JPH01127280U - - Google Patents

Info

Publication number
JPH01127280U
JPH01127280U JP2185688U JP2185688U JPH01127280U JP H01127280 U JPH01127280 U JP H01127280U JP 2185688 U JP2185688 U JP 2185688U JP 2185688 U JP2185688 U JP 2185688U JP H01127280 U JPH01127280 U JP H01127280U
Authority
JP
Japan
Prior art keywords
film
soldering temperature
molding
circuit
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2185688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2185688U priority Critical patent/JPH01127280U/ja
Publication of JPH01127280U publication Critical patent/JPH01127280U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
JP2185688U 1988-02-23 1988-02-23 Pending JPH01127280U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2185688U JPH01127280U (enExample) 1988-02-23 1988-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2185688U JPH01127280U (enExample) 1988-02-23 1988-02-23

Publications (1)

Publication Number Publication Date
JPH01127280U true JPH01127280U (enExample) 1989-08-31

Family

ID=31239453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2185688U Pending JPH01127280U (enExample) 1988-02-23 1988-02-23

Country Status (1)

Country Link
JP (1) JPH01127280U (enExample)

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