JPH03145074A - Connection method for flexible substrate - Google Patents
Connection method for flexible substrateInfo
- Publication number
- JPH03145074A JPH03145074A JP1281222A JP28122289A JPH03145074A JP H03145074 A JPH03145074 A JP H03145074A JP 1281222 A JP1281222 A JP 1281222A JP 28122289 A JP28122289 A JP 28122289A JP H03145074 A JPH03145074 A JP H03145074A
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- terminal
- positioning
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims description 13
- 230000035515 penetration Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、フレキシブル基板の接続方式に関するもので
、とくに、小型化の要求されるカメ・うやビデオカメラ
等で、基板の薄さから配線材としても利用されているフ
レキシブル基板とプリント基板の接続方式として好適な
ものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a connection method for flexible substrates, and is particularly applicable to cameras, cages, video cameras, etc. that require miniaturization, due to the thinness of the substrate. This is a suitable method for connecting flexible boards and printed circuit boards, which are also used as materials.
〔従来の技術〕・
従来から、フレキシブル基板とプリント基板の接続は、
加熱による圧着、ごて半田による半田付け、あるいはコ
ネクタによる接続方式等があった。[Conventional technology] - Traditionally, the connection between flexible circuit boards and printed circuit boards has been
Connection methods included crimping by heating, soldering with a soldering iron, and connectors.
しかしながら、前述した従来の技術では、いずれも自動
化が困難で、手作業で行なうため、作業効率が悪く、コ
ストが高くなってしまうという問題点があった。またフ
レキシブル基板のはがれ、端子のずれによる接触不良を
発生する可能性があるという問題点があった。However, the above-mentioned conventional techniques have problems in that they are difficult to automate and are performed manually, resulting in poor work efficiency and high costs. Further, there is a problem that the flexible substrate may peel off or contact failure may occur due to misalignment of the terminals.
本発明は、上記のような問題点を解決しようとするもの
である。すなわち、本発明は、自動化が可能となってコ
ストの低減を図ることができ、また端子の接触不良等が
生じないフレキシブル基板の接続方式を提供することを
目的とするものである。The present invention aims to solve the above problems. That is, an object of the present invention is to provide a flexible substrate connection method that enables automation, reduces costs, and does not cause terminal contact failure.
上記目的を達成するために、本発明のフレキシブル基板
の接続方式は、フレキシブル基板の端子とプリント基板
の端子が接する位置の近くに、前記両基板に設けられた
位置決め用の貫通部を有し、かつ、該位置決め用の貫通
部にクランプ材を通すことにより、前記フレキシブル基
板と前記プリント基板を接続して固定するようにした。In order to achieve the above object, the flexible board connection method of the present invention has a positioning penetration part provided in both the boards near the position where the terminal of the flexible board and the terminal of the printed circuit board contact, Moreover, the flexible board and the printed circuit board are connected and fixed by passing a clamp member through the positioning penetration part.
本発明によれば、フレキシブル基板の端子とプリント基
板の端子が接触するように、前記両基板に位置決め用の
穴あるいは切り欠きなどの貫通部を設け、該位置決め用
の貫通部にクランプ材を通し、前記両基板を接続して固
定するので、フレキシブル基板のはがれ、端子のずれ等
の接触不良が防止されるとともに、自動化が可能であっ
て、組み立て性を向上させることができる。According to the present invention, a through part such as a hole or a cutout for positioning is provided in both boards so that the terminal of the flexible board and the terminal of the printed circuit board come into contact with each other, and the clamp material is passed through the through part for positioning. Since the two substrates are connected and fixed, contact failures such as peeling of the flexible substrate and displacement of the terminals are prevented, automation is possible, and ease of assembly can be improved.
(実 施 例)
第1図ないし第3図は本発明の第1実施例を示している
。(Embodiment) FIGS. 1 to 3 show a first embodiment of the present invention.
′i41図において、101はクランプ材、102はフ
レキシブル基板、103はプリント基板である。フレキ
シブル基板102のプリント基板103側にはパターン
105.106.107.108109が、プリント基
板103にはパターン111゜112、113.114
.115.116が引かれており、クランプ材101を
位置決め用の貫通部としての穴104a、104b、に
挿入し、前記両基板102103を固定する構成となっ
ている。、 第2図と第3図は第1図の断面図であり、
クランプ材101は第2図に示されるように、先端が鍵
状になっており、位置決め用の穴104a、 104b
に挿入された後、フレキシブル基板102の端子201
とプリント基板103の端子202を常時はさむ力が加
わるように固定される。またクランプ材101は端子ど
うしの接触をよくするために、フレキシブル基板102
との接触面が鋸状になっている。In Figure 'i41, 101 is a clamp material, 102 is a flexible board, and 103 is a printed board. Patterns 105, 106, 107, 108, 109 are on the printed board 103 side of the flexible board 102, and patterns 111, 112, 113, 114 are on the printed board 103.
