, etc., and are positioned by the adsorption forces of the facing surfaces and bonded at correct positions. Focusing on the magnets 5b on the upper substrate 1, the magnets 6a and 6 on the lower substrate 2
A repulsive force acts on c, and an adsorption force acts on the magnet 6b, and this action gives a positioning effect as a whole between the upper substrate 1 and the lower substrate 2, and becomes an adsorption force in the vertical direction. Thus, the upper substrate 1 and the lower substrate 2 can be fixed at correct positions.
本発明の上基板１、下基板２の接続部に用いられる磁石
としては、プラスチック磁石のように、樹脂中に磁性体
を分散させて磁化したものでもよい。The magnet used in the connection between the upper substrate 1 and the lower substrate 2 of the present invention may be a magnet made by dispersing a magnetic material in a resin, such as a plastic magnet.
また、上基Ｆｉ１、下基板２の接続部に磁石を取付ける
手段としては、チップ状の磁石をｒＣのグイボンディン
グと同様の方法で精度よく位置決めされた所に接着する
ことができるし、またプリント基板に磁性体を取付けた
後、磁化することによって形成することができる。In addition, as a means for attaching a magnet to the connection part between the upper substrate Fi1 and the lower substrate 2, a chip-shaped magnet can be glued at a precisely positioned place using the same method as rc bonding, or printed It can be formed by attaching a magnetic material to the substrate and then magnetizing it.
第３図から第５図には、本発明の他の実施例を示す。3 to 5 show other embodiments of the invention.
第３図の実施例では、通常のプリント基板であるリジッ
ド基板とフレキシブル基板の組合せに好適なプリント基
板の接続法を示している。すなわち、フレキシブル基板
ＬＡと磁石群５との間にシリコーンゴム等の弾性体７を
介在させている。このため、リジッド基板２Ａにおける
反りや凹凸がある場合においても、フレキシブル基板Ｉ
Ａ側に設けた弾性体７がリジッド基板２Ａの反りや凹凸
に追随しうる作用をもたらし、フレキシブル基板ＩＡと
リジッド基板２への配線パターン３，４を磁石群５，６
により確実に密着させることができる。The embodiment shown in FIG. 3 shows a method of connecting a printed circuit board suitable for a combination of a rigid board and a flexible board, which are ordinary printed circuit boards. That is, an elastic body 7 such as silicone rubber is interposed between the flexible substrate LA and the magnet group 5. Therefore, even if the rigid substrate 2A has warpage or unevenness, the flexible substrate I
The elastic body 7 provided on the A side has the effect of following the warpage and unevenness of the rigid board 2A, and connects the wiring patterns 3 and 4 to the flexible board IA and the rigid board 2 to the magnet groups 5 and 6.
This allows for more reliable contact.
第４図の他の実施例では、上基板、下基板がリジッド基
板である場合におけるプリント基板の接続法を示してい
る。上基板ＩＢと下基板２Ｂはりジッド基板からなり、
これらの上基板ＩＢと下基板２Ｂとの間の配線パターン
３，４の間に、異方導電性コネクタ８を介在させること
により、リジッド基板からなる上基板ＩＢ、下基板２Ｂ
の反り等による変位があっても、それら基板ＩＢ、２Ｂ
間に位置する配線パターン３，４は、磁石群５゜６の作
用のもとに、異方導電性コネクタ８により確実に接続さ
れる。Another embodiment shown in FIG. 4 shows a method of connecting printed circuit boards when the upper and lower boards are rigid boards. It consists of an upper board IB and a lower board 2B.
By interposing an anisotropically conductive connector 8 between the wiring patterns 3 and 4 between the upper board IB and the lower board 2B, the upper board IB and the lower board 2B made of rigid boards
Even if there is a displacement due to warpage, etc., those boards IB, 2B
The wiring patterns 3 and 4 located between them are reliably connected by the anisotropically conductive connector 8 under the action of the magnet group 5.6.
第５図の実施例は、直交する二枚のプリント基板を接続
する構成を示すものであり、細部の構造としては、プリ
ント基板と磁石群との間に弾性体を介在させることもで
きるし、またプリント基板の配線パターンの間に異方導
電性コネクタを介在させること等も可能である。The embodiment shown in FIG. 5 shows a configuration in which two orthogonal printed circuit boards are connected, and as for the detailed structure, an elastic body can be interposed between the printed circuit board and the magnet group, It is also possible to interpose an anisotropically conductive connector between the wiring patterns of the printed circuit board.
第５図では、垂直に配置した上基板１と水平に配置した
下基板２の各端部を弯曲せしめ、上基板１の弯曲部に磁
石群５を配置し、下基板２の弯曲部に設けた筒状部に磁
石群６を配置しており、上基板１と下基板２の対向面が
形成した導電パターン３，４を接合している。In FIG. 5, each end of the vertically arranged upper substrate 1 and the horizontally arranged lower substrate 2 are curved, and the magnet group 5 is arranged in the curved part of the upper board 1, and the magnet group 5 is arranged in the curved part of the lower board 2. A group of magnets 6 is arranged in the cylindrical part, and the conductive patterns 3 and 4 formed by the opposing surfaces of the upper substrate 1 and the lower substrate 2 are joined.
また、第５図の変形構造として、直交する二つのプリン
ト基板の端部を接合するため、接合端としての一方のプ
リント基板の端部を９０度屈曲せしめ、他方のプリント
基板の端部と平行に配置し、該平行端部を夫々のプリン
ト基板に取付けた磁石群により接合することができる。In addition, as a modified structure shown in Fig. 5, in order to join the ends of two orthogonal printed circuit boards, the end of one printed circuit board serving as the joining end is bent 90 degrees and parallel to the end of the other printed circuit board. The parallel ends can be joined by a group of magnets attached to the respective printed circuit boards.