.. 115 and 116 are pulled, and the clamp member 101 is inserted into the holes 104a and 104b serving as a positioning through hole to fix both the substrates 102103. , Figures 2 and 3 are cross-sectional views of Figure 1,
As shown in FIG. 2, the clamp member 101 has a key-shaped tip and has positioning holes 104a and 104b.
After being inserted into the terminal 201 of the flexible board 102
and the terminals 202 of the printed circuit board 103 are fixed so that a force is always applied to them. In addition, the clamp material 101 is attached to the flexible substrate 102 in order to improve contact between the terminals.
The contact surface is serrated.
すなわち、フレキシブル基板102の端子201とプリ
ント基板103の端子202が接触する位置の近くに、
前記両基板102.103に設けた位置決め用の穴10
4a、104bにクランプ材101を挿入して、前記両
基板102,103をクランプ材101で固定するだけ
で、端子201.202間のずれ等の接触不良をなくし
、フレキシブル基板102のはがれを防止することがで
きる。また単純作業であるため、自動化も容易である。That is, near the position where the terminal 201 of the flexible board 102 and the terminal 202 of the printed circuit board 103 contact,
Positioning holes 10 provided in both substrates 102 and 103
By simply inserting the clamp material 101 into 4a and 104b and fixing both the boards 102 and 103 with the clamp material 101, poor contact such as misalignment between the terminals 201 and 202 can be eliminated, and peeling of the flexible board 102 can be prevented. be able to. Furthermore, since it is a simple task, it is easy to automate.
第4図は本発明の第2実施例を示している。FIG. 4 shows a second embodiment of the invention.
前述の第1実施例では、クランプ材101でもって2か
所で固定したが、この第2実施例では、3か所の位置決
め用の穴を設け、フレキシブル基板402とプリント基
部403をクランプ材401で固定している。In the first embodiment described above, the clamping material 101 was used to secure the flexible substrate 402 and the printed base 403 at two locations, but in this second embodiment, three positioning holes were provided, and the flexible substrate 402 and the printed base 403 were fixed using the clamping material 401. It is fixed at
すなわち、フレキシブル基板402には端子404.4
05.408.407があり、プリント基板403には
端子408.409.410.4ヱlがあり、前述の第
1実施例と同様に、クランプ材401を挿入することに
より、端子は、常時、はさむ力が加わるように固定され
る。つまり、フレキシブル基板402とプリント基板4
03には、位置決め用の貫通部としての穴が端子(パタ
ーン)を避けるようにして3か所に設けられており、ク
ランプ材401も3本の足で固定するように構成されて
いる。That is, the flexible board 402 has terminals 404.4.
05.408.407, and the printed circuit board 403 has terminals 408.409.410.4. Similarly to the first embodiment, by inserting the clamping material 401, the terminals are always connected. It is fixed so that a pinching force is applied. In other words, the flexible board 402 and the printed circuit board 4
In 03, holes as penetration parts for positioning are provided in three places so as to avoid the terminals (patterns), and the clamp member 401 is also configured to be fixed with three legs.
このように、前述の第1実施例では、クランプ材101
の2本の足で固定していたが、端子の数が増え、フレキ
シブル基板の幅が広くなると、2か所の固定では、十分
な接触圧が確保できないので、この第2実施例では、3
か所の位置決め用の穴を設け、クランプ材401の3本
の足で固定することにより、幅の広いフレキシプル基板
402(も対応できるようにしたものである。In this way, in the first embodiment described above, the clamp material 101
However, as the number of terminals increases and the width of the flexible board becomes wider, sufficient contact pressure cannot be secured by fixing in two places, so in this second embodiment, three
By providing holes for positioning at certain locations and fixing with the three legs of the clamp member 401, it is possible to accommodate a wide flexible board 402.
なお上記各実施例では、位置決め用の貫通部を穴にして
いるが、切り欠きにしてもよい。In each of the above embodiments, the positioning penetration portion is a hole, but it may be a notch.
以上説明したように、本発明によれば、フレキシブル基
板とプリント基板の接続において、前記両基板のそれぞ
れの端子が接する位置の近くに、前記両基板に設けられ
た位置決め用の貫通部にクランプ材を通すことにより、
前記フレキシブル基板と前記プリント基板を接続して固
定するので、前記フレキシブル基板のはがれ、端子のず
れ等の接触不良が防止されるとともに、自動化が可能で
あって、作業性がよくなるという効果を奏する。As explained above, according to the present invention, in connecting a flexible board and a printed circuit board, a clamp member is installed in a positioning through hole provided in both boards near the position where respective terminals of both boards touch. By passing
Since the flexible substrate and the printed circuit board are connected and fixed, poor contact such as peeling of the flexible substrate and displacement of terminals is prevented, automation is possible, and workability is improved.
第1図は本発明の第1実施を示した斜視図、第2図は第
1図の正面断面図、第3図は第1図の側面断面図、第4
図は本発明の第2実施例を示した正面断面図である。
101.401・・・クランプ材
102.402・・・フレキシブル基板103.403
・・・プリント基板
104a、104b・・・位置決め用の大地4名
第
図
第
図
第
図FIG. 1 is a perspective view showing a first implementation of the present invention, FIG. 2 is a front sectional view of FIG. 1, FIG. 3 is a side sectional view of FIG. 1, and FIG.
The figure is a front sectional view showing a second embodiment of the present invention. 101.401... Clamp material 102.402... Flexible board 103.403
...Printed circuit boards 104a, 104b...4 people for positioning
Claims (1)
する位置の近くに、前記両基板に設けられた位置決め用
の貫通部を有し、かつ、該位置決め用の貫通部にクラン
プ材を通すことにより、前記フレキシブル基板と前記プ
リント基板を接続して固定することを特徴とするフレキ
シブル基板の接続方式。 2 クランプ材におけるフレキシブル基板との接触面が
鋸状になっている請求項1記載のフレキシブル基板の接
続方式。 3 位置決め用の貫通部が、穴と切り欠きのいずれから
なる請求項1または2記載のフレキシブル基板の接続方
式。[Scope of Claims] 1. A through-hole for positioning is provided in both boards near the position where the terminal of the flexible board and the terminal of the printed circuit board come into contact, and a clamping material is provided in the through-hole for positioning. A method for connecting a flexible substrate, characterized in that the flexible substrate and the printed circuit board are connected and fixed by passing the flexible substrate through the printed circuit board. 2. The flexible substrate connection method according to claim 1, wherein the contact surface of the clamp material with the flexible substrate is serrated. 3. The flexible substrate connection method according to claim 1 or 2, wherein the positioning penetration portion comprises either a hole or a notch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1281222A JPH03145074A (en) | 1989-10-27 | 1989-10-27 | Connection method for flexible substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1281222A JPH03145074A (en) | 1989-10-27 | 1989-10-27 | Connection method for flexible substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03145074A true JPH03145074A (en) | 1991-06-20 |
Family
ID=17636070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1281222A Pending JPH03145074A (en) | 1989-10-27 | 1989-10-27 | Connection method for flexible substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03145074A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5643007A (en) * | 1996-09-13 | 1997-07-01 | Abb Power T&D Company Inc. | Transformer tap connector |
DE102011075034A1 (en) * | 2011-04-29 | 2012-10-31 | Technische Universität Berlin | Contact stable snap connector |
DE102012110057A1 (en) * | 2012-10-22 | 2014-04-24 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Cable printed circuit board connection structure has metallic mandrel that is penetrated through wire of cable positioned on printed circuit board, and contacted with metalized hole formed on circuit board arranged underneath wire |
-
1989
- 1989-10-27 JP JP1281222A patent/JPH03145074A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5643007A (en) * | 1996-09-13 | 1997-07-01 | Abb Power T&D Company Inc. | Transformer tap connector |
DE102011075034A1 (en) * | 2011-04-29 | 2012-10-31 | Technische Universität Berlin | Contact stable snap connector |
DE102012110057A1 (en) * | 2012-10-22 | 2014-04-24 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Cable printed circuit board connection structure has metallic mandrel that is penetrated through wire of cable positioned on printed circuit board, and contacted with metalized hole formed on circuit board arranged underneath wire |
DE102012110057B4 (en) | 2012-10-22 | 2024-08-08 | Endress+Hauser Conducta Gmbh+Co. Kg | Cable-PCB connection |
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