本発明では、ツブインピッチを有するプリント基板の相
互接続を行なうに際して、正しい位置合せを容易になし
うると共にその位置合せ手段が接続保持機能をも兼ね合
せたものであり、しかも接続部の着脱を可能とする利点
を有している。従来のプリント基板の接続法と比較し、
本発明は簡単な手段により前記のすぐれた機能を有して
いるものである。In the present invention, when interconnecting printed circuit boards having a twin-in pitch, it is possible to easily achieve correct positioning, and the positioning means also has a connection holding function, and furthermore, the connecting portions can be attached and detached. It has the advantage of Compared to the conventional printed circuit board connection method,
The present invention provides the above-mentioned excellent functions using simple means.
第１図は本発明のプリント基板の接続部を分離した斜視
図、
第２図は本発明のプリント基板の接続部の断面図、
−
第３図、第４図は夫々本発明のプリント基板の接続部の
他の実施例を示す断面図、
第５図は本発明−の直交するプリント基板の接続を示す
斜視図である。
１ 、ＩＡ、ＩＢ・・・一方のプリント基板、２，２Ａ
、２Ｂ・・・他方のプリント基板、３・・・一方の配線
パターン、４・・・他方の配線パターン、５・・・一方
の磁石群、６・・・他方の磁石群。FIG. 1 is an isolated perspective view of the connecting portion of the printed circuit board of the present invention, FIG. 2 is a sectional view of the connecting portion of the printed circuit board of the present invention,
- FIGS. 3 and 4 are sectional views showing other embodiments of the connecting portion of the printed circuit board according to the present invention, and FIG. 5 is a perspective view showing the connection of orthogonal printed circuit boards according to the present invention. 1, IA, IB...one printed circuit board, 2, 2A
, 2B...other printed circuit board, 3...one wiring pattern, 4...other wiring pattern, 5...one magnet group, 6...other magnet group.
Claims (1)
とができるプリント基板接続法において、夫々のプリン
ト基板の一面に接続される配線パターンを形成すると共
に、夫々のプリント基板の他面に配線パターンの位置ぎ
めをなしうる一定ピッチで且つ異なる極性の磁石を隣接
配列し、二つのプリント基板に設けた磁石の吸着力の作
用位置を配線パターンの接続位置としたことを特徴とす
るプリント基板接続法。In the printed circuit board connection method that allows two printed circuit boards to be removably electrically connected, a wiring pattern to be connected is formed on one side of each printed circuit board, and a wiring pattern is formed on the other side of each printed circuit board. A printed circuit board connection method characterized by arranging magnets adjacent to each other at a constant pitch and of different polarities to achieve positioning, and setting the connection position of the wiring pattern as the position where the attractive force of the magnets provided on the two printed circuit boards acts. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62285523A JPH01128586A (en) | 1987-11-13 | 1987-11-13 | Printed board connecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62285523A JPH01128586A (en) | 1987-11-13 | 1987-11-13 | Printed board connecting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01128586A true JPH01128586A (en) | 1989-05-22 |
Family
ID=17692631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62285523A Pending JPH01128586A (en) | 1987-11-13 | 1987-11-13 | Printed board connecting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01128586A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003032698A1 (en) * | 2001-10-05 | 2003-04-17 | Fujitsu Limited | Dividable and connectable printed circuit board |
| JP2006120498A (en) * | 2004-10-22 | 2006-05-11 | Smk Corp | Contact and connector using the same |
| JP2007250482A (en) * | 2006-03-20 | 2007-09-27 | Japan Aviation Electronics Industry Ltd | Magnetic power connector |
| US20120038382A1 (en) * | 2010-04-07 | 2012-02-16 | Advantest Corporation | Probe and method of manufacturing same |
| FR3049811A1 (en) * | 2016-04-04 | 2017-10-06 | Ecole Nat Superieure Des Mines | FLEXIBLE ELECTRONIC DEVICE COMPRISING AT LEAST TWO FLEXIBLE ELECTRONIC CARDS NOT PERMANENTLY COUPLED |
| EP4203199A4 (en) * | 2021-01-05 | 2024-03-13 | LG Energy Solution, Ltd. | Connection structure |
-
1987
- 1987-11-13 JP JP62285523A patent/JPH01128586A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003032698A1 (en) * | 2001-10-05 | 2003-04-17 | Fujitsu Limited | Dividable and connectable printed circuit board |
| JP2006120498A (en) * | 2004-10-22 | 2006-05-11 | Smk Corp | Contact and connector using the same |
| JP4532234B2 (en) * | 2004-10-22 | 2010-08-25 | Ｓｍｋ株式会社 | connector |
| JP2007250482A (en) * | 2006-03-20 | 2007-09-27 | Japan Aviation Electronics Industry Ltd | Magnetic power connector |
| US20120038382A1 (en) * | 2010-04-07 | 2012-02-16 | Advantest Corporation | Probe and method of manufacturing same |
| US8779791B2 (en) * | 2010-04-07 | 2014-07-15 | Advantest Corporation | Method of manufacturing probe having boards connected by magnets |
| FR3049811A1 (en) * | 2016-04-04 | 2017-10-06 | Ecole Nat Superieure Des Mines | FLEXIBLE ELECTRONIC DEVICE COMPRISING AT LEAST TWO FLEXIBLE ELECTRONIC CARDS NOT PERMANENTLY COUPLED |
| EP4203199A4 (en) * | 2021-01-05 | 2024-03-13 | LG Energy Solution, Ltd. | Connection structure |
